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Chip resistor
We are conducting plating processes aimed at providing functionality for solder mounting on electrode parts ranging from size 1005 (L×W=1.0mm×0.5mm) to size 6330 (L×W=6.3mm×3.2mm). Our fully automated barrel plating equipment is controlled based on plating conditions (master data) determined by size and resistance values, allowing us to meet customer requirements. The sorting after plating is constructed using our in-house developed process that utilizes shape differences.