ユー・エイチ・システム List of Products and Services

We would like to introduce our 3D X-ray CT system, the 'XVA-160αII "Z"'. This product is a super high-resolution model that achieves ultra-high magnification (2,000 times) and nano-order sizes (250/800nm). There are examples of imaging such as transmission images and tomographic images of fingerprint sensors, as well as tomographic images of electromigration. It is equipped with numerous features, including user-centric functionality, automatic adjustment of the optical axis, rotation center, and focus. 【Standard Specifications】 ■ Flat panel detector ■ User-centric functionality ■ High magnification (2,000 times) ■ Focus size switching function (250/800nm) ■ High-resolution top table ■ Automatic adjustment of optical axis, rotation center, and focus *For more details, please refer to the related links or feel free to contact us.

This is an example of a QFP (Quad Flat Package) captured using orthogonal CT. It allows for detailed observation of the second bonding marks of the wires. The XVA-160RZ enables easy orthogonal CT imaging simply by attaching a dedicated unit without the need to change the stage. Similar to oblique CT, orthogonal CT can also be performed at high magnification.

Our company offers a 3D X-ray CT system that employs our unique technology, the "U-Centric Mechanism," allowing for easy and efficient observation at high magnification. In diagonal CT imaging, bringing the target area closer to the X-ray focus enables high-magnification tomographic imaging. This allows for detailed observation and strongly supports the discovery and analysis of defects in printed circuit boards and semiconductor devices. 【Features】 ◎ 'XVA-160RA' ■ A newly revamped model based on the standard model, compatible with high-resolution generators ■ Equipped with a nano-focus X-ray generator (focus size 250/800nm) ■ Enables clear observation of details at a magnification of 1,600 times ■ Features visible light mapping and automatic focus adjustment functions ◎ 'XVA-160αII "Z"' ■ A high-end model specialized for even higher magnification, capable of analyzing the internal structure of packages ■ Equipped with a nano-focus X-ray generator (focus size from 200nm) ■ Allows precise observation of detailed structures at a magnification of 2,000 times ■ Features a high-resolution top table, automatic adjustment functions for optical axis, rotation center, and focus

This is a case of a conductive polymer aluminum solid electrolytic capacitor captured through transmission imaging and oblique CT scanning. It allows for the confirmation of internal structures and observation of solder conditions. The XVA-160RZ is a standard model that can broadly observe various defects in a wide range of workpieces. Additionally, it is capable of CT scanning in just three and a half minutes, contributing to increased efficiency in analysis.

This is an example of a heated tobacco product captured through transmission imaging. It allows for understanding the internal substrate condition and structure. The XVA-160RZ can perform orthogonal CT imaging easily by simply attaching a dedicated unit without changing the stage. Similar to oblique CT, orthogonal CT can also be captured at high magnification.

The "XVA-160RZ" is a micro-focus X-ray CT system used for applications such as non-destructive testing and material analysis. This system can visualize fine internal structures with high resolution. Additionally, you can choose between a high-resolution type and a wide-field type. This time, we will introduce a case study of the micro-focus X-ray CT system "XVA-160RZ"!

The "XVA-160RZ" is a micro-focus X-ray CT system used in applications such as non-destructive testing and material analysis. This system can visualize fine internal structures with high resolution. Additionally, you can choose between a high-resolution type and a wide-field type. This time, we will introduce shooting examples of the micro-focus X-ray CT system "XVA-160RZ"! On a separate page, we have published the first-generation smartphone. Changes in the internal structure can be observed comparatively.

This is a case where TGV (Through Glass Via: Glass Penetrating Electrode) was imaged using transmission imaging and angled CT scanning. The voids inside the Cu filled vias can be clearly observed. The device used for imaging, 'XVA-160αII "Z"', is an ultra-high-resolution nano-focus 3D X-ray CT system. It is an ultra-high-end model that achieves nano-order analysis and can perform CT scanning in just 3.5 minutes thanks to world-class angled CT technology, contributing to improved efficiency in analysis. 【Features】 - A high-end model specialized for higher magnification, capable of analyzing the internal structure of packages. - Equipped with a nano-focus X-ray generator (focus size 200nm and above). - Precisely observes detailed structures at a high magnification of 2,000 times. - Equipped with a high-resolution top table, automatic adjustment functions for optical axis, rotation center, and focus.

The "XVA-160□520" is a three-dimensional X-ray CT system that adopts the unique technology "User-Centric Mechanism," allowing for easy and efficient observation at high magnification. Recently, there has been an increasing demand for observation of large substrates, so we have released a new model that can perform oblique CT imaging at high magnification on large substrates. It strongly supports the observation of solder mounting conditions and the detection and analysis of device defects on large substrates sized 520mm x 520mm. 【Features】 ■ A model based on the standard model with an enlarged stage mechanism to improve precision and accommodate high-resolution generators. ■ Equipped with a nano-focus X-ray generator (focus size 250/800nm). ■ Allows for clear observation of details at a high magnification of 2000 times. *For more details, please contact us through the inquiry form on our website.

This is a case of X-ray imaging of the wire bonding of a microSD card. The wire bonding can be clearly observed. The device used for imaging, "XVA-160αII 'Z'," is an ultra-high-resolution nano-focus 3D X-ray CT system. It is an ultra-high-end model that achieves nano-order analysis and can perform CT imaging in just 3.5 minutes thanks to world-class oblique CT technology, contributing to improved efficiency in analysis. 【Features】 - A high-end model specialized for higher magnification, capable of analyzing the internal structure of packages. - Equipped with a nano-focus X-ray generator (focus size 200nm and above). - Precise observation of detailed structures at a high magnification of 2,000 times. - Features a high-resolution top table, automatic adjustment functions for optical axis, rotation center, and focus.