イーアールエス List of Products and Services

This device cuts steel pipes to a specified length and supplies and discharges them to a CNC automatic lathe. It can automatically feed pipes with a maximum diameter of φ100mm and a length of up to 4,000mm, and it can accommodate up to two pipes of φ100mm. A robot catches the workpieces cut by the cutting machine and supplies them to the CNC automatic lathe. 【Features】 ■ Automation of processing operations: Achieves lower prices for processed products through unmanned operation ■ Improved safety during processing: Reduces operator fatigue and helps prevent accidents ■ Enhanced processing quality: Maintains quality through a stable process ■ Expandability: Allows for multiple automatic lathe lines by laying rails on the floor ■ Addition of IoT functions: Enables tool life management, operational management, and cost management (optional) *For detailed information and product catalogs, please access the related links.

• Other machine elements

This device automates insert molding by installing one robot each on a punch and forming press. It collects metal parts punched out by a progressive press at the transfer section and transports them for insert molding, then retrieves the finished products. Additionally, with the optional IoT functionality, production and operation management, as well as cost management, become possible. 【Features】 ■ Robots automate and streamline complex tasks ■ Achieves quality improvement and stabilization through precise operations ■ Realizes accurate takt time ■ Enables production and operation management, as well as cost management with the addition of IoT functionality (optional) *For detailed information and product catalogs, please access the related links.

• Other machine elements

This device is designed to press resin pins accurately and quickly into multiple yoke parts located on the back side of the workpiece (auto parts). The robotic hand presses the resin pins supplied from the parts feeder into the yoke parts of the workpiece while correcting the position using an image recognition camera. It supports two types of workpieces (left and right symmetrical) and two types of resin pins. The set jig can be exchanged with one touch to accommodate workpieces with different insertion shapes and dimensions of the resin pins. 【Features】 - Improvement of takt time: Achieves a series of operations in 1/2 to 2/3 of the time taken by manual work. - Quality enhancement: Prevents forgetting to insert resin pins or insertion errors. - Expandability: Automation linked with a stocker is also possible. - IoT functionality: Takt management and cost management are possible (optional). *For detailed information and product catalogs, please access the related link.

• Other machine elements

This device is designed to remove burrs from aluminum die-cast parts using a robot. The die-cast workpiece is set on a platform, and when the start button is pressed, the work table rotates half a turn within the device. The specified burrs are automatically filed down in the device, and after completion, pressing the discharge button returns the work table to its original position. It can be used in various industries that handle parts and products where burrs are generated. 【Features】 ■ Cost Reduction: Achieves a reduction in labor costs associated with burr removal. ■ Quality Improvement: Stabilizes burr removal conditions such as pressure and time, reducing quality variation. ■ Worker Health Protection: Eliminates concerns about inhaling dust generated during burr removal. ■ Expandability: Allows for tool changes for burr removal tools and automation of supply and discharge. ■ IoT Functionality: Enables management of pad and file replacements, as well as operation and cost management. *For detailed information and product catalogs, please access the related links.

• Other machine elements

This device is a coater designed to achieve advanced and delicate thin film coating necessary for the development of secondary batteries such as LCDs, optical films, LIB/LIC, and FC. It realizes non-contact drying that creates a beautiful sine curve. Three coating heads have been compactly integrated. It achieves a clean winding edge using COAST CONTROLS' EPC. 【Features】 ■ Achieves advanced and delicate thin film coating ■ Realizes non-contact drying that creates a beautiful sine curve ■ Compact design with three coating heads ■ Achieves a clean winding edge using COAST CONTROLS' EPC ■ Equipped with high-performance processing equipment from VETAPHONE as standard *For detailed information and product catalogs, please access the related links.

• Other machine elements

This IoT system links PLCs and web cameras to provide real-time live streaming, as well as abnormality notifications to supervisors during incidents and recording before and after abnormalities (dashcam function). You can check the situation on-site from anywhere, providing peace of mind. Even if an abnormality occurs, notifications are sent immediately, and records are kept. 【Features】 ■ Peace of mind as you can check the on-site situation from anywhere ■ Immediate abnormality notifications sent to the supervisor's smartphone for quick recovery ■ Video data before and after abnormalities is stored in the cloud, aiding in cause analysis and predictive maintenance ■ Various additional features can be added, such as real-time inquiries on operating hours and production quantities, and automatic Excel data generation for data analysis (optional) *For detailed information and product catalogs, please access the related links.

• Other security and surveillance systems

The "ME-200" is a manual expander that allows the wafer, which has been diced into individual chips, to be moved to an expansion ring while maintaining the gaps between the chips to prevent interference. This is done while the wafer is still attached to the tape frame. It is ideal for research and development as it allows for easy expansion of the wafer. It can also be repurposed for expanding IC substrates and other applications. 【Features】 - The amount of wafer expansion can be adjusted arbitrarily by turning the handle. - The operating temperature can be set widely up to a maximum of 100°C. - Design modifications can be made to accommodate the tape frame and expansion ring used (optional). - It is perfect for research and development due to the ease of wafer expansion. - It can also be repurposed for expanding IC substrates and other applications. *For detailed information and product catalogs, please access the related links.

• Other machine elements

The "SE-200" is a semi-auto expander that can move an IC substrate, which has been diced into individual pieces, to an expansion ring while maintaining a gap to prevent interference between the chips before picking them up. The expansion conditions for the IC substrate can be set, and the reproducibility makes it suitable for mass production. The preheating position, time, expansion amount, and speed of the IC substrate can be repeatedly reproduced, ensuring stable quality. 【Features】 ■ The preheating position, time, expansion amount, and speed of the IC substrate can be set and adjusted via a monitor. ■ The expansion amount can be repeatedly performed under pre-set conditions. ■ Design modifications can be made to match the tape frame and expansion ring used (optional). ■ A jig for accurately fitting the outer ring of the expansion ring is available (optional). *For detailed information and product catalog requests, please access the related link.

• Other machine elements

The "SMM-100" is a semi-automatic tape mounter that accurately adheres wafers and dicing tape to a tape frame. The table can be heated to ensure the appropriate temperature is applied to the wafer. It is equipped with an ionizer to prevent tape static. Additionally, as an option, rings other than the specified tape frame can be accommodated by exchanging the set plate. 【Features】 ■ The table can be heated to ensure the appropriate temperature is applied to the wafer. ■ Equipped with an ionizer to prevent tape static. ■ The application of tape and wafers is performed automatically at the set speed. ■ The thickness adjustment of the wafer can be set by raising or lowering the table height. ■ Bonding of IC substrates (fully molded) is also possible. *For detailed information or product catalogs, please access the related link.

• Other machine tools

The "RC-250" is a fully automatic ring cleaner that removes dicing tape from a ring frame after removing good chips, wipes the surface of the ring frame, cleans it, and stacks it in the collection area in an aligned manner. By automating the auxiliary task of tape removal, significant labor savings are achieved, and compared to manual work, the frequency of handling organic solvents is greatly reduced, making it effective for safety and hygiene. 【Features】 - After setting the cassette and turning on the switch, it automatically performs tape removal, cleaning, and storage. - Automatically handles phase alignment, warpage detection, and alignment of the ring frame. - Allows for the setting of optimal cleaning conditions based on the tape used. - The removed dicing tape is stored in a dedicated box and can be withdrawn from the back of the device for disposal. *For detailed information and product catalogs, please access the related links.

• Other machine elements

The "KT-100" is a cover tape mounting machine that automatically applies mold tape to the back of lead frames. The reel-shaped mold tape is half-cut to a specified length and then accurately affixed to the back of the lead frame. The tape length can be arbitrarily adjusted to match the lead frame. It can also be repurposed for covers of IC substrates, electronic components, and electronic devices. 【Features】 ■ Half-cutting of mold tape is performed using a dedicated mold ■ The application temperature can be widely set up to a maximum of 100°C ■ Design modifications can be made to accommodate the lead frame and mold tape used (optional) *For detailed information and product catalogs, please access the related links.

• Other machine tools

The "SCO-150S" is a coring device that extracts a core (cylindrical shape) from semiconductor compound ingots. The setup and alignment of the ingot (workpiece) are done manually, and the cutting fluid is circulated from the coolant tank for cooling and cleaning. Additionally, as an option, various sensors can be added in conjunction with an IoT system to perform data sensing, enabling maintenance management and quality improvement. 【Features】 ■ Extracts a core (cylindrical shape) from semiconductor compound ingots ■ Manual setup and alignment of the ingot (workpiece) ■ Cooling and cleaning are performed by circulating cutting fluid from the coolant tank *For detailed information or product catalogs, please access the related link.

• Grinding Machine
• Other machine tools

The "SCY-200" is a cylindrical grinding machine that automatically performs the grinding of the core (cylindrical) circumference of semiconductor compounds to specified dimensions and carries out the oriflap processing. The cutting fluid is circulated through a coolant tank for cooling and cleaning. Additionally, by integrating with an IoT system and adding various sensors for data sensing, it enables maintenance management and quality improvement. 【Features】 ■ Automatically grinds the core circumference of semiconductor compounds to specified dimensions and performs oriflap processing ■ Core (workpiece) setup and alignment can be done manually or with a set cart ■ Fully automated from core position correction to grinding, crystal orientation detection, and oriflap processing ■ Cutting fluid is circulated through a coolant tank for cooling and cleaning *For detailed information and product catalogs, please access the related links.

• Grinding Machine
• Other cutting tools

The "SBC-150S" is a peripheral blade cutting device that cuts and shapes the ends of ingots and cores made of semiconductor compounds. The setup and alignment of the ingot (workpiece) are done manually, and the ends of the ingot are cut with a peripheral blade (diamond blade). By adding various sensors linked to an IoT system and performing data sensing, maintenance management and quality improvement are possible. 【Features】 ■ Cuts and shapes the ends of ingots and cores made of semiconductor compounds ■ Manual setup and alignment of the ingot (workpiece) ■ Cuts the ends of the ingot with a peripheral blade (diamond blade) ■ The cutting fluid is circulated from the coolant tank for cooling and cleaning *For detailed information and product catalogs, please access the related links.

• Other cutting tools
• Plastic processing machines (cutting and rolling)
• Other processing machines

The "SCC-150S" is an end-face cutting and grinding device that cuts and shapes the ends of semiconductor compound ingots and cores. It is equipped with grinding heads for both peripheral blades and grinding wheels. By adding various sensors linked to an IoT system for data sensing, it enables maintenance management and quality improvement. 【Features】 ■ Cuts and shapes the ends of semiconductor compound ingots and cores ■ Equipped with grinding heads for both peripheral blades and grinding wheels ■ Manual setup and alignment of ingots (workpieces) ■ Cuts the ends of ingots with a peripheral blade (diamond blade) ■ Cooling and cleaning are performed by circulating cutting fluid from a coolant tank *For detailed information and product catalogs, please access the related links.

• Grinding Machine
• Other cutting tools

This document is a "Corporate Catalog" that introduces: - The range of products offered by our company - Company overview [Contents] ■ "Utilizing robots" for productivity improvement and prototype development ■ "Growth-type IoT" linked with automation systems ■ "Design and manufacturing of KOTA" from development to production machines ■ Examples of automation systems designed and manufactured so far ■ The process leading to the introduction of "automation of production operations" *For detailed information or to request the corporate catalog, please access the related link.

• Other industrial robots
• Contract manufacturing