三菱ガス化学ネクスト（旧日本ユピカ） Product Lineup

"Viroglass" is a thermosetting dry molding material made from crystalline unsaturated polyester resin, possessing excellent properties such as electrical insulation, flame resistance, and heat resistance. Compared to BMC molding materials, Viroglass excels in handling, moldability, and storage stability. Additionally, we provide an easy-to-understand presentation of Viroglass's performance, including graphs of bending characteristics after heat resistance tests and strength characteristics after heat cycle tests, as technical documentation. 【Features】 ■ Excellent properties of electrical insulation, flame resistance, and heat resistance ■ Heat-resistant grade, flame-retardant grade, high-strength grade, heat dissipation grade ■ Applications in electrical equipment, electronic components, automotive electrical parts, heat-resistant parts, and more *For more details, please request documentation or view the PDF data available for download.

Mitsubishi Gas Chemical Next (formerly Nippon Yuka) has developed a low-pressure thermosetting dry molding material called "Bioglass" that enables insert molding, achieving both reduced production time and low-pressure molding for the encapsulation of miniaturized electronic materials. Compared to conventional materials, it allows for significant productivity improvements through rapid curing and post-curing elimination. It contributes to the "miniaturization" and "reduction of processes" in automotive components. 【Exhibition Information】 ■Exhibition Name: CEATEC2025 ■Dates: October 14 (Tuesday) to October 17 (Friday), 10:00 AM to 5:00 PM ■Venue: Makuhari Messe ■Hall Number: 3 3H008 ■Admission Fee: Free (Pre-registration required) ■Exhibition URL: https://www.ceatec.com/ja/ *For more details, please refer to the PDF document or feel free to contact us.

【Exhibition Overview】 Automotive World 2022 12th Lightweight Vehicle Technology Exhibition ● Date: January 19 (Wednesday) to 21 (Friday) 10:00 AM to 5:00 PM ● Venue: Tokyo Big Sight, East Hall 4 ● Booth Number: 32-37 ● Products We Plan to Exhibit: 　・Resin CBZ for CFRP 　・Intermediate Material for CFRP 　・Biomass Polyester BIOMUP 　・Low-Pressure Sealing Thermosetting Molding Material Bioglass 　・PVC Repair Light-Curing Sheet 　・Yupica GF-SMC 　・Hydrogen Barrier Prepreg

Our company will be exhibiting at the "2nd Automotive World [Autumn]" held at Makuhari Messe from September 13 to 15, 2023. At our booth, we will showcase resins and FRP materials aimed at lightweighting automobiles. We invite you to visit our booth. 【Exhibited Products (Excerpt)】 ◎ Resin for CFRP "CBZ" ■ High adhesion to carbon fibers sized for epoxy resins ■ High adhesion to glass, aramid, and basalt fibers ◎ "CBZ-Prepreg" (Under development) ■ High performance: High adhesion to fibers allows for broader CFRP design possibilities ■ High cycle: Contributes to improved productivity due to fast curing ◎ Low-pressure sealing thermosetting molding material "Bioglass" ■ Dry molding material using crystalline thermosetting resin ■ Excellent electrical insulation, flame retardancy, and heat resistance *For more details, please refer to the materials. Feel free to contact us with any inquiries.

【Exhibition Overview】 ■ Name: 2nd Automotive World Autumn - Advanced Automotive Technology Exhibition ■ Dates: September 13 (Wednesday) to September 15 (Friday), 2023, 10:00 AM to 5:00 PM ■ Venue: Makuhari Messe (Lightweight Processing Technology Zone) ■ Products We Plan to Exhibit: ・Resin CBZ for CFRP ・CBZ Prepreg ・Low-pressure Sealing Thermosetting Molding Material Bioglass ・Biomass Polyester BIOMUP ・Environmentally Friendly Resin ・Yupica Mat

Mitsubishi Gas Chemical Next (formerly Nippon Yuka) offers a low-pressure thermosetting dry molding material called "Biloglass," aimed at accelerating the sealing process and improving yield. Compared to conventional materials, it enables shorter cycle times and mass production capabilities due to its fast curing properties and post-cure-less design. It meets the demands for high-speed lines and stable quality in the automotive electronic component market, contributing to reduced processing costs. 【Features】 - Fast curing / High reliability - Low-pressure sealing / High flow resin - Post-cure-less - Heat dissipation / Insulation performance *For more details, please refer to the PDF document or feel free to contact us.

"Byloglass" is a sealing material developed by Mitsubishi Gas Chemical Next (formerly Nippon Yuka) for electronic components that are subjected to high thermal stress. It combines high insulation and heat dissipation properties, ensuring reliability even in automotive applications where durability and temperature cycle evaluation are required. Being a dry material, it is easy to handle and compatible with stable low-pressure molding. 【Features】 - Heat resistance reliability - Heat dissipation/insulation performance - Low-pressure molding - High fluidity/high cycle - No post-curing required *For more details, please refer to the PDF document or feel free to contact us.

Mitsubishi Gas Chemical Next (formerly Nippon Yuka)'s "Biologlass" is a low-pressure thermosetting dry molding material suitable for sealing compact electronic devices. Its high fillability and low-pressure characteristics allow it to be used in insert molding processes. The post-cure-less design eliminates the need for additional processing, achieving simplification of the process and reduction of equipment load. 【Features】 - Insert molding capable - High flow & low-pressure sealing - Process reduction / space-saving - High reliability / heat dissipation design *For more details, please refer to the PDF materials or feel free to contact us.

In automotive electronic components used in harsh environments, reliability and mass production capability are emphasized. "Biloglass" is a thermosetting dry molding material that achieves both rapid curing and low-pressure sealing, allowing for reduced tact time without post-curing. It also supports small devices and insert molding, contributing to reduced production costs. 【Features】 - Thermal cycle resistance - High-speed curing - Heat dissipation & insulation - Low-pressure sealing / high filling capability - No additional heat treatment required *For more details, please refer to the PDF document or feel free to contact us.

In high-frequency electronic components, the insulation performance, heat resistance, and processing accuracy of the sealing material are important. "Biloglass" can accommodate fine shapes due to its high fluidity design, achieving both mass production and sealing quality. High reliability can be obtained even without post-curing, making it suitable for the manufacture of highly integrated modules. 【Features】 - Compatible with high-frequency components - Low dielectric/insulating properties - High fluidity/low-pressure molding - Process reduction - Sealing for small devices *For more details, please refer to the PDF document or feel free to contact us.

In home appliances and small electronic devices, processability suitable for mass production and stable quality are required. "Bioglass" achieves high mass production efficiency with short curing times while keeping equipment load low through low-pressure sealing. Being a dry material, it also excels in manageability and is compatible with insert molding. 【Features】 - Cost reduction - Fast curing / reduced processes - Stable filling properties - Low-pressure processing - Easy management of dry materials *For more details, please refer to the PDF document or feel free to contact us.

In power device and module encapsulation, heat dissipation characteristics and insulation performance are emphasized. "Bioglass" enables uniform encapsulation down to fine details due to its high filling and low-pressure moldability. Its design reduces processes, contributing to production efficiency and quality stability in mass production. 【Features】 - Insulation & heat dissipation design - High reliability encapsulation - Low-pressure processing - Fast curing / process reduction - Compatible with module encapsulation *For more details, please refer to the PDF document or feel free to contact us.

In the automotive industry, the reliability of power modules and electronic components is crucial. Products that can withstand harsh environments are required. In particular, under conditions exposed to temperature changes and vibrations, insulation performance and heat dissipation are essential for extending the lifespan of products. "Biloglass" meets the demands of high-power applications while simultaneously achieving sealing quality and longevity. 【Application Scenarios】 - Power module sealing - Electronic control units (ECU) - Automotive electronic components 【Benefits of Implementation】 - Achieving high reliability - Extending product lifespan - Improving production efficiency

In the home appliance industry, extending the lifespan of products is an important challenge. In particular, power modules are affected by degradation due to heat, so excellent heat dissipation and insulation performance are required. "Bioglass" contributes to the longevity of home appliances by enhancing sealing quality to accommodate high-power applications. 【Usage Scenarios】 - Sealing of power modules - High-power home appliances - Products that aim to achieve longevity 【Benefits of Implementation】 - Improved product reliability - Reduced risk of failure - Extended product lifespan

In the field of high-power industrial equipment, the reliability and longevity of power modules are important challenges. In particular, with the increase in power output, there is a demand for both heat dissipation performance and insulation performance to be achieved simultaneously. "Biloglass" addresses these challenges by enabling uniform sealing down to fine details through high filling and low-pressure molding. This prevents performance degradation of the product and allows for stable operation. 【Usage Scenarios】 - High-power power modules - Inverters - Power supply units 【Benefits of Implementation】 - Improved heat dissipation - Ensured insulation - Extended product lifespan