大船企業日本 Product Lineup

The multi-purpose single-axis laser processing machine was first exhibited as a real machine at "JPCA 2022" by the Japanese company Ofuna. Customers can choose the laser oscillator and table specifications according to their processing applications and materials, allowing for custom-made solutions. We own various types of multi-purpose single-axis laser processing machines, including UV (nanosecond, picosecond) and CO2, enabling us to provide consistent support from the development of processing technology for new materials to the sale of production machines. ■ Examples of processing with UV laser Processing of micro-diameter holes in ABF material (package substrate), processing of micro-diameter holes in PI material (flexible substrate), small-diameter hole processing of SI wafers and ceramics, cutting of Cu/PP multilayer boards, cutting of Cu/LCP double-sided boards, etc. ■ Examples of processing with CO2 laser TH processing of Cu 2um double-sided boards, BH processing of Cu 2um multilayer boards, and new materials compatible with high frequency and 5G such as fluororesin, liquid crystal polymer, and PPE resin. *For more details, please refer to the PDF materials or feel free to contact us. *There are also various examples of processing applications, so please check the PDF materials.

The PKG material 4-beam CO2 laser processing machine 'ECO-TL4C' is a new product that enables efficient processing with 2 tables and 4 beams. Compared to our conventional machine with 1 table and 1 beam, processing is completed in about half the time. It is a machine that combines processing quality and productivity, capable of quickly processing various materials. We also offer services such as contract processing using this product. 【Other Services】 ■ Manufacturing and sales of laser processing machines (Pico UV, Nano UV, etc.) ■ Contract processing for R&D and small-scale production using our own processing machines ■ Contract processing of interlayer insulating films, MEG materials, RO materials, PI, PTFE, etc. ★ We will demonstrate processing with this machine at the "JPCA Show 2023" starting on May 31. Please visit our booth (East Exhibition Hall 2B-04). *Please refer to the accompanying materials. Feel free to contact us with any inquiries.

Full hole inspection with laser beer is possible! - Dual CCD, no alignment required, fastest in the industry with the same resolution: 25 seconds per sheet (5um) - Uses telecentric telephoto lens, no misrecognition issues due to angles - Usable for multiple processes, conformal, and DLD - For high resolution of 2um, minimum measurable diameter is 20um - Original one-touch minimalist operation mode - Full substrate inspection, blind hole defect statistical analysis, group check function for defective detection holes, improved re-inspection efficiency - Customer sales record: 417 units, top market share

This is a laser processing machine that maximizes the use of limited space and meets a wide range of needs from prototyping to mass production. It has the same size as a single-axis machine while achieving overwhelming improvements in throughput and precision processing quality. Optimized for the processing of precision printed circuit boards and other materials, it enables high-precision processing even in limited spaces. It achieves twice the productivity compared to single-axis machines. 【Features】 - Flexibility in installation due to compact design - Achieves double the productivity in the same space - Fine processing with low thermal impact using picosecond lasers - Compatible with various laser oscillators *For more details, please download the PDF or feel free to contact us.