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This is a case where TGV (Through Glass Via: Glass Penetrating Electrode) was imaged using transmission imaging and angled CT scanning. The voids inside the Cu filled vias can be clearly observed. The device used for imaging, 'XVA-160αII "Z"', is an ultra-high-resolution nano-focus 3D X-ray CT system. It is an ultra-high-end model that achieves nano-order analysis and can perform CT scanning in just 3.5 minutes thanks to world-class angled CT technology, contributing to improved efficiency in analysis. 【Features】 - A high-end model specialized for higher magnification, capable of analyzing the internal structure of packages. - Equipped with a nano-focus X-ray generator (focus size 200nm and above). - Precisely observes detailed structures at a high magnification of 2,000 times. - Equipped with a high-resolution top table, automatic adjustment functions for optical axis, rotation center, and focus.

The "XVA-160RZ" is a micro-focus X-ray CT system used in applications such as non-destructive testing and material analysis. This system can visualize fine internal structures with high resolution. Additionally, you can choose between a high-resolution type and a wide-field type. This time, we will introduce shooting examples of the micro-focus X-ray CT system "XVA-160RZ"! On a separate page, we have published the first-generation smartphone. Changes in the internal structure can be observed comparatively.

The "XVA-160RZ" is a micro-focus X-ray CT system used for applications such as non-destructive testing and material analysis. This system can visualize fine internal structures with high resolution. Additionally, you can choose between a high-resolution type and a wide-field type. This time, we will introduce a case study of the micro-focus X-ray CT system "XVA-160RZ"!

This is an example of a heated tobacco product captured through transmission imaging. It allows for understanding the internal substrate condition and structure. The XVA-160RZ can perform orthogonal CT imaging easily by simply attaching a dedicated unit without changing the stage. Similar to oblique CT, orthogonal CT can also be captured at high magnification.

This is a case of a conductive polymer aluminum solid electrolytic capacitor captured through transmission imaging and oblique CT scanning. It allows for the confirmation of internal structures and observation of solder conditions. The XVA-160RZ is a standard model that can broadly observe various defects in a wide range of workpieces. Additionally, it is capable of CT scanning in just three and a half minutes, contributing to increased efficiency in analysis.

The XVA-160RZ is a versatile 3D X-ray CT system that can be used for quality assurance, failure analysis, and inspection of semiconductors, electronic components, and electronic modules. By utilizing functions such as real-time observation, 3D oblique CT, and orthogonal CT according to the application, it not only advances analysis tasks efficiently but also dramatically improves the success rate of analyses. Additionally, by using the standard program operation function, it can also be employed for product sorting and sampling inspection purposes.

This is an example of a QFP (Quad Flat Package) captured using orthogonal CT. It allows for detailed observation of the second bonding marks of the wires. The XVA-160RZ enables easy orthogonal CT imaging simply by attaching a dedicated unit without the need to change the stage. Similar to oblique CT, orthogonal CT can also be performed at high magnification.

Our in-house developed software "Jasper" is a multi-device control software that can accommodate a variety of light sources and cameras. Patterns, voids, and wire impressions that were not visible before filter processing can now be clearly seen thanks to the filter treatment. It can be used not only for post-processing of captured images but also during live observation, contributing to a reduction in man-hours.

This is an example of capturing an FET (Field Effect Transistor) using 3D oblique CT. In fluoroscopy, it is difficult to distinguish the voids in each layer because the solder in the mounting area overlaps with the solder under the chip. By using CT imaging, it becomes possible to observe the sections separately, as shown in the attached materials. The XVA-160RZ allows for specifying the imaging area during the fluoroscopic observation phase through its user-centric function, enabling a transition to 3D oblique CT imaging without removing the sample, which also contributes to reducing labor costs.

This is an example of a QFP (Quad Flat Package) captured using orthogonal CT. It is possible to observe the internal chip patterns in detail. The XVA-160RZ allows for easy orthogonal CT imaging simply by attaching a dedicated unit without changing the stage. Similar to oblique CT, orthogonal CT can also be performed at high magnification.

The "XVA-160αII 'Z'" is a nano-focus X-ray CT system used in applications such as non-destructive testing and material analysis. This system is an ultra-high-resolution model that achieves ultra-high magnification (2000 times) and nano-order sizes (250/800nm). The patterns of each internal layer are captured clearly. The condition of the fillet and the mounting state are also uniquely visible through CT imaging.

The "XVA-160RZ" is a micro-focus X-ray CT system used in applications such as non-destructive testing and material analysis. This system can visualize fine internal structures with high resolution. Additionally, you can choose between a high-resolution type and a wide-field type. This time, we will introduce a case study of the micro-focus X-ray CT system "XVA-160RZ"! It is a case where CT scans of a smartphone-mounted CPU were taken.