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大伸産業

addressOsaka/Nishi-ku, Osaka-shi/2-5-14 Ujibontcho
phone06-6443-3031
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last updated:Jun 17, 2020
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大伸産業 List of Products and Services

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Electronic and control equipment Electronic and control equipment
Linear guide Linear guide
FA products FA products
Sheet metal processing, manufacturing, production Sheet metal processing, manufacturing, production
Metal mask Metal mask
Resin processing Resin processing
Metal

Metal mask

This is an introduction to the metal mask-related products and processing services we offer.

Metal mask special processing: super fine treatment

We are performing super fine processing to smooth the uneven surfaces of the opening walls of laser-processed metal masks.

Introducing our special processing, "Super Fine Treatment." We perform Super Fine Treatment to smooth the uneven surfaces of the openings in laser-processed metal masks. By applying this treatment, the release of cream solder improves compared to conventional metal masks. As a result, the blurring of the stencil is reduced, enhancing printability. 【Features】 ■ Smooths the uneven surfaces of the openings in laser-processed metal masks ■ Improves the release of cream solder ■ Reduces stencil blurring and enhances printability *For more details, please refer to the PDF document or feel free to contact us.

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Metal mask special processing: half-etching treatment

You can freely adjust it by performing step cutting on the ski surface at any desired depth!

This is an introduction to our special processing, "Half Etching Treatment." Half Etching Treatment allows for flexible adjustment of the cream solder amount by creating a stepped recess on the squeegee surface at a desired depth when you want to reduce the amount of cream solder for different components within the same plate. Additionally, when you want to prevent solder adhesion due to plate bleeding on areas like gold terminals, half processing on the back of the mask is effective. 【Features】 ■ Position accuracy: ±0.05mm ■ Half etching board thickness accuracy: ±0.01mm ■ Delivery time: Standard processing time + 1 day *For more details, please refer to the PDF document or feel free to contact us.

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Metal mask special processing: titanium coating treatment

Compared to standard metal masks and metal masks with fluorine coating, the printability has improved significantly!

This is an introduction to our special processing, "Titanium Coating Treatment." Titanium Coating Treatment refers to a special metal mask that has undergone special processing on the backside (substrate side) and openings using titanium-based compounds. Compared to standard metal masks or metal masks with fluorine coating, the printability is significantly improved. In particular, it is less likely for paste to remain inside the openings, resulting in better paste release. 【Features】 ■ Special metal mask treated with titanium-based compounds ■ Significantly improved printability compared to standard metal masks ■ Particularly less paste remains inside the openings, leading to better paste release *For more details, please refer to the PDF document or feel free to contact us.

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Space-saving one-touch frame

No need for tools or jigs! Storage space is reduced to one-third, and it can be securely fixed to the main frame with one touch.

Introducing our "Space-Saving One-Touch Frame." This product reduces storage space by one-third and can be easily secured to the main frame with a single touch. No tools or fixtures are required. The weight remains unchanged from previous models, making it easy to transport and set up the plates. Despite being thin, it maintains the same tension as before. 【Features】 ■ One-third the storage space ■ Secures to the main frame with one touch ■ No tools or fixtures needed ■ Easy to transport and set up plates ■ Maintains the same tension despite being thin *For more details, please refer to the PDF document or feel free to contact us.

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Flow carrier for post-reflow attachment

Reduce stress on components! Protects reflowed PCBs during soldering with excellent thermal insulation properties.

This product is a carrier used for soldering after-market components (such as capacitors and heat sinks) using a dip layer after reflow. During soldering, it protects the reflowed substrate with excellent thermal insulation properties, reducing stress on the components. With conventional materials (such as glass epoxy), issues (such as warping) occur after 400 to 600 dips, but our material can be used semi-permanently. 【Features】 ■ Can be used semi-permanently ■ Can be repaired and reused even if damaged ■ Has conductivity ■ Reduces stress on components *For more details, please refer to the PDF document or feel free to contact us.

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Introduction to metal mask special processing and related implementation products.

We have listed the special processing for metal masks and the related assembly products that we offer!

This catalog features various special processing for metal masks conducted by Daishin Sangyo Co., Ltd., as well as a number of related products. In the special processing for metal masks, we introduce "Super Fine Treatment," "Titanium Coating Treatment," and "Half Etching Treatment." For related products, we present the "Space-Saving One-Touch Frame" and "Flow Carrier." 【Featured Products】 ■ Super Fine Treatment ■ Titanium Coating Treatment ■ Half Etching Treatment ■ Space-Saving One-Touch Frame ■ Flow Carrier *For more details, please refer to the PDF document or feel free to contact us.

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Characteristics of Daishin Sangyo Co., Ltd.

Even one unit is fine! We can accommodate from small lots to mass production.

Daishin Sangyo Co., Ltd. thoroughly implements the "3S" that is trusted by our customers. (1) Speed (Prompt Response), (2) Service (Proposals/Information Provision), (3) Special (Advanced Technology Support) Our company welcomes requests from design to circuit board production, parts procurement, and rapid delivery of actual layers. We can accommodate from small lots to mass production. Please feel free to contact us. 【Features】 ■ Support for printed circuit boards, design, board production, parts procurement, assembly, and finished products ■ Capable of handling small lots to mass production ■ Able to provide ultra-short delivery times for printed circuit boards ■ Lead-free compliance * For more details, please refer to the PDF materials or feel free to contact us.

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[Information] Daishin Sangyo Co., Ltd. Manufacturing Supplement

Introducing numerous examples of high-difficulty substrates, such as 0.5 pitch BGA mounted 8-layer through resin-filled boards (t0.6)!

This document is a supplementary manufacturing material from Oshin Industry Co., Ltd. It includes information such as the lineup of standard substrate materials, maximum sizes of multilayer boards, and maximum board thickness. Additionally, as examples of high-difficulty substrates, we introduce technologies such as "0.4 pitch BGA mounted 8-layer through resin-filled substrate (t1.6)" and "0.4 pitch BGA mounted 16-layer L1-2/L1-3…L1-8 continuous IVH substrate (t3.2)." We encourage you to read it. 【Contents (partial)】 ■General - Standard substrate materials - Maximum sizes of multilayer boards - Maximum board thickness ■Technology (Examples of high-difficulty substrate achievements) - 0.5 pitch BGA mounted 12-layer 2-8-2 build-up substrate (t1.6) - 0.5 pitch BGA mounted 16-layer L1-8/L9-16 IVH + through resin-filled substrate (t2.0) *For more details, please refer to the PDF document or feel free to contact us.

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[Data] BGA Mounting Board Data Specifications

Below t1.6! Here are examples of data specifications for BGA-mounted substrates.

This document presents examples of board data specifications for BGA mounted boards with a pitch of 1.6 mm or less. It introduces various specifications, starting with "4-pitch BGA mounted through resin-filled boards," "0.5-pitch BGA mounted through resin-filled boards," and the main specifications of build-up boards. We encourage you to read it. [Contents] ■ Through boards (Recommended design specifications for BGA section) ■ Build-up boards (Recommended design specifications for BGA section) *For more details, please refer to the PDF document or feel free to contact us.

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Printed circuit board "10-layer 3-4-3 build-up board"

Introducing a printed circuit board with a core section of 4-layer TH, resin-filled and lid-plated! It features a 0.4 pitch 256-pin BGA.

Daishin Sangyo Co., Ltd. was founded in the early Showa period in the Fukushima Ward of Osaka and has been a trading company primarily selling electrical and electronic products for many years. The "10-layer 3-4-3 build-up substrate" is a printed circuit board equipped with a 0.4 pitch 256 pin BGA. It features via-on-via with via fill copper plating. The resist is exposed using DI laser, with a laser hole diameter of φ0.1. 【Features】 ■ Via-on-via with via fill copper plating ■ Core section 4-layer TH is resin-filled and covered with plating ■ L5/6 layer clearance φ0.35 (TH φ0.2 drill) *For more details, please refer to the PDF document or feel free to contact us.

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Printed Circuit Board "6-Layer 2-2-2 Build-Up Board"

Introduction of a printed circuit board with a 0.3 pitch 144 pin BGA featuring via-on-via with copper plating!

Daishin Sangyo Co., Ltd. was founded in the early Showa period in the Fukushima district of Osaka and has been a trading company primarily selling electrical and electronic products for many years. The "6-layer 2-2-2 build-up substrate" is a printed circuit board equipped with a 0.3 pitch 144 pin BGA. It features via-on-via with via fill copper plating. The core part has 2 layers of through-hole (TH) with resin filling and cover plating, and the resist is exposed using laser via DI. 【Features】 ■ Via-on-via with via fill copper plating ■ Core part 2-layer TH with resin filling and cover plating ■ Core part 2-layer TH with φ0.2 drill / land diameter φ0.25 *For more details, please refer to the PDF document or feel free to contact us.

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Printed circuit board "8-layer 6-stage continuous IVH board"

Introduction of a printed circuit board with a hole wall pattern gap of 0.175 and a 0.4 pitch 196 pin BGA.

Daishin Sangyo Co., Ltd. was founded in the early Showa period in the Fukushima district of Osaka and has been a trading company primarily selling electrical and electronic products for many years. The "8-layer 6-stage continuous IVH substrate" is a printed circuit board equipped with a 0.4 pitch 196 pin BGA. The gap between the hole wall patterns is 0.175. L1-2/L1-3/L1-4/L1-5/L1-6/L1-7 IVH passes through L1-8. 【Specifications】 ■ BGA pad/IVH land: φ0.3 ■ Hole wall gap: 0.175 ■ IVH drill diameter - L1-2/L1-3 = φ0.1 - L1-4 to L1-7 = φ0.15 *For more details, please refer to the PDF document or feel free to contact us.

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Register laser exposure

Introducing the use of resist ink PSR-4000 AM02SP! Exposure with the resist laser (DI: Direct Imager).

Daishin Sangyo Co., Ltd. was founded in the early Showa period in the Fukushima district of Osaka and has been a trading company primarily selling electrical and electronic products for many years. The resist ink used is PSR-4000 AM02SP. We would like to introduce "0.3 pitch BGA" and "0.4 pitch BGA." 【Specifications】 <0.3 Pitch BGA> ■ Pad diameter: φ0.15 ■ Resist opening: φ0.15 ■ Line/space: 0.05/0.05 ■ Distance between resist opening edge and line: 0.05 *For more details, please refer to the PDF document or feel free to contact us.

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