共栄電資 Product Lineup

We have substrate-mounted busbars and coils used for high current applications in the heavy electrical and automotive industries. By substrate mounting, the following effects can be expected: - Substrate mounting of power devices such as IGBTs and SiCs - Installation on equipment after substrate mounting → Reduction of assembly work and prevention of miswiring - Space-saving due to substrate mounting and simplification of wiring → Miniaturization of the entire device - Generally, a thick copper substrate refers to a substrate with a copper foil thickness of 200μ (0.2mm) or more, but we have also achieved substrate mounting with 3000μ (3mm) copper plates. - The greatest advantage of substrate mounting is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, so there is no concern about variation in thickness like with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

We have substrate-ized busbars used for high current applications. By utilizing our special technology for substrate-ization, we achieve high insulation properties and a compact, lightweight design. We can accommodate lengths of up to 1,000mm. Additionally, substrate-ization offers the following benefits: - Mounting of power devices such as IGBTs and SiCs on the substrate. - After substrate mounting, installation into equipment is possible, leading to reduced assembly time and prevention of miswiring. - Space-saving due to simplified substrate and wiring, resulting in overall equipment miniaturization. - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer made with prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

We have substrate-ized busbars used for high current applications. By utilizing our special technology for substrate-ization, we achieve high insulation properties and compactness. We can accommodate lengths of up to 1,000mm. Additionally, the substrate-ization is expected to provide the following benefits: - Substrate mounting of power devices such as IGBTs and SiCs - Possible attachment to devices after substrate mounting → Reduction of assembly labor and prevention of miswiring - Space-saving due to simplified substrate and wiring → Overall miniaturization of the device - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, eliminating concerns about variations in thickness like those found in powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be done safely. *For more details, please refer to the PDF document or feel free to contact us.

We have substrate-formed busbars used for high current applications. By utilizing our special technology for substrate formation, we achieve high insulation properties and compactness. We can accommodate lengths of up to 1,000mm. Additionally, substrate formation is expected to provide the following benefits: - Substrate mounting of power devices such as IGBTs and SiCs - Possible attachment to equipment after substrate mounting → Reduction of assembly labor and prevention of miswiring - Space-saving due to simplification of substrate and wiring → Miniaturization of the entire device - The greatest advantage of substrate formation is its high insulation performance and usability. The insulation layer made with prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - Covering areas other than the necessary parts with a substrate makes handling easier and allows for safe operations during transport and installation. *For more details, please refer to the PDF document or feel free to contact us.

We have substrate-ized busbars used for high current applications. By utilizing our special technology for substrate-ization, we achieve high insulation properties and miniaturization. We can accommodate lengths of up to 1,000mm. Additionally, the substrate-ization is expected to provide the following benefits: - Substrate mounting of power devices such as IGBTs and SiCs - Possible attachment to devices after substrate mounting → Reduction of assembly labor and prevention of miswiring - Space-saving due to simplification of substrate and wiring → Overall miniaturization of the device - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and operations during transport and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

We have substrate-ized busbars used for high current applications. Our special technology enables substrate-ization, achieving high insulation properties and compactness. We can accommodate lengths of up to 1,000mm. Additionally, substrate-ization is expected to provide the following benefits: - Substrate mounting of power devices such as IGBTs and SiCs - Possible attachment to equipment after substrate mounting → Reduction of assembly labor and prevention of miswiring - Space-saving due to simplification of substrate and wiring → Overall miniaturization of the equipment - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - Covering areas other than the necessary parts with a substrate makes handling easier and allows for safe operations during transportation and installation. *For more details, please refer to the PDF document or feel free to contact us.

In data center power supply systems, stable power supply and space-saving are required. Especially as density increases, improving power supply efficiency and addressing heat generation are crucial. The reliability of busbars is directly linked to the stable operation of the system, making high insulation and secure connections essential. Our busbars (bus bars) for high current substrates address these challenges. 【Usage Scenarios】 - Power units for data centers - Power supply within server racks - Power systems requiring high-density mounting 【Benefits of Implementation】 - Improved safety due to high insulation - Enhanced system efficiency through space-saving - Reduced assembly labor and prevention of wiring errors - Miniaturization of the entire device

In the high-power supply of the electric vehicle industry, components that can safely and efficiently transmit large currents are required. In particular, reliable connections to power devices and placement within limited space significantly impact the overall performance and design flexibility of the vehicle. Improper wiring or insufficient insulation can lead to performance degradation and safety issues. Our thick copper busbar substrates and coil substrates address these challenges by substrate-mounting busbars and coils used in high-current applications. 【Usage Scenarios】 - Inverters, converters, and charging systems for electric vehicles - High-power battery systems - Power control units 【Benefits of Implementation】 - Substrate mounting of power devices such as IGBTs and SiCs - Reduction of assembly labor and prevention of miswiring - Miniaturization of the entire device

In ship propulsion control systems, the reliability and efficiency of components handling high currents are essential. In particular, complex wiring and high-voltage control can lead to issues such as miswiring troubles and space constraints. To address these challenges, by integrating busbars and coils into a substrate, we can achieve high insulation and simplify wiring, contributing to the construction of a safe and efficient propulsion control system. 【Application Scenarios】 - Consolidation of high-current circuits in propulsion control systems - Implementation of power devices (IGBT, SiC, etc.) - Effective utilization of onboard space 【Benefits of Implementation】 - Reduction in assembly labor and risk of miswiring - Space-saving and miniaturization of the entire device - Improved reliability due to high insulation performance

In data centers, the stable operation of equipment and the maintenance of cooling efficiency are prioritized. Particularly in areas where large currents flow, heat suppression and safety assurance are required. Conventional busbars and coils face challenges in securing wiring space and insulation processing, which can impact the overall cooling efficiency of the equipment. Our thick copper busbar substrates and coil substrates address these issues by simplifying wiring through substrate integration and providing high insulation performance, contributing to space-saving and improved cooling efficiency in data centers. 【Usage Scenarios】 - High current wiring within server racks - High current transmission in cooling systems - Wiring around power supply units 【Benefits of Implementation】 - Reduction of installation space due to overall equipment miniaturization - Increased efficiency in assembly work through reduced wiring labor and prevention of miswiring - Enhanced safety due to high insulation performance - Assurance of reliability through a consistent insulation layer thickness

In the field of aerospace power distribution, high reliability and safety are required. Particularly in systems that handle large currents, ensuring a stable power supply, managing heat, and achieving weight reduction are important challenges. Traditional busbars and coils can complicate wiring, ensure insulation, and impose constraints on installation space, which can burden the overall system design. Our thick copper busbar substrates and coil substrates address these challenges by providing high insulation through substrate integration, simplifying wiring, and reducing the overall space required for the equipment, thereby contributing to improved performance and reliability of aerospace devices. 【Application Scenarios】 - Large current power distribution systems in aircraft and spacecraft - Implementation in power electronics modules - Wiring design in limited spaces 【Benefits of Implementation】 - Miniaturization and weight reduction of the entire device - Reduction in assembly work and decreased risk of wiring errors - Improved safety due to high insulation performance

In the medical device industry and fields requiring high-precision control, miniaturization of equipment, along with high reliability and safety, is essential. Particularly in precise control involving large currents, a reliable power supply and accurate operation significantly influence product performance. Improper wiring or insufficient insulation can lead to malfunctions or failures, potentially resulting in serious issues related to patient safety in medical devices. Our thick copper busbar substrates and coil substrates address these challenges with proven performance in large current applications, high insulation performance, and improved reliability through reduced assembly work. 【Application Scenarios】 - Medical devices requiring high-precision current control - Medical devices that require miniaturization - Medical devices where reducing assembly work and preventing miswiring are critical 【Benefits of Implementation】 - Improved reliability through substrate mounting of power devices - Enhanced work efficiency through reduced assembly time and prevention of miswiring - Miniaturization of the entire device due to space-saving design