三協サーモテック Product Lineup

The "WBSX Series" is a high-performance heat sink for forced air cooling that forms a wind tunnel and allows for component mounting on multiple surfaces. 【Product Specifications Example】 (High-performance type, compatible with 60mm fans) ■Dimensions: H64×W64×L100 (mm) ■Material: A6063S ■Weight: 530g 【Product Specifications Example】 (Low pressure loss type, compatible with 120mm fans) ■Dimensions: H124×W124×L200 (mm) ■Material: A6063S ■Weight: 3780g *For more details, please refer to the PDF document or feel free to contact us.

• Other energy equipment
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We propose "thermal analysis simulation." By understanding the size, arrangement, and heat generation of semiconductor devices on a heat sink, we can visualize the temperature distribution and airflow distribution of the heat sink using color, allowing for optimal design of the heat sink without the need for prototyping. Additionally, we can design heat sinks, devices, and systems in a short amount of time, which reduces both the time and cost of the design process. *For more details, please refer to the PDF document or feel free to contact us.*

• Thermo-fluid analysis
• Analysis Services

This catalog features a wide range of large heat sinks for forced air cooling of industrial equipment and large power supplies. Starting with the "WC Series," which uniquely combines extruded profiles and thin, narrow-pitch corrugated fins in a one-press process, we also offer the high-performance "FPK Series," which combines base materials and fins, the "CB Series" with a four-sided mounting type using extruded profiles, and the "WKBS Series," a double-sided mounting type that combines extruded profiles with thin sheet metal fins. [Featured Products] ■ WC Series ■ FPK Series ■ CB Series ■ WKBS Series *For more details, please refer to the PDF materials or feel free to contact us.

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This catalog features a wide range of large heat sinks for forced liquid cooling of large power supplies for industrial equipment and devices. We can accommodate custom specifications, allowing for greater design flexibility and enabling us to provide suitable heat sinks tailored to individual devices. For custom specifications, please inquire separately. 【Featured Products】 ■WP127-L150 ■WP127-L300 ■WP127-L450 ■WP127-L600 ■WP197-L150 ■WP197-L300 ■WP197-L450 ■WP197-L600 *For more details, please refer to the PDF document or feel free to contact us.

• Other energy equipment
• Other electronic parts

This catalog features various heat sinks for small semiconductor cooling and surface-mounted semiconductors. We offer a lineup including the "IC Series," which can be fixed to printed circuit boards with screws, as well as the "OSH Series" and "NOSV Series." The methods for securing to printed circuit boards include screw fixation, round pin soldering, and terminal soldering, with various series available to suit your needs. 【Featured Products (Excerpt)】 ■ IC Series - IC-1625-STL (-MT) - IC-2425-STL (-MT) ■ OSH Series - OSH-1025-SFL (-MF) - OSH-1525-SFL (-MF) ■ NOSV Series - NOSV-1530 / NOSV-1535 - NOSV-1545 / NOSV-1555 *For more details, please refer to the PDF document or feel free to contact us.

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This catalog features heat sink products from Sankyo Thermotech Co., Ltd., which manufactures and sells heat sinks. We offer a variety of products, including "heat sinks for printed circuit boards" that can be integrated with semiconductors and mounted and secured to printed circuit boards, as well as standard "natural air-cooled heat sinks" suitable for various applications from consumer electronics to industrial equipment. [Contents] ■ Heat sinks for printed circuit boards ■ Natural air-cooled heat sinks ■ Forced air-cooled heat sinks ■ Liquid-cooled heat sinks, etc. *For more details, please download the PDF or feel free to contact us.

• Other energy equipment
• Other electronic parts