大伸産業 Product Lineup

Introducing our special processing, "Super Fine Treatment." We perform Super Fine Treatment to smooth the uneven surfaces of the openings in laser-processed metal masks. By applying this treatment, the release of cream solder improves compared to conventional metal masks. As a result, the blurring of the stencil is reduced, enhancing printability. 【Features】 ■ Smooths the uneven surfaces of the openings in laser-processed metal masks ■ Improves the release of cream solder ■ Reduces stencil blurring and enhances printability *For more details, please refer to the PDF document or feel free to contact us.

This is an introduction to our special processing, "Half Etching Treatment." Half Etching Treatment allows for flexible adjustment of the cream solder amount by creating a stepped recess on the squeegee surface at a desired depth when you want to reduce the amount of cream solder for different components within the same plate. Additionally, when you want to prevent solder adhesion due to plate bleeding on areas like gold terminals, half processing on the back of the mask is effective. 【Features】 ■ Position accuracy: ±0.05mm ■ Half etching board thickness accuracy: ±0.01mm ■ Delivery time: Standard processing time + 1 day *For more details, please refer to the PDF document or feel free to contact us.

This is an introduction to our special processing, "Titanium Coating Treatment." Titanium Coating Treatment refers to a special metal mask that has undergone special processing on the backside (substrate side) and openings using titanium-based compounds. Compared to standard metal masks or metal masks with fluorine coating, the printability is significantly improved. In particular, it is less likely for paste to remain inside the openings, resulting in better paste release. 【Features】 ■ Special metal mask treated with titanium-based compounds ■ Significantly improved printability compared to standard metal masks ■ Particularly less paste remains inside the openings, leading to better paste release *For more details, please refer to the PDF document or feel free to contact us.

Introducing our "Space-Saving One-Touch Frame." This product reduces storage space by one-third and can be easily secured to the main frame with a single touch. No tools or fixtures are required. The weight remains unchanged from previous models, making it easy to transport and set up the plates. Despite being thin, it maintains the same tension as before. 【Features】 ■ One-third the storage space ■ Secures to the main frame with one touch ■ No tools or fixtures needed ■ Easy to transport and set up plates ■ Maintains the same tension despite being thin *For more details, please refer to the PDF document or feel free to contact us.

This product is a carrier used for soldering after-market components (such as capacitors and heat sinks) using a dip layer after reflow. During soldering, it protects the reflowed substrate with excellent thermal insulation properties, reducing stress on the components. With conventional materials (such as glass epoxy), issues (such as warping) occur after 400 to 600 dips, but our material can be used semi-permanently. 【Features】 ■ Can be used semi-permanently ■ Can be repaired and reused even if damaged ■ Has conductivity ■ Reduces stress on components *For more details, please refer to the PDF document or feel free to contact us.

This catalog features various special processing for metal masks conducted by Daishin Sangyo Co., Ltd., as well as a number of related products. In the special processing for metal masks, we introduce "Super Fine Treatment," "Titanium Coating Treatment," and "Half Etching Treatment." For related products, we present the "Space-Saving One-Touch Frame" and "Flow Carrier." 【Featured Products】 ■ Super Fine Treatment ■ Titanium Coating Treatment ■ Half Etching Treatment ■ Space-Saving One-Touch Frame ■ Flow Carrier *For more details, please refer to the PDF document or feel free to contact us.

Daishin Sangyo Co., Ltd. thoroughly implements the "3S" that is trusted by our customers. (1) Speed (Prompt Response), (2) Service (Proposals/Information Provision), (3) Special (Advanced Technology Support) Our company welcomes requests from design to circuit board production, parts procurement, and rapid delivery of actual layers. We can accommodate from small lots to mass production. Please feel free to contact us. 【Features】 ■ Support for printed circuit boards, design, board production, parts procurement, assembly, and finished products ■ Capable of handling small lots to mass production ■ Able to provide ultra-short delivery times for printed circuit boards ■ Lead-free compliance * For more details, please refer to the PDF materials or feel free to contact us.

This document is a supplementary manufacturing material from Oshin Industry Co., Ltd. It includes information such as the lineup of standard substrate materials, maximum sizes of multilayer boards, and maximum board thickness. Additionally, as examples of high-difficulty substrates, we introduce technologies such as "0.4 pitch BGA mounted 8-layer through resin-filled substrate (t1.6)" and "0.4 pitch BGA mounted 16-layer L1-2/L1-3…L1-8 continuous IVH substrate (t3.2)." We encourage you to read it. 【Contents (partial)】 ■General - Standard substrate materials - Maximum sizes of multilayer boards - Maximum board thickness ■Technology (Examples of high-difficulty substrate achievements) - 0.5 pitch BGA mounted 12-layer 2-8-2 build-up substrate (t1.6) - 0.5 pitch BGA mounted 16-layer L1-8/L9-16 IVH + through resin-filled substrate (t2.0) *For more details, please refer to the PDF document or feel free to contact us.

This document presents examples of board data specifications for BGA mounted boards with a pitch of 1.6 mm or less. It introduces various specifications, starting with "4-pitch BGA mounted through resin-filled boards," "0.5-pitch BGA mounted through resin-filled boards," and the main specifications of build-up boards. We encourage you to read it. [Contents] ■ Through boards (Recommended design specifications for BGA section) ■ Build-up boards (Recommended design specifications for BGA section) *For more details, please refer to the PDF document or feel free to contact us.

Daishin Sangyo Co., Ltd. was founded in the early Showa period in the Fukushima Ward of Osaka and has been a trading company primarily selling electrical and electronic products for many years. The "10-layer 3-4-3 build-up substrate" is a printed circuit board equipped with a 0.4 pitch 256 pin BGA. It features via-on-via with via fill copper plating. The resist is exposed using DI laser, with a laser hole diameter of φ0.1. 【Features】 ■ Via-on-via with via fill copper plating ■ Core section 4-layer TH is resin-filled and covered with plating ■ L5/6 layer clearance φ0.35 (TH φ0.2 drill) *For more details, please refer to the PDF document or feel free to contact us.

Daishin Sangyo Co., Ltd. was founded in the early Showa period in the Fukushima district of Osaka and has been a trading company primarily selling electrical and electronic products for many years. The "6-layer 2-2-2 build-up substrate" is a printed circuit board equipped with a 0.3 pitch 144 pin BGA. It features via-on-via with via fill copper plating. The core part has 2 layers of through-hole (TH) with resin filling and cover plating, and the resist is exposed using laser via DI. 【Features】 ■ Via-on-via with via fill copper plating ■ Core part 2-layer TH with resin filling and cover plating ■ Core part 2-layer TH with φ0.2 drill / land diameter φ0.25 *For more details, please refer to the PDF document or feel free to contact us.

Daishin Sangyo Co., Ltd. was founded in the early Showa period in the Fukushima district of Osaka and has been a trading company primarily selling electrical and electronic products for many years. The "8-layer 6-stage continuous IVH substrate" is a printed circuit board equipped with a 0.4 pitch 196 pin BGA. The gap between the hole wall patterns is 0.175. L1-2/L1-3/L1-4/L1-5/L1-6/L1-7 IVH passes through L1-8. 【Specifications】 ■ BGA pad/IVH land: φ0.3 ■ Hole wall gap: 0.175 ■ IVH drill diameter - L1-2/L1-3 = φ0.1 - L1-4 to L1-7 = φ0.15 *For more details, please refer to the PDF document or feel free to contact us.

Daishin Sangyo Co., Ltd. was founded in the early Showa period in the Fukushima district of Osaka and has been a trading company primarily selling electrical and electronic products for many years. The resist ink used is PSR-4000 AM02SP. We would like to introduce "0.3 pitch BGA" and "0.4 pitch BGA." 【Specifications】 <0.3 Pitch BGA> ■ Pad diameter: φ0.15 ■ Resist opening: φ0.15 ■ Line/space: 0.05/0.05 ■ Distance between resist opening edge and line: 0.05 *For more details, please refer to the PDF document or feel free to contact us.