JCU Product Lineup

JCU Corporation has been supporting the growth of industries such as automotive, printed circuit boards, electronic components, and semiconductors for many years by providing various surface treatment technologies developed from decorative and anti-corrosion plating techniques since its establishment. In recent years, with the advancement of IT in various industrial sectors and the globalization of our customers' economic activities, the demands for surface treatment technologies have become more sophisticated and diversified. We not only respond to such needs but also lead the future of manufacturing through research and development of technologies that anticipate our customers' needs "beyond" the present, contributing to the creation of new markets. [Business Activities] ■ Chemicals for surface treatment ■ Manufacturing and sales of equipment and related materials for surface treatment *For more details, please refer to the PDF document or feel free to contact us.

• Other surface treatment equipment
• Other electronic parts
• Other Auto Parts

Electroplating serves various roles such as decoration, corrosion resistance, and circuit formation for printed circuit boards. Our company has established a research and development system to create products that meet the needs of each of these areas. We are addressing the challenge of responding to increasingly shorter product cycles by developing technologies and commercializing products in a shorter time and at a lower cost. Additionally, to tackle issues in the invisible microscopic world, we are striving to improve quality through analysis using analytical instruments such as FE-SEM, FIB, GD-OES, and GC-MS. As part of our environmental initiatives, we are also conducting research and development to cease and reduce the use of harmful substances such as lead, cyanide, and hexavalent chromium that have been used in the electroplating process. 【Four Areas of Research and Development】 ■ Surface treatment chemicals for decorative and corrosion resistance applications ■ Surface treatment chemicals for electronics and semiconductor applications ■ Electroplating equipment systems ■ Dry processes *For more details, please refer to the PDF materials or feel free to contact us.

• Other surface treatment equipment
• Other electronic parts
• Surface treatment contract service

Our production facility in Niigata is a domestic production site designed based on the environmental management system ISO 14001 and the quality management system ISO 9001. Under thorough quality control, we produce surface treatment chemicals delivered to a wide range of customers. Thanks to high-performance production equipment and the efforts of our staff, who aim for "customer first," "compliance with laws and regulations," "environmental conservation," and "energy conservation," reliable products are efficiently produced day and night. [Features] - High-performance production equipment - Designed based on environmental management system and quality management system principles - Producing surface treatment chemicals delivered to a wide range of customers through thorough quality control *For more details, please refer to the PDF document or feel free to contact us.

• Other surface treatment equipment
• Other electronic parts
• Surface treatment contract service

This catalog features the manufacturing and sales of surface treatment equipment by JCU Corporation, including their "Fully Automatic Surface Treatment Equipment." The fully automatic equipment is available in three types: program type, pusher type, and elevator type, along with various other products such as control software and pre-treatment equipment. [Contents] ■ Fully Automatic Equipment - Program Type Fully Automatic Equipment - Pusher Type Fully Automatic Equipment - Elevator Type Fully Automatic Equipment ■ Control Software, etc. *For more details, please download the PDF or feel free to contact us.

• Plating Equipment
• Other surface treatment equipment

We propose a "Copper Pressure Adjustment Etching Process" aimed at thinning copper pressure and flattening the uneven surface of copper. This process suppresses pitting corrosion (etching pits) that occurs during the etching treatment of filling plated products. Additionally, it is compatible with hydrogen peroxide/sulfuric acid-based etching equipment. 【Features】 - Optimal etching speed for copper pressure adjustment (3-7 μm/min) - Compatible with hydrogen peroxide/sulfuric acid-based etching equipment - Stable management of operating bath component concentration through quantitative replenishment using a sheet counter *For more details, please download the PDF or feel free to contact us.

• Surface treatment contract service
• Other surface treatment equipment