There are five expansion slots, allowing for additional installation of sputter chambers, deposition devices, glove boxes, etc.
The RAM cluster sputtering system is a cluster-type sputtering device equipped with RAM cathodes (four-sided low-damage sputtering cathodes). To avoid damaging the underlying layer, the initial layer is deposited using low-damage sputtering with the RAM cathode. It has five expansion slots, allowing for the addition of sputtering chambers, deposition devices, glove boxes, and more. Additionally, it is equipped with a 25-stage multi-tier load lock, enabling automatic deposition of a wide variety of film recipes for each slot, making it suitable for all kinds of research and development.
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basic information
Max. Sub. Size: 200mm x 200mm x t1mm Effective deposition width: 200mm Number of substrates per tray: 1 Deposition methods: Sputter up tray *For more details, please refer to the PDF document or feel free to contact us.*
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Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
Company information
Keihin Ramtech was founded in 1972 and has become a trusted manufacturer in the liquid crystal and semiconductor manufacturing equipment industry as well as the automotive industry. At our company, we believe that continuous technological development is the responsibility of all employees. The unique technology possessed by Keihin Ramtech is utilized as core technology across various industries. As a proposer that continues to develop and propose innovative technologies expected to further advance in the future, we contribute to our customers' continued growth.
![[Example of Use] Sputtering Target Composite Material SiC/Si](https://image.mono.ipros.com/public/product/image/f42/2000180520/IPROS14162266355367390576.jpeg?w=280&h=280)
