Electronic Components and Semiconductors

ExPlus

EstablishmentJuly 24, 1997
capital400000Ten thousand
number of employees200
addressTaiwan/(All areas)/3rd Floor, No. 534, Section 1, Minsheng North Road, Guishan District, Taoyuan City
phone+886-3-311-6170
last updated：
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ExPlus List of Products and Services

1～14 item / All 14 items

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4-layer high-density multilayer substrate

Generally, high multi-layer lamination technology is adopted in manufacturing.

Number of layers: 4 layers Material: FR4 Board thickness: 2.28 +/- 0.23 mm Surface treatment: Electroless gold plating Copper foil thickness: 1/3/0.85 OZ

  • Circuit board design and manufacturing

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2-layer rigid substrate

It is a commonly used circuit board.

It is a two-layer FR-4 substrate.

  • Circuit board design and manufacturing
  • EMS

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12-layer high-density multilayer circuit board

Generally, high multilayer stacking technology is adopted in manufacturing.

Number of layers: 12 layers Material: FR4 TG175 Board thickness: 2.0 +/- 10% mm Surface treatment: Electroless nickel/electroless gold plating Copper foil thickness: H/1/1/1/1H OZ Remark: Blind holes: L1/L2 & blind holes

  • Circuit board design and manufacturing

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Six-layer substrate assembly

Six-layer substrate assembly

Number of layers: Six layers Material: FR-4 Board thickness: 1.3 +/- 0.13mm Surface treatment: Electroless gold plating Au: 1μ" (min); Ni: 120μ" (min) Copper foil thickness: H/1~1/H oz

  • Circuit board design and manufacturing

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4-layer rigid flex circuit board

4-layer rigid flex circuit board

Number of Layers: Four Layers Materials: FR4 + Polyimide + Copper Foil + Carbarelay Board Thickness: FR4: 0.8 +/- 0.1mm PI: 0.175mm Surface Treatment: Electroless Gold Plating Au 2µ", Ni 80µ" Copper Foil Thickness: 1/H~H/1 OZ Blind Holes: L1~L2 / L3~L4 Remark: Smartwatch

  • Circuit board design and manufacturing

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8-layer rigid-flexible printed circuit board

It is a composite board of rigid and flexible substrates. Most rigid substrates are multilayer boards.

Number of Layers: Eight Layers Material: FR-4/Polyimide Board Thickness: FR4: 1.0 +/- 10% PI: 0.05mm Surface Treatment: Electroless Gold Plating 2µ" (min), Ni 100µ" (min) Copper Foil Thickness: 1/H~H/1 oz Remark: Camera Lens

  • Circuit board design and manufacturing

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4-layer high-density wiring circuit board

4-layer high-density wiring circuit board

Number of layers: Four layers Material: FR-4 Board thickness: 1.57 +/- 0.13 mm Surface treatment: Electroless gold plating Copper foil thickness: H/H~1/1 oz Remark: Impedance control 75 OHM Differential pair: 85/90/100 OHM

  • Circuit board design and manufacturing

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Six-layer high-density multilayer circuit board

Generally, high multilayer lamination technology is adopted in manufacturing.

Number of Layers: Six Layers Material: FR-4 (High TG 170) Board Thickness: 1.6 +/- 0.1mm Surface Treatment: Electroless Nickel/Electroless Gold Copper Foil Thickness: H/1/1/1/1H OZ Remark: Blind Holes: L1/L2 & Blind Holes

  • Circuit board design and manufacturing

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Six-layer multi-layer substrate

The functions of electronic devices are becoming increasingly complex and their sizes are getting smaller. If you need multilayer substrates, please consult us here.

Can handle more complex functions. Higher quality. Greater power, greater operational capability, and faster speed. Improved durability. Smaller size and lighter weight.

  • Circuit board design and manufacturing
  • EMS
  • Processing Contract

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Six-layer multi-layer circuit board

For computers, cameras, automobiles, etc.

Can handle more complex functions. Higher quality. Greater power, greater operational capability, and faster speed. Improved durability. Smaller size and lighter weight.

  • Other electronic parts
  • Processing Contract
  • Circuit board design and manufacturing

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Four-layer flexible circuit board

We can meet the diverse design needs of our customers.

The advantages of copper foil circuits are their ability to withstand high temperatures and their rigidity. They are suitable for various types of handheld mobile devices, printers, and table equipment.

  • Circuit board design and manufacturing
  • EMS

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Single-sided circuit board

Priority selection of various electronic products is relatively easy to produce at low cost. They are used in small household electrical appliances, such as computers, radios, and printers.

Low cost! Easy to design and produce! Furthermore, short delivery time!

  • Circuit board design and manufacturing

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Multilayer substrate

The functions of electronic devices are becoming increasingly complex, and their sizes are getting smaller. If you need multilayer substrates, please consult us here.

Can handle more complex functions. Higher quality. Greater power, greater operational capability, and faster speed. Improved durability. Smaller size and lighter weight.

  • Processing Contract
  • Circuit board design and manufacturing

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Double-sided circuit board

It is a commonly used circuit board.

It is a two-layer FR-4 TG140 board.

  • Circuit board design and manufacturing

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