松田精機 List of Products and Services

The "Bader Machine" is our belt grinder that boasts excellent polishing performance for each unit. By selecting models and types according to the shape and size of the workpiece, and equipping them with polishing belts suitable for the task, we can flexibly accommodate a wide variety of items across various fields. Please make extensive use of it for high-efficiency polishing and grinding, reducing work time and labor, and standardizing operations. 【Lineup】 ■ Portable type BP-K (air motor type) ■ Made-to-order machine PC-1 (wheel centerless), BC (standard dust cover equipped) ■ Installed type BM (basic type), SBA-1, BH-2 ■ Wheel type SBD-4S, SBD-7, BWd *For more details, please download the PDF or contact us.

• Other machine tools

The "BWd" is a wheel-type machine designed specifically for polishing and grinding operations during the production of rolled steel and H-beams, with dimensions of 700mm in width, 1300mm in height, and 1400mm in depth. It is a center belt machine that is convenient for tasks such as removing scratches, primary removal, and grinding welding beads. This machine can be used for applications such as internal and external surface bead work on large-diameter steel pipes, as well as scratch removal in bridge construction, shipbuilding, and architecture. 【Features】 ■ Wheel-type machine focused on polishing and grinding operations during the production of rolled steel and H-beams ■ Convenient center belt machine for grinding welding beads and primary removal ■ Polishing and grinding tasks include: scratch removal, primary removal, welding bead grinding, surface grinding after cutting, and deburring drill holes *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment

The SBD-7 is a wheel-type machine designed specifically for polishing and grinding operations during the production of rolled steel and H-shaped steel, with dimensions of 590mm in width, 1250mm in height, and 1300mm in depth. It is a side belt machine that smoothly handles corner and edge surface polishing and grinding of steel plates, suitable for scratch removal, primary removal, and welding bead grinding. This machine can be used for applications such as the production of rolled steel, H-shaped steel, and the inner and outer surface beads of large-diameter steel pipes, as well as for scratch removal in bridges, shipbuilding, and construction. [Features] - Wheel-type machine focused on polishing and grinding operations during the production of rolled steel and H-shaped steel - Side belt machine that smoothly handles corner and edge surface polishing and grinding of steel plates - Polishing and grinding contents: scratch removal, primary removal, welding bead grinding, surface grinding after cutting, and deburring of drill holes *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment

The "SBD-4S" is a wheel-type machine designed specifically for polishing and grinding operations during the production of rolled steel and H-shaped steel, with dimensions of 400mm in width, 1050mm in height, and 730mm in depth. It is a compact and lightweight side belt machine that is easy to carry, suitable for tasks such as scratch removal, primary removal, and grinding of weld beads. It can be used for applications such as the production of rolled steel, H-shaped steel, and the inner and outer surface beads of large-diameter steel pipes, as well as scratch removal in bridge construction, shipbuilding, and architecture. 【Features】 - Wheel-type machine focused on polishing and grinding operations during the production of rolled steel and H-shaped steel - Compact and lightweight side belt machine that is easy to carry - Polishing and grinding tasks: scratch removal, primary removal, grinding of weld beads, surface grinding after cutting, and deburring of drill holes *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment

The "BH-2" is a tabletop machine suitable for polishing and grinding small parts and materials. It is capable of removing scratches, deburring, grinding weld beads, grinding sprue, removing scale, and surface finishing. It can also be mounted on a standard lathe and is recommended for grinding, polishing, and finishing small parts. 【Features】 ■ Polishing capabilities - Scratch removal, deburring, weld bead grinding, sprue grinding, scale removal, surface finishing ■ Can be mounted on a standard lathe ■ Recommended for grinding, polishing, and finishing small parts *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment

The "SBA-1" is a high-power machine designed for high efficiency by narrowing its functions. It excels in mass and high-speed grinding of parts with the same shape. With a powerful motor, heavy grinding tasks such as gate grinding are also easy and speedy. No expertise is required to achieve stable grinding precision, and it significantly contributes to increased work efficiency through high-speed grinding. 【Features】 ■ Can be mounted on roll lathes ■ Recommended for grinding and polishing finishes of roll shafts and similar items ■ Excels in mass and high-speed grinding of parts with the same shape ■ With a powerful motor, heavy grinding tasks such as gate grinding are also easy and speedy *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment

The "BM" is a basic machine that flexibly accommodates a wide range of applications. It can adapt to various workpieces, from flat surfaces to curved ones, and from ordinary steel and special steel to plated parts and plastic components. The rubber contact wheel can be replaced according to the size of the workpiece, making it recommended for grinding, polishing, and finishing various standard-sized parts. 【Features】 ■ The rubber contact wheel can be replaced according to the size of the workpiece. ■ Recommended for grinding, polishing, and finishing various standard-sized parts. ■ Equipped with a dedicated arm and small-diameter contact wheel, it can also handle grinding on curved surfaces, curves, and concave areas. ■ Standard semi-enclosed cover (fully enclosed cover is also available). *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment

The "BC (Dust Cover Equipped)" is a belt grinding machine suitable for high-speed polishing and grinding of pipes, round bars, and cylinders. The external dimensions are 2015mm in width, 1600mm in height, and 580mm in depth. The weight is 229kg. Please make extensive use of it for reducing work time and labor through high-efficiency polishing and grinding, as well as standardizing operations. 【Features】 ■ Made to order ■ Convenient for centerless surface finishing of round bars and pipes ■ Ideal for high-speed polishing and grinding of pipes, round bars, and cylinders ■ Dust cover included as standard *For more details, please refer to the PDF materials or feel free to contact us.

• Wafer processing/polishing equipment

The "PC-1" is a centerless belt grinding machine suitable for decorative finishes such as pearlescent and cylindrical hairline finishes. Its dimensions are 1000mm in width, 1200mm in height, and 1600mm in depth. The weight is 250kg. Please make extensive use of it for reducing work time and labor through high-efficiency grinding and polishing, as well as for standardizing operations. 【Features】 ■ Made to order ■ Convenient for centerless surface finishing of round bars and pipes ■ Ideal for decorative finishes such as pearlescent and cylindrical hairline ■ Wheel centerless *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment

The "BP-K (Air Motor Type)" is a portable belt sander suitable for smooth finishing in areas that can only be done manually or have complex shapes. It can also polish corners that cannot be reached by a hand grinder. It is a lightweight, easy-to-operate handheld type that does not burden the operator. It can be used for applications such as the inner surfaces of tanks, stainless steel sinks, bathtubs, stainless steel painted products, and woodworking products. 【Features】 - Suitable for smooth finishing in areas that can only be done manually or have complex shapes - Can polish corners that cannot be reached by a hand grinder - Lightweight and easy-to-operate handheld type that does not burden the operator - High-speed polishing improves work efficiency - Polishing contents: scratch removal, burr removal, contouring, surface finishing, paint stripping, rust removal *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment

Our company manufactures and sells a "super finishing device" that achieves stable surface finishing by polishing while winding roll film coated with abrasive particles. We are excited to announce the addition of a 'new unit' to our lineup! We are currently conducting final checks, but we would like to introduce some of its features ahead of the launch. 【Specifications (compared to our SP-50 model)】 Size: L610×W324×H297mm (approximately 26% reduction in volume, height reduced by 86mm) Weight: 32kg (20% reduction) Power consumption: 36Wh (approximately 45% reduction) Air consumption: 2.5L/min *Please feel free to contact us for more details.

• Grinding Machine

The "Attachment SF" is a product that enables combined processing with super finishing by incorporating the super finishing process, which was traditionally performed as a separate operation, into CNC lathes and other machines. Compared to our existing products, the unit has been miniaturized from a weight of 40 kg to approximately 4.2 kg, about 1/10 of its original size. As a turret type with a tool rotation axis, it allows for space-saving super finishing and improved efficiency. 【Features】 - Polishing in a cross-hatch pattern due to the film oscillation mechanism - Uniform finishing without directionality - The drive source is linked to the turret tool rotation axis of the lathe - Processing conditions can be set arbitrarily - Minimizes film costs *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment

We would like to introduce our "Helium Leak Testing Device." ■ Helium leak rate: 1×10^-9 Pa·m³/sec or less ■ Cycle time: 10 seconds per unit Work is performed at 2 stations (1 station 20 seconds per unit) When the rough vacuum time is 4.5 seconds and the measurement time is 7.5 seconds We also design and manufacture many other measuring devices and specialized machines. We will create equipment that responds to your needs. Please contact Matsuda Seiki, celebrating its 70th anniversary! *For more details, please inquire.

• Other processing machines

We would like to introduce our "Air Leak Tester." ■ Processing and Measurement Conditions Coining and Measurement Ball: φ13.49 (JIS B1501 Grade 60) Coining Pressure: 1.0 to 2.5 kN Pressing Pressure during Leak Measurement: 10 N ■ Air Leak Rate: 3 ml/min or less (-60 kPa) We also design and manufacture many other measuring devices and specialized machines. We will create equipment that responds to your needs. Please contact Matsuda Seiki, celebrating 70 years in business! *For more details, please inquire.

• Other processing machines

We design and manufacture many other measuring devices and specialized machines. We create equipment that responds to the question, "What if we could do this...?" Please feel free to contact Matsuda Seiki, which is celebrating its 70th anniversary!

• Other processing machines

This is a semi-custom pipe cutting machine that reflects the customer's requests. It is also possible to manufacture pipe cutting machines under conditions other than those listed below. ■ Work Conditions Type: EGR-TUBE Appearance: Pipe material (φ17.0) Processing Locations: Both ends Material: SUS429M Processing Time: 40 seconds (processing 2 pieces simultaneously) We also design and manufacture many other measuring devices and specialized machines. We will create equipment that responds to your "if only we could do this..." requests. Please feel free to contact Matsuda Seiki, celebrating its 70th anniversary!

• Other processing machines

We would like to introduce our "Deburring Machine for Two-Plate Sprockets." ■ Machine Name: Deburring Machine for Two-Plate Sprockets ■ Work Head Section Work Rotation Speed: Max 5 RPM (60Hz) Slide Travel Distance: Max 100mm Slide Drive Method: Air Cylinder Detection Function: Forward End / Reverse End (Auto Switch) We also design and manufacture many other measuring devices and specialized machines. We will create equipment that responds to your needs. Please contact Matsuda Seiki, celebrating its 70th anniversary! *For more details, please inquire.

• Other processing machines

We design and manufacture many other measuring devices and specialized machines. We create equipment that responds to the question, "What if we could do this...?" Please feel free to contact Matsuda Seiki, which is celebrating its 70th anniversary!

• Other processing machines

We design and manufacture many other measuring devices and specialized machines. We create equipment that responds to "If only we could do this..." Please feel free to contact Matsuda Seiki, celebrating 70 years in business!

• Other processing machines

Matsuda Seiki offers "Free Test Processing for Film Type Ultra-Finish in Film Polishing Machines." If you are facing issues such as "not achieving the desired surface roughness in the polishing process" or "wanting to elevate the quality of the target workpiece to the next level," please leave it to us. With 70 years of precision metal processing technology and over 30 years of experience in film-type ultra-finish polishing, we will solve your problems. Feel free to consult with us. 【Do you have any of the following concerns?】 ■ Not achieving the desired surface roughness in the polishing process ■ Unable to achieve process capability due to unstable polishing ■ Wanting to perform low-cost and hassle-free polishing processing ■ Wanting to elevate the quality of the target workpiece to the next level *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Surface treatment contract service
• Processing Contract

"Film polishing" can achieve an excellent surface finish in a short time while minimizing polishing unevenness and the occurrence of scratches. We received a request from an OA parts manufacturer aimed at improving surface roughness through rubber roll polishing. Before processing, the Ra value was 1.43μm, with a required value of less than Ra 0.6μm. Using a 9μ mirror film and processing for 15 seconds, the measured result after processing was Ra 0.395μm. 【Processing Example】 ■ Client: OA parts manufacturer ■ Work Name: Rubber Roll ■ Work Material: General-purpose Rubber ■ Purpose: Improvement of surface roughness / Before processing Ra 1.43μm / Required value Ra less than 0.6μm ■ Film Used: 9μ Mirror Film ■ Processing Time: 15 seconds ■ Measurement Result After Processing: Ra 0.395μm * Test processing is available. The first time is free of charge. * For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Surface treatment contract service
• Processing Contract

"Film polishing" enables the achievement of excellent surface finishes in a short time while minimizing polishing unevenness and the occurrence of scratches. We received a request for large roll polishing from a steel roll manufacturer, aimed at removing the feed marks from grinding. Before the introduction of the super finisher, the processing time was 9 hours per piece, but after its introduction, it was reduced to 30 minutes (1 pass) × 4 passes = 2 hours per piece, allowing for a reduction of processing time to less than one-fourth. [Processing Example] - Customer: Steel roll manufacturer - Work Material: Tungsten thermal spray - Work Size: φ350×3000 - Product Name: Bridle Roll - Purpose: Removal of feed marks from grinding - Required Surface Roughness: R max 0.3μm / Ra 0.04μm - Processing Time Before Super Finisher Introduction: 9 hours per piece - Processing Time After Super Finisher Introduction: 30 minutes (1 pass) × 4 passes = 2 hours per piece *Test processing is available. The first time is free of charge. *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Surface treatment contract service
• Processing Contract

"Film polishing" can achieve an excellent surface finish in a short time while minimizing polishing unevenness and the occurrence of scratches. We received a request from a tool holder manufacturer for taper surface polishing aimed at improving surface roughness. The workpiece is a tool holder for machining, and the material is SCM415. Using a microfilm of 15μ, we processed for 25 seconds, and the measurement results after processing were R max 0.329μm/Ra 0.029μm. [Processing Example] ■ Requestor: Tool holder manufacturer ■ Workpiece Name: Tool holder for machining ■ Workpiece Material: SCM415 ■ Purpose: Improvement of surface roughness / Pre-processing R max 1.1μm / Required value R max below 0.6μm ■ Film Used: Microfilm 15μ ■ Processing Time: 25 seconds ■ Measurement Results After Processing: R max 0.329μm/Ra 0.029μm * Test processing is available. The first time is free of charge. * For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Surface treatment contract service
• Processing Contract

"Film polishing" can achieve an excellent finish in a short time while minimizing polishing unevenness and the occurrence of scratches. We received a request from an automotive parts manufacturer for processing using a super finisher aimed at improving surface roughness. Before processing, the Ra was 0.8μm, and the required value was below Ra 0.5μm. Using a micro film of 9μ, we performed processing for 15 seconds, and the measurement result after processing was Ra 0.035μm. 【Processing Example】 ■ Requester: Automotive parts manufacturer ■ Work Name: Shaft, Planet Pinion ■ Work Material: SCM415H Hardened ■ Purpose: Improvement of surface roughness / Pre-processing Ra 0.8μm / Required value below Ra 0.5μm ■ Film Used: Micro Film 9μ ■ Processing Time: 15 seconds ■ Measurement Result After Processing: Ra 0.035μm * Test processing is available. The first time is free of charge. * For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Surface treatment contract service
• Processing Contract

The "SFF Series" is a multi-head type cylindrical super finishing machine with a transport device. For example, it can simultaneously polish different areas of three workpieces using three polishing units, achieving high-efficiency polishing that shortens cycle time. It is also capable of varying the finishing degree for different areas of each workpiece. By combining the workpiece loading and unloading robot with this machine, it is possible to realize inline polishing processes that were previously considered difficult, as well as the establishment of fully automated unmanned polishing lines. 【Features】 ■ Capable of handling a mix of cross hatch and straight hatch ■ Polishing tailored to specific purposes and applications, such as super finishing ■ Fully automated polishing through inline integration is possible ■ High-efficiency and stable polishing of large quantities of identical shape parts can be achieved with minimal manual labor ■ Improved cost competitiveness *For more details, please refer to the PDF materials or feel free to contact us.

• Wafer processing/polishing equipment

Introducing the "Internal Super Finishing Unit" handled by Matsuda Seiki Co., Ltd. We offer a clamping type that polishes small-diameter workpieces by wrapping them in film, as well as a slack type that applies film at low pressure. Based on extensive testing results, we respond to various requests with a range of specialized machines for centerless workpiece polishing and more. 【Features】 ■ Internal unit ■ Available in clamping type and slack type ■ Extensive testing results available ■ Suitable for super finishing polishing of cylindrical inner surfaces and end faces *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment

We would like to introduce our super finisher, the 'DOUBLE CROSS HEAD'. By incorporating a three-dimensional film feeding mechanism and head configuration into the conventional film-based super finishing process, we have adopted our unique film guide method that enables external diameter polishing of recessed areas on the inner surface of cylindrical workpieces, which was difficult with traditional film-based super finishing. Additionally, thanks to the three-dimensional crossover method unique to film-based super finishing, we ensure stable film tension and prevent misalignment by setting a reasonable film path. 【Features】 ■ W Cross Guide Method - Enables external diameter polishing of recessed areas on the inner surface of cylindrical workpieces - Our unique film guide method ■ Three-dimensional crossover method unique to film-based super finishing - New film polishing materials and post-polishing items cross each other without contact - Stable film tension and prevention of misalignment through reasonable film path settings *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment

The "SF200 model" is a super finishing grinding device that can shorten grinding time. It is compatible with various large rolls such as "super calendar rolls for papermaking," "press rolls," "coater rolls," "backing rolls," and "rolling mill rolls for steelmaking." You only need to replace the film with a set cycle, making maintenance adjustments easy (no dresser required), significantly reducing downtime. 【Features】 ■ Reduces grinding time Approximately 1/2 to 1/3 of the grinding time with grinding stones (based on our performance) ■ Contributes to the rationalization of maintenance and reduction of downtime ■ Flexibly accommodates various roll materials *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment

The "SM-25 type" is a unit-type super finisher. It demonstrates its power when mounted on compact general-purpose machines. The standard specifications include the super finisher body, control panel, backup rubber roller, core for film winding, mounting base for the body, and tools. It has a vibration frequency of 300 to 1,600 cpm and a swing amount of 2 mm. 【Features】 ■ Unit type ■ Easily mounted on small machines ■ Operating speed: 10 to 55 mm/min (60Hz) ■ Vibration frequency: 300 to 1,600 cpm ■ Swing amount: 2 mm *For more details, please refer to the PDF materials or feel free to contact us.

• Wafer processing/polishing equipment

The "SP-50 model" is a film super-finishing device that achieves the desired surface roughness through standard operations. It employs a method of polishing while winding a roll film coated with abrasive particles. This allows for consistently stable surface finishing without affecting the dimensional accuracy of the workpiece. The oscillation mechanism of the film enables cross-hatch polishing, resulting in a uniform surface finish without directionality. 【Features】 - Consistently stable surface finishing achieved with simple operation that requires no skill - Flexibility to accommodate the desired surface roughness - Easy to mount on existing equipment - Eliminates concerns about uneven polishing and scratches without affecting the dimensional accuracy of the workpiece - Maintains a clean working environment *For more details, please refer to the PDF document or feel free to contact us.

• Grinding Machine
• Wafer processing/polishing equipment

The "SP-100 model" is a film super-finishing device that achieves the desired surface roughness through standard operations. It uses a method of polishing while winding a roll film coated with abrasive particles. It allows for consistently stable surface finishing without affecting the dimensional accuracy of the workpiece. By simply selecting the appropriate film according to the required surface roughness, it can accommodate roughness down to Ra 0.02 microns. The body is lightweight and compact, making it easy to attach to your existing equipment. 【Features】 - Consistently stable surface finishing achieved with easy operation that requires no expertise - Flexible response to the desired surface roughness - Easy to mount on your existing equipment - Does not affect the dimensional accuracy of the workpiece, eliminating concerns about uneven polishing and scratches - Maintains a clean working environment *For more details, please refer to the PDF document or feel free to contact us.

• Grinding Machine
• Wafer processing/polishing equipment

There is an increasing number of precision functional parts that require surface functionality, particularly in high-tech products such as automotive and office automation equipment. For example, in automotive parts, by super-finishing the surface of related components to RZ0.8 or lower, their durability, operability, and airtightness are improved. In office automation-related components, by finishing parts primarily made of non-metal materials to the required surface roughness, functions such as smoothness are achieved. 【Features】 - Cross hatch or straight options are available during plunge cutting. - Film stop polishing to enhance surface roughness can also be programmed. - Polishing positions can be selected via numerical input or teaching methods. - Space-saving design. *For more details, please download the PDF or contact us.

• Grinding Machine

The "Bader Machine" is our belt grinder that boasts excellent polishing performance for each individual unit. By selecting models and types according to the shape and size of the workpiece, and equipping them with polishing belts suitable for the task, we can flexibly accommodate a wide variety of items across diverse fields. Please make extensive use of it for high-efficiency polishing and grinding, reducing work time and labor, and standardizing operations. 【Product Lineup】 ■ Portable Type BP-K (Air Motor Type) ■ Made-to-order Machine PC-1 (Wheel Centerless), BC (Standard Dust Cover Equipped) ■ Installed Type BM (Basic Type), SBA-1, BH-2 ■ Wheel Type SBD-4S, SBD-7, BWd *For more details, please download the PDF or contact us.

• Other machine tools

The "Super Finisher SFC025PMd" is a film-type cylindrical ultra-finishing machine that does not experience abrasive wear or changes in polishing, ensuring that the dimensional accuracy of the workpiece is unaffected and achieving a stable surface roughness of Rz0.8μ or less. It can also comfortably handle the ultra-finishing surface roughness requirements of Rz0.1 to 0.2μ that are increasingly demanded today. Additionally, film polishing offers the significant advantage of easy operation that does not require skilled labor, allowing for uniform finishing at the specified roughness, as well as overwhelming productivity compared to grinding wheel methods. 【Features】 ■ Compatible with surface roughness of Rz0.8μ or less ■ High-efficiency polishing possible from the day of installation ■ Cost-competitive low-cost automatic machine ■ Thorough pursuit of cost reduction with single functionality *For more details, please download the PDF or contact us.

• Gear cutting machine/Gear finishing machine