ケイアイワールド Product Lineup

In research and development settings, end mills with unique shapes are sometimes used for prototype production and special processing. These tools often face the challenge of being difficult to re-sharpen when worn due to their uniqueness. Even small-diameter tools and complex shapes, which were difficult to handle with conventional re-sharpening techniques, can now be re-sharpened thanks to our advanced processing technology and measurement equipment. This allows for the reuse of expensive special tools instead of discarding them, contributing to the reduction of development costs. Our end mill re-sharpening service meets the diverse needs of research and development and supports new manufacturing initiatives. ## Usage Scenarios * Wear and damage of special-shaped end mills * Re-sharpening of small-diameter tools * Maintenance and management of tools in prototype development * Reduction of research and development costs ## Benefits of Implementation * Extended lifespan of special tools * Reduced development costs * Maintenance of stable processing accuracy * Reduced environmental impact

• Wafer processing/polishing equipment

In custom applications for jigs and tools, there is often a demand for tools with special shapes and dimensions, and the cost of replacement in case of wear or damage can be a challenge. Particularly, small-diameter end mills have been considered difficult to regrind, but our service has introduced dedicated processing and measuring machines, achieving stable precision in regrinding. 【Usage Scenarios】 - When custom end mills are worn or damaged - Regrinding of end mills with special shapes - Cost reduction for small-diameter tools 【Benefits of Implementation】 - Cost savings compared to purchasing new tools - Extended tool lifespan - Stable supply of custom tools

• Wafer processing/polishing equipment

We have made it possible to regrind small-diameter tools, which were previously difficult to regrind, by introducing specialized processing machines and dedicated measuring instruments. By implementing advanced CCD micrometers, we have been able to measure items that could not be measured with conventional touch sensors, ensuring stable positioning accuracy. At the same time, we have used specialized motors with extremely low vibration, enabling the processing of small-diameter tools. Please feel free to contact us if you have any requests. *For more details, please download the PDF or contact us.

• Wafer processing/polishing equipment