菱進テック Product Lineup

This document presents six main case studies addressing challenges related to semiconductor testing, each detailed individually. For example, cases such as "difficulties in maintaining operations due to aging testers" and "insufficient resources for test development and measurement module development." The explanations are clearly structured around four key areas: background, challenges, implementation, and results. This document is available for free. Please check the download link below. 【Overview of Cases】 ■ Difficulties in maintaining operations due to aging testers ■ Insufficient tester specifications required for testing ■ Inability to perform laser trimming on wafers ■ Inability to conduct reliability testing and failure analysis ■ Issues with wafer testing for automotive products ■ Insufficient resources for test development and measurement module development *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductors
• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

We propose test development and production capacity improvement tailored to customer specifications. We build testing methods, develop test programs, and create test boards/probe cards according to product specifications and test specifications. In the "OST (Outliers Screening Test)," we detect outlier chips from wafer test results to further improve the quality of good chips as part of quality control for automotive products. For individual test item measurement values, we calculate distributions and classify chips with data that falls outside the main distribution as defective through "PAT," and we detect chips that fall outside the good product distribution based on the positional distribution on the wafer using test result map data, classifying them as defective in the "GAT" test. *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductors
• Semiconductor inspection/test equipment
• Other contract services

At Rinshi Tech, we conduct reliability tests, including lifespan tests. We perform tests using equipment such as signal generators, high-power high-temperature high-humidity furnaces, liquid-layer thermal shock furnaces, and static load testing machines. 【List of Tests】 ■ Lifespan Test ■ Strength Test ■ Electrostatic Test ■ Solder Heat Resistance *For more details, please refer to the PDF materials or feel free to contact us.

• Other semiconductors
• Semiconductor inspection/test equipment
• Other contract services

At Rinshi Tech, we are engaged in the development and mass production of semiconductor wafer laser trimming. Please send us your test data and cut data as is. We will create a data conversion program for our equipment and perform the trimming. We will propose layout designs (such as fuse placement) aimed at improving mass production efficiency (trimming speed) and trimming accuracy. 【Features】 ■ We create a data conversion program for our equipment and perform trimming. ■ We propose layout designs aimed at improving mass production efficiency and trimming accuracy. *For more details, please refer to the PDF materials or feel free to contact us.

• Other semiconductors
• Semiconductor inspection/test equipment

Rinjin Tech provides semiconductor inspection (wafer testing) services. As part of quality control for automotive products, we offer technologies such as OST (Outliers Screening Test) to detect outlier chips from wafer test results and classify them as defective, in order to further improve the quality of good chips. Additionally, we have services for electrostatic management, earthquake countermeasures, and reliability testing. 【Wafer Testing Technologies】 ■PAT (Part Average Testing) - Purpose: To calculate the distribution of measurement values for individual test items and classify chips with data that deviates from the main distribution as defective. ■GAT (Geometric Analysis Testing) - Purpose: To detect chips that deviate from the good product distribution based on the positional distribution on the wafer from the map data of test results and classify them as defective. *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductors
• Semiconductor inspection/test equipment

Our company conducts electrical characteristic testing, laser trimming, and visual inspection as part of semiconductor testing (wafer testing), as well as reliability testing. In addition, we offer test development, equipment modifications, and production capacity improvements based on customer requests. We can flexibly respond to the construction of testing methods, development of test programs, and development of test boards and probe cards according to product specifications and test specifications. Furthermore, our cleanroom has an effective cleanliness level of "Class 10," allowing us to conduct tests on products, particularly semiconductors, that are significantly affected by foreign matter contamination. *For more details, please feel free to contact us.

• Other semiconductors
• Semiconductor inspection/test equipment