京浜ラムテック List of Products and Services

We have developed a Synchronized Stir Welding Tool Holder that far exceeds the general characteristics of FSW, which can be simply attached to the ATC of existing cutting machines without the need for dedicated FSW machines or FSW hybrid machines. It does not require a tilt angle and enables overwhelming "high-speed joining, high-strength joining, and low-temperature joining" compared to conventional FSW. It is utilized in various fields, from the EV automotive industry to aerospace. Additionally, our R&D center is equipped with a machining center fitted with the SSW Tool Holder, allowing us to model joining tools and propose joining parameters tailored to customer needs. 【Features】 ■ Synchronizes with the desired "direction and speed" of stirring, actively stirring the material ■ Joining speed is in the high-speed range ■ Joining with a small shoulder diameter is possible ■ Joining in a low heat input range is possible ■ A wide parameter range is available without the need for a forward angle (tilt angle) *For more details, please refer to the PDF document or feel free to contact us.

• others

The RAM CATHODE dramatically improves the ionization rate by using a four-sided opposing target, allowing for the formation of DLC (ta-C) with a DC pulse power supply instead of a HIPIMS power supply. 【Conventional Sputtering Method】 Due to the low ionization rate of carbon, it was necessary to use a HIPIMS power supply to forcibly increase the ionization rate in order to obtain a hard ta-C region. 【RAM Cathode Developed by Our Company】 By arranging targets that face each other on four sides, the magnetic field between the targets enhances plasma confinement, resulting in the formation of high-density plasma. Within the confined plasma, electrons, rebounding argon, and Cflux repeatedly collide, promoting the ionization of Ar ions and Cflux, which facilitates the easy formation of C-C bonds in the DLC film. As a result, we have achieved the formation of high-hardness and high-smoothness DLC without using a HIPIMS power supply. Additionally, since surface treatment is unnecessary, quality is improved, and time and labor costs can be reduced. *For more details, please refer to the PDF document or feel free to contact us.

• Sputtering Equipment

The RAM CATHODE (four-sided opposing cathode) dramatically improves the ionization rate, allowing for the formation of DLC (ta-C) using a DC pulse power supply without the need for HIPIMS power supply. 【Conventional Sputtering Method】 Due to the low ionization rate of carbon, it was necessary to use HIPIMS power supply to forcibly increase the ionization rate in order to obtain the ta-C region. 【RAM Cathode Developed by Our Company】 By arranging targets on four opposing sides, it is possible to enhance the confinement of plasma due to the magnetic field between the targets, resulting in the formation of high-density plasma. Within the confined plasma, the collisions between electrons, rebounding argon, and C flux promote the ionization of Ar ions and C flux, making it easier to form C-C bonds in the DLC film. As a result, we have achieved the formation of high-hardness and high-smoothness DLC without using HIPIMS power supply. *For more details, please refer to the PDF document or feel free to contact us.

• Sputtering Equipment

At Keihin Ramtech, we have introduced FSW (Friction Stir Welding) and have accumulated expertise in joining technology. We also possess multiple lathes and machining centers, allowing us to handle everything from machining to assembly consistently. Even if you have never adopted FSW, please feel free to consult us for support with designs compatible with FSW. We are capable of joining for various industries, from pilot production to large-scale mass production. Please consult us for joining prototypes for various materials and shapes. If you have any requests, please contact us. 【Features】 ■ Capable of achieving low distortion joints by minimizing heat input during joining ■ Specializes in joining difficult-to-weld materials and can be applied to various materials ■ Achieves excellent joint quality through mechanical processes *For more details, please refer to the PDF document or feel free to contact us.

• Mixer/agitator

We have developed the 'SSW', which demonstrates high performance simply by being mounted on the ATC of existing cutting machines, eliminating the need for dedicated FSW machines or FSW hybrid machines. It does not require a tilt angle and enables overwhelming "high-speed joining, high-strength joining, and low-temperature joining." It is utilized in various fields, from the EV automotive industry to aerospace. 【Features】 ■ Wide joining range, making it easy to establish appropriate conditions for joining ■ Low defect occurrence rate at the joint ■ Capable of obtaining advantageous setting condition ranges *For more details, please refer to the PDF document or feel free to contact us.

• others

Synchronized Stir Welding involves the joining tool tip performing "driving with slight vibrations" in both the tool's rotational direction and vertical direction. As a result, by synchronizing and stirring the tool according to the "direction" and "speed" required by the material to be joined, this joining technology enables a joining process that surpasses conventional concepts. Please feel free to contact us when you need assistance. 【Features】 ■ High-speed joining ■ High strength ■ Low-temperature joining *For more details, please refer to the PDF document or feel free to contact us.

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We will introduce a comparison of the joining load between FSW and SSW. It is possible to reduce the vertical load applied during joining by more than 50%, and the required pressing pressure can be reduced to about half. Additionally, the joining load on the drive shaft side is approximately 3KN for FSW, while it is less than 1KN for SSW, meaning that SSW reduces the load to less than one-third compared to FSW. [Overview] ■ It is possible to reduce the vertical load applied during joining by more than 50% ■ The required pressing pressure can be reduced to about half ■ The joining load on the drive shaft side is reduced to less than one-third *For more details, please refer to the PDF document or feel free to contact us.

• others

We would like to introduce our "SSW Tool Holder." Equipped with synchronous stirring joining technology, it achieves high-speed joining, high strength, and low-temperature joining. Your cutting machine will evolve. Please feel free to contact us when you need assistance. 【Features】 ■ High-speed joining ■ High strength ■ Low-temperature joining *For more details, please refer to the PDF document or feel free to contact us.

• others

"RAM Force" is a roll-to-roll sputtering device that can perform multilayer film deposition of optical films and metals on plastic films. Not only can it evaluate the performance of RAM cathodes (low-damage cathodes), but it also allows you to test your applications under lab conditions and transition from pilot lines to mass production lines. 【Features】 ■ Patent obtained ■ Reduces damage to substrates by over 60% * Comparison between conventional planar sputtering and RAM cathodes ■ Increases deposition speed by more than three times * Comparison between conventional opposing sputtering and RAM cathodes ■ Unique technology from Keihin Lamtech * For more details, please refer to the PDF materials or feel free to contact us.

• Sputtering Equipment

This is a deposition-up horizontal inline sputtering device equipped with RAM cathodes (four-sided opposing low-damage sputtering cathodes) and strong magnetic field planar cathodes. To avoid damaging the underlying layer, the initial layer is deposited using the RAM cathode with low-damage sputtering. After that, high-speed deposition is performed using the strong magnetic field cathode. Each of the load lock stockers and unload lock stockers is vacuum-stored with 15 trays. *For more details, please refer to the PDF document or feel free to contact us.*

• Sputtering Equipment

The RAM cluster sputtering system is a cluster-type sputtering device equipped with RAM cathodes (four-sided low-damage sputtering cathodes). To avoid damaging the underlying layer, the initial layer is deposited using low-damage sputtering with the RAM cathode. It has five expansion slots, allowing for the addition of sputtering chambers, deposition devices, glove boxes, and more. Additionally, it is equipped with a 25-stage multi-tier load lock, enabling automatic deposition of a wide variety of film recipes for each slot, making it suitable for all kinds of research and development.

• Sputtering Equipment

"PMC welding" differs from conventional MIG/MAG welding by forcibly cooling the molten pool through a special wire feeding control. By repeating this control, both welding speed and quality improvement can be achieved simultaneously. As a result, spatter is minimized to the extreme, enabling a variety of joints such as MIG brazing and welding of 0.3 mm thin plates. 【Features】 ■ Significant reduction in heat input ■ Extreme reduction of spatter ■ Extremely stable arc ■ High-speed welding of thin aluminum plates is possible ■ Significant reduction in heat input *For more details, please refer to the PDF document or feel free to contact us.

• others

In conventional planar sputtering, significant damage was inflicted on the substrate, and in opposing sputtering, the film deposition rate was slow, posing practical challenges. Our "RAM Cathode" successfully generates dense plasma near the target surface by surrounding the target on all sides. By having argon ions collide with great force against the target, we have resolved the issues that existed until now. 【Features】 ■ Reduces damage to the substrate by over 60% compared to conventional planar cathodes ■ Achieves a film deposition rate more than three times that of conventional opposing cathodes *For more details, please refer to the PDF document or feel free to contact us.

• others

Our company responds to customer needs with a rich lineup, including target materials, heaters, quartz glass, and other consumables. By applying our unique design thermal analysis simulation technology, we achieve high cooling efficiency and more stable sputtering. We offer a wide range of support, from consultations and proposals for various processing and welding to sputtering targets for solar cells, LCDs (up to G10.5), and semiconductors, as well as surface treatments such as plating and blasting, annealing, cleaning of used protective plates, ultrasonic inspection of materials, and tensile testing. Please feel free to consult with us about anything. 【Product Lineup】 ■ Backing plates for FPDs ■ Backing plates for semiconductors ■ Planar targets ■ Quartz processed products ■ Others *For more details, please refer to the PDF materials or feel free to contact us.

• Composite Materials

At Keihin Ramtech, we have introduced Friction Stir Welding (FSW) and have accumulated expertise in joining technology. We also possess multiple lathes and machining centers, allowing us to provide consistent support from machining to assembly. If you have never used FSW, please feel free to consult us for design support compatible with FSW. We are capable of joining for various industries, from pilot production to large-scale mass production. Please consult us for joining prototypes with various materials and shapes. If you need our services, please contact us. 【Features】 ■ Enables joining with minimal heat input and distortion during the process ■ Specializes in joining difficult-to-weld materials and can be applied to various materials ■ Achieves excellent joinability through mechanical processes *For more details, please refer to the PDF document or feel free to contact us.

• Mixer/agitator

The semiconductor manufacturing process, which requires high purity and heat resistance, is one of the important application areas of "quartz glass." In recent years, automation in this field has progressed, and there is an increasing demand for more precise products. Essential tubes, boats, and other components for CVD processes and oxidation/diffusion processes are being developed with our processing technology to meet advanced requirements and further expand application areas. 【Features】 - Wide wavelength range from ultraviolet to infrared - Good transmission characteristics - High heat resistance, with a softening point of about 1700°C, usable at high temperatures up to 1000°C - Extremely low thermal expansion coefficient, allowing it to withstand rapid temperature changes - Excellent chemical resistance *For more details, please refer to the PDF document or feel free to contact us.

• Glass

FSW not only enables the joining of non-ferrous metals such as aluminum and copper with low melting points, but also allows for the joining of materials with different properties. 【Features】 ■ Reduces distortion and deformation compared to fusion welding ■ Achieves joint strength close to that of the base material due to fine grain size ■ Supports the joining of difficult-to-weld materials such as Al, Mg, Cu alloys, Fe alloys (SUS), and dissimilar materials *We will conduct joining tests with the materials you wish to join. For more details, please contact us or download the PDF to view.

• Other contract services