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Our company and its group have developed a thermal property measurement method and measuring instrument that can evaluate the thermal resistance of contact interfaces as small as possible. Previous measuring instruments were unable to accurately evaluate the thermal resistance of thermal conductive resins, but this technology now allows for significantly higher precision in measuring thermal resistance. We offer contract measurements of thermal conductive resins using this measuring device, and we look forward to your inquiries. [Features] - Developed a thermal property measurement method and measuring instrument that can evaluate the thermal resistance of contact interfaces as small as possible - Capable of measuring thermal resistance with high precision *For more details, please feel free to contact us.

• Contract measurement

We offer "molecular bonding prototyping" as a contracted service. Conventional adhesive bonding relies on the anchor effect, where the surfaces of materials are roughened to allow the adhesive to embed into the recesses for bonding through intermolecular forces. The molecular bonding technology we recommend involves applying a molecular bonding agent with a thickness equivalent to one molecule onto the surfaces of materials such as resins, metals, ceramics, and rubber. The materials are then overlapped and bonded through chemical bonding by applying heat and pressure. We will select a molecular bonding agent suitable for the materials to be bonded, so please provide the detailed specifications of the materials. For materials that have not been prototyped before, we will collaborate with Iou Chemical Research Institute to start with an analysis of the surface condition of the materials. [Features] ■ Chemical bonding through heat and pressure ■ Selection of suitable bonding agents by us ■ Capability to handle materials with no prototyping history ■ For materials with no prototyping history, we will start with an analysis of the surface condition *For more details, please feel free to contact us.

• Contract manufacturing
• Processing Contract
• Other contract services

"Molecular adhesive" is a bonding agent that differs from conventional adhesives by chemically bonding a dithioltriazine group to the material surface, causing a chemical reaction at the bonding interface to achieve adhesion. Our company is engaged in the development and research support of surface modification technologies for metals, resins, rubber, ceramics, and more using molecular bonding technology. We offer technical support and services for all-purpose bonding, hexavalent chromium-free plating, development support for printed circuit boards, construction support for manufacturing technologies, and other manufacturing technology support. [Features] ■ Causes a chemical reaction at the bonding interface to achieve adhesion. *For more details, please feel free to contact us.

• Chemicals
• glue
• others

The "Thermal Conductive Sheet" is a new concept silicone rubber thermal conductive sheet with high thermal conductivity, electrical insulation, and flame retardancy. Our company is engaged in the development and research support of surface modification technologies for metals, resins, rubber, ceramics, and more through molecular bonding technology. We offer technical support and services for various manufacturing technologies, including all-purpose bonding, hexavalent chromium-free plating, development support for printed circuit boards, and the establishment of manufacturing technologies. 【Features】 ■ High thermal conductivity ■ Electrical insulation ■ Flame retardancy *For more details, please feel free to contact us.

• Other polymer materials
• others

This product is a thermal conductivity measurement device that complies with ASTM-D5470 and JIS H 7903. The measurement sample is held between the aluminum blocks of the device (measurement section), and a specified pressure is applied. The heat flow from the cotton heater placed on top is passed through the measurement sample, and the temperature difference between the upper and lower aluminum blocks is automatically calculated to determine and display the thermal resistance value and thermal conductivity. 【Main Specifications】 ■ Measurement targets: Films, sheets, plates, multilayer materials, etc. ■ Device dimensions and weight: 500mm × 700mm × 500mmH, 30kg ■ Power supply and power consumption: AC100V, 300W *For more details, please download the PDF or feel free to contact us.

• Other measurement, recording and measuring instruments