フクダ Product Lineup

The "MS series" is a leak test system for small electronic components that require airtightness, including: - Crystal devices - Ceramic oscillators - Optical devices - Power semiconductors - CAN devices - Laser diodes - Capacitors Leak testing of sealed products may involve both gross leak and fine leak inspections, depending on product specifications and characteristics. We offer a lineup that includes fully automatic machines capable of performing the entire process in one unit, custom-built dedicated machines, and convenient tabletop types for sampling inspections. 【Lineup (excerpt)】 <Fully Automatic Devices> ■ Gross Leak Test System - MSZ-6200 - MS-6086 ■ Bombing Gross and Fine Leak Test System - MSX-6110 - MSX-6200 - MSX-7000 *For more details, please refer to the PDF document or feel free to contact us.

The 【MSX-7003 series】 is a leak testing device designed for relatively large electronic devices ranging from medium to large sizes. It is capable of performing leak tests on electronic devices smaller than 10 mm square, such as LEDs, optical devices, high-frequency devices, power semiconductors, IR sensors, gyro sensors, angular velocity sensors, and electrolytic capacitors. The 【MSX-7003 series】 is the top model in the series and is a composite leak testing device that automatically performs three processes: - Helium bombing - Gross leak test - Fine leak test It is also compatible with inline applications (the pass line height is 940 mm). Additionally, we offer a lineup tailored to customer needs, including: - The 【MSZ-7003 series】, designed solely for gross leak testing - The 【MHX-7003 series】, which performs bombing and fine leak testing - The 【MSH-7003 series】, which does not have a bombing device You can watch a video of the actual device in the YouTube link below.

The "MSX-0101 series" is a compact leak testing device specifically designed for electronic components such as MEMS, crystal devices, and SMDs. It is fully equipped with helium filling, gross leak testing, and fine leak testing in a single system. By managing the filling time and waiting time, it allows for proper gross and fine leak testing. 【Features】 ■ Ideal for leak testing of electronic components such as MEMS and SMDs ■ Quantifies gross and fine leak amounts while managing filling time and waiting time ■ Capable of performing both gross leak testing and fine leak testing with one device ■ Enables highly accurate fine leak measurement by appropriately setting bonding conditions and gross leak conditions *For more details, please refer to the PDF document or feel free to contact us.

The "MSX-7000 series" is a leak testing device for sealed package products such as small electronic components, crystal oscillators, MEMS and optical devices, and various sensors. With a new mechanism, it has achieved inspection of sizes as small as 1.0 × 0.8 mm for the first time, and the transport accuracy has improved through position correction using image processing. It can perform both bomb testing and gross/fine leak testing in a single unit. 【Features】 ■ Achieved inspection of sizes as small as 1.0 × 0.8 mm for the first time with a new mechanism ■ Improved transport accuracy through position correction using image processing ■ Enhanced gross leak sensitivity to 8.5×10⁻⁸Pa·m³/s *For more details, please refer to the PDF document or feel free to contact us.

As an alternative inspection method to liquid immersion testing (leak testing) using per- and polyfluoroalkyl substances (PFAS), Fukuda Corporation has been providing airtight testing equipment using pressure change leak testing methods for some time. The 'MSA-0101 series' is the latest airtight testing equipment for sealed products that confirms gross leaks. It is designed for small-scale applications such as testing during device development and random airtight inspections. (For mass production testing or line integration, we offer fully automated testing equipment in the 'MS series.') The product size for inspection ranges from small devices measuring a few millimeters to medium-sized devices up to 80 × 70 mm, which can be accommodated by manufacturing measurement jigs (cores).

In the semiconductor industry, the airtightness of encapsulation is crucial for enhancing product reliability. In devices exposed to temperature changes and vibrations, even minor leaks from the encapsulation can lead to performance degradation or failure. The MSA-0101 series addresses these challenges with PFAS-free air leak testing. 【Application Scenarios】 - Airtightness inspection in the encapsulation process of semiconductor devices - Prototype evaluation during the development stage - Random sampling inspection 【Benefits of Implementation】 - Reduction of environmental impact due to PFAS-free materials - Lower running costs through air leak testing - Compatible with small to medium-sized devices

In the electronics industry, the waterproofing of products is a crucial factor that affects reliability. The intrusion of moisture can lead to corrosion and short circuits in circuits, potentially resulting in product failure. Particularly for electronic devices used outdoors or products intended for use around water, high waterproof performance is required. The MSA-0101 series efficiently tests the waterproof performance of electronic devices through PFAS-free air leak testing. 【Usage Scenarios】 - Waterproof testing for smartphones, keyless switches, various small sensors, etc. - Prototype evaluation during the development stage - Random sampling inspection 【Benefits of Implementation】 - Reduced environmental impact due to PFAS-free materials - Lower running costs through air leak testing - Capable of accommodating devices from small to medium sizes