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  3. 立山電化工業
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立山電化工業

addressToyama/Takaoka-shi/Red Grandfather 546
phone0766-22-2377
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last updated:Jun 04, 2024
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立山電化工業 List of Products and Services

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About plating About plating
About metals About metals
ICP emission spectrometer ICP emission spectrometer
Barrel plating Barrel plating
Hoop plating Hoop plating
Rack plating Rack plating
Chip resistor Chip resistor
Mobile phone, smartphone connector Mobile phone, smartphone connector
LED ceramic substrate LED ceramic substrate
Hoop

Hoop plating

About hoop plating

Metal surface treatment: hoop plating (hoop Au plating, hoop Sn plating)

A section without gold plating (exposed nickel plating) is provided, and the thickness of the gold-plated section can be adjusted vertically! Additionally, technical materials related to surface treatment are also available!

When you look inside mobile phones and smartphones, you will find ultra-low-profile narrow-pitch connectors that have partial gold plating on their terminals. "Hoop plating" is a plating method suitable for connector components that connect electronic circuits. It realizes advanced technology that applies a "nickel barrier" to prevent solder wicking during assembly. 【Features】 ■ In the partial plating reel-to-reel line, stripe Au plating and spot Au plating are possible. ■ It supports specifications that combine two types of plating, such as partial Sn plating and partial Au plating, and can propose cost reductions by changing specifications from partial Au plating to partial Sn plating. ■ Our unique special drum and inline laser stripping technology enable the formation of a more precise "nickel barrier" through partial plating. ■ In the reel-to-reel line for full plating, base Ni plating followed by Sn plating is possible. ■ Both Au plating and Sn plating lines can accommodate SUS materials. ■ Supports reflow processing for Sn plating. *Some specifications may have restrictions. *For more details, please refer to the PDF document or feel free to contact us.

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[Case Study] Reduction of Au in Au-plated parts and improvement of Ni barrier function.

We will introduce a case where it became possible to prevent Au plating deposition and suppress variation in plating between terminals.

We are introducing a case study where we reviewed the spot Au plating jig for our customer company, resulting in a reduction of Au usage in Au-plated components and an improvement in the Ni barrier function, thereby solving their issues. 【Challenges faced by the customer】 The existing customer was troubled by the rising procurement costs of Au-plated components for connectors due to the recent surge in Au market prices. Additionally, they were also struggling with unnecessary solder wetting on certain areas during the PCB assembly of the connectors, which led them to consult with us. For details on the solution, its effects, and results, please download the case study from the catalog below or feel free to contact us.

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[Case Study] Reduction of Variation in Sn Plating

A case where we were able to achieve the process capability that the customer requires!

We would like to introduce a case where we reviewed the process design and conducted prototype production for a customer company, successfully reducing the variation in Sn plating. In this company, the customer was developing an automotive connector and required Sn plating on a certain component. However, they were unable to meet the specified range of plating thickness required by the customer, making it difficult to fulfill the connector's functionality. By reviewing our plating process design and developing a dedicated jig, we repeatedly went through trial and error in the prototype production, which allowed us to reduce the variation in plating thickness. Ultimately, we were able to achieve the process capability that the customer was looking for. 【Case Overview】 ■ Background - Sn plating thickness could not meet the specified range, making functionality difficult. ■ Effect - The customer's product development was successfully advanced, allowing for the product to be launched in mass production, thereby gaining the customer's trust. *For more details, please download the PDF or feel free to contact us.

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We are currently offering two documents addressing the challenges of Au・Sn hoop plating!

Introducing examples related to the reduction of Au usage in Au-plated parts, improvement of Ni barrier function, and reduction of variation in Sn plating.

【Challenges faced by the customer in the case study】 ■Au Plating The existing customer was troubled by the rising procurement costs of Au-plated components for connectors due to the recent surge in Au market prices. Additionally, they were also struggling with solder wetting on unnecessary parts during the mounting of connectors on the circuit board, and sought our consultation. ■Sn Plating For a vehicle-mounted connector that the customer was developing, they required Sn plating on a certain component. However, they were unable to meet the specified thickness range for the plating that the customer desired, making it difficult to satisfy the functionality of the connector. *For details on the solutions and effects, please refer to the PDF document or feel free to contact us.

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Plating of connector terminals with hoop plating and hoop Au plating.

A non-gold-plated section (nickel-plated exposed section) is provided, and the thickness of the gold-plated section can be adjusted vertically! Additionally, technical documentation regarding surface treatment is also available!

"Hoop Au plating" is a plating method suitable for connector components that connect electronic circuits. It realizes advanced technology that applies a "nickel barrier" to prevent solder wicking during assembly. When looking inside mobile phones and smartphones, ultra-low-profile narrow-pitch connectors are used, and these connector terminals are partially gold-plated. 【Features】 ■ In the partial plating reel-to-reel line, stripe Au plating and spot Au plating are possible. ■ Sn plating and Sn reflow are also possible for soldering areas. ■ Our unique special drum and inline laser stripping enable precise partial plating. ■ In the full plating reel-to-reel line, finishing Sn plating is performed, and it supports both underlying Ni plating and underlying Cu plating. ■ Reflow processing is possible for both underlying specifications, and it is compatible with SUS materials. * For more details, please refer to the PDF materials or feel free to contact us.

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Countermeasures for solder wetting during connector substrate mounting! Review of spot Au plating fixtures.

We will introduce a case where a review of the spot Au plating jig successfully reduced the amount of Au plating deposition by 30%. This also contributed to reducing variation in plating between terminals.

We are introducing a case where we addressed the issues faced by our client company by reviewing the spot Au plating fixtures, which led to a reduction in Au usage for Au plated components and an improvement in the Ni barrier function. 【Challenges Faced by the Client】 The existing client was troubled by the rising procurement costs of Au plated components for connectors due to the recent surge in Au market prices. Additionally, they were also struggling with solder wetting on unnecessary areas during the board assembly of the connectors, which prompted them to consult with us. For details on the solution, its effects, and results, please download the case study from the catalog below or feel free to contact us.

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Unable to meet the specifications for plating thickness, the connector is not functioning as intended.

A case where we were able to achieve the process capability that the customer requires!

We would like to introduce a case where we reviewed the plating process design and conducted prototype production for our customer, resulting in a reduction of variation in Sn plating. 【Challenges faced by the customer】 Regarding the automotive connectors that the customer was developing, they required Sn plating on a certain component, but we were unable to meet the specified range of plating thickness that the customer desired, making it difficult to satisfy the functionality of the connector. For the solution, its effects, and results, please download the case study from the catalog below or feel free to contact us.

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