立山電化工業 List of Products and Services

Our company offers manual plating lines using racks for various types of substrates, as well as fully automated plating lines with our unique belt conveyor system. For IC lead frames, we utilize a fully automated rackless plating line. Our fully automated plating line with a unique belt conveyor system aims to reduce labor by automating the loading and unloading of substrates and IC lead frames. Additionally, our fully automated plating process with the unique belt conveyor system has very minimal variation in plating thickness between substrates. 【Features】 ■ We provide manual plating lines using racks and our unique fully automated plating lines with belt conveyors for various types of substrates. ■ For IC lead frames, we utilize a fully automated rackless plating line. *For more details, please refer to the PDF document or feel free to contact us.

Our company specializes in metal surface treatment through electroplating. The plating process is positioned in the middle of our customers' processes, where we take in products (materials) from our customers, add "value through plating," and return them to our customers. Representative categories of ordered products include electronic components, flat-type chip resistors (electrode parts), crystal devices, automotive LED components, and connectors that connect electronic circuits. Please feel free to contact us if you have any inquiries. [Business Description] ■ Metal surface treatment through electroplating *For more details, please download the PDF or feel free to contact us.

We would like to introduce the "plating that provides solderability" that we handle. Soldering is an essential technology in the production of electronic devices. The purpose of soldering is to join metals together to allow electrical conduction and to maintain the position through the joint. In printed circuit boards, soldering is used to connect circuits and electronic components to enable electrical conduction, while also fixing the components in place to prevent movement, and solderability is achieved through plating. 【Functional Plating】 ■ Electrical properties: electrical conductivity, wiring formation, electromagnetic wave shielding ■ Mechanical properties: wear resistance, lubricity ■ Physical properties: solder wetting, bonding ability *For more details, please download the PDF or feel free to contact us.

We would like to introduce the "plating with bonding properties" that we handle. In plating with bonding properties, gold and silver plating are used. In particular, neutral bath pure gold plating is used for gold plating. Plating is applied to the parts where bonding occurs, specifically on the electrode parts of semiconductor devices and package leads, to enhance joint compatibility. Please feel free to contact us if you have any requests. 【Typical composition of neutral bath (partial)】 ■ Gold compound (metal salt): Potassium cyanide ■ Gold concentration: 8–10 ■ Conductive salt/acid: Citrate/phosphate ■ pH: 6–7 ■ Added metals: As or Ta *For more details, please download the PDF or feel free to contact us.

We would like to introduce "plating that provides electrical conductivity," which we handle. The main reason for plating electronic components is to impart or enhance the property of conducting electricity. Among metals, silver has the best electrical conductivity, followed by copper and gold. Among these, gold plating is primarily used for contact components (such as connectors) because it not only has good conductivity but also does not form an oxide film, resulting in stable low contact resistance. 【Functional Plating】 ■ Electrical properties: electrical conductivity, wiring formability, electromagnetic wave shielding ■ Mechanical properties: wear resistance, lubricity ■ Physical properties: solder wettability, bonding ability *For more details, please download the PDF or feel free to contact us.

Introducing "Plating for Electromagnetic Wave Shielding." As electronic devices become smaller and lighter, it is common for their outer casings to be made of non-conductive materials such as plastics. These materials allow electromagnetic waves to pass through, making shielding necessary. To address this, a method of covering the inner surface of the casing or areas close to components that generate electromagnetic waves with a plating film is employed, using electroless copper plating and electroless nickel plating. **Features** - Plating is used to prevent (shield) the generation of electromagnetic wave noise. - Electroless copper plating and electroless nickel plating are primarily adopted. *For more details, please download the PDF or feel free to contact us.*

Our company offers manual plating lines using racks for various substrates, as well as fully automated plating lines utilizing our unique belt conveyor system. For IC lead frames, we utilize a fully automated rackless plating line. The fully automated plating line with our unique belt conveyor system aims to reduce labor by automating the loading and unloading of substrates and IC lead frames. Additionally, our fully automated plating process with the unique belt conveyor system has very minimal variation in plating thickness between substrates. 【Features】 ■ Manual plating lines using racks and our unique fully automated plating lines with belt conveyors for various substrates ■ Fully automated rackless plating line for IC lead frames *For more details, please refer to the PDF document or feel free to contact us.