ラップジャパン List of Products and Services

The "LTP-250" is a product that allows for vacuum degassing during wax application. It enables the uniformity and thinning of the wax film. By applying the wax in a vacuum state, it is possible to degas bubbles contained in the wax and air that may have been trapped during the application of warped wafers. 【Effects of the application process】 ■ Improved parallelism of the workpiece ■ Enhanced flatness of the polished surface ■ Uniformity of the wax film thickness ■ Thinning of the film ■ Improvement of film distortion *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• others

The "LJ-24-STD" is a stationary lapping machine that maintains ultra-precise accuracy and enables stable processing. If the workpiece lacks sufficient weight, it is possible to apply lapping pressure using an air cylinder for efficient processing of the lapping material. The drip-type abrasive tank drips the abrasive liquid from the bottom of the tank, preventing sedimentation and solidification. Additionally, the forced drive of the correction ring assists in the stable rotation of the workpiece. 【Features】 ■ Ability to apply lapping pressure using an air cylinder ■ Efficient cooling of the lapping plate ■ Prevention of sedimentation and solidification with a timed drip abrasive tank ■ Assistance in stable rotation of the workpiece with forced drive of the correction ring ■ Prevention of surface distortion of the lapping plate due to heat during processing ■ Maintenance of the flatness of the lapping plate at all times *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other processing machines

The LGP-612 is a product that supports the development of high-precision technology equipped with a dual polishing head compatible with wafers ranging from φ4" to φ8". The polishing plate uses ultra-flat alumina ceramics. The polishing head features a mechanism that allows for one-touch replacement, and by employing a low-friction cylinder, it enhances pressure responsiveness. 【Features】 ■ Achieves high-precision polishing with a spindle designed for increased rigidity that can withstand uneven loading ■ The polishing plate uses ultra-flat alumina ceramics ■ Adopts high-precision, high-rigidity LM guides to reduce vibrations, which are uncertain factors during processing ■ Allows for individual input of "pressure" and "rotation speed" for both axes (heads) ■ Supports complex polishing recipes *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other processing machines

The "LJ-24-PD3" is a product designed for ultra-flat and high surface roughness processing, allowing for rough finishing, medium finishing, and ultra-mirror finishing by changing the material of the lapping plate. With the variable speed control knob, it is possible to adjust the rotation speed during the lapping process. The load on the workpiece is managed by a lifting unit that automatically raises and lowers a dead weight, reducing the burden on the operator. A PLC sequencer is used for control, accommodating customization for each customer. 【Features】 - Reduces the burden on the operator - Implements safety measures to prevent hand pinching - Allows for millimeter-level position adjustments even during processing - Enables free adjustment of the workpiece's rotational and orbital speeds - Additional expansion functions can be added even after the device is installed, thanks to the 32-bit I/O *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other processing machines

The LGP-712 is a product that supports the development of high-precision technology for wafers ranging from φ8" to φ12". It is equipped with two polishing heads to accommodate device flattening CMP. It is also suitable as an experimental machine for the research and development of pads and slurries. Our company offers many options to meet customer needs, including support for metal CMP such as Cu-CMP. 【Features】 ■ Capable of ultra-precision polishing ■ Equipped with two polishing heads to accommodate device flattening CMP ■ Supports metal CMP such as Cu-CMP ■ Also suitable as an experimental machine for research and development *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other processing machines

The "LJ-15-D2 model" is a versatile tabletop wrapping machine. Regardless of the processing volume, it achieves high levels of flatness and surface roughness. Additionally, the correction ring is equipped with a forced drive motor, ensuring stable rotation. Furthermore, the wrapping plate can be freely adjusted in rotation during processing due to inverter control. 【Main Specifications】 ■ Wrapping Plate Diameter: Φ380mm ■ Correction Ring Diameter: Outer Diameter Φ178mm × Inner Diameter Φ138mm ■ Correction Ring Drive Mechanism: 2-axis ■ Control Method: Relay Sequence Circuit ■ Wrapping Plate Rotation Control: Variable Speed Inverter, etc. *For more details, please download the PDF or feel free to contact us.

• Wafer processing/polishing equipment
• Other processing machines

The "LJ-36 type" is a precision single-sided lapping machine equipped with a high-pressure cylinder designed for high rigidity and three axes. It is available in two types: the "Open Type," suitable for workpieces that have sufficient weight to provide adequate lapping pressure by their own weight, or when a limited amount of lapping pressure is required, and the "Pneumatic Lift Type," which is suitable for efficiently processing a large number of relatively small parts with added lapping pressure. 【Lineup】 ■ Open Type 'LJ-36-O' ■ Pneumatic Lift Type 'LJ-36-P' *For more details, please download the PDF or feel free to contact us.

• Wafer processing/polishing equipment
• Other processing machines

The "LJ-48-OD3" is a practical general-purpose lapping machine that incorporates unique mechanisms throughout to maintain stable high precision. Regardless of the size of the parts, whether large or small, and regardless of the amount of processing, it achieves a micron-level polished surface finish in either semi-automatic or fully automatic mode. 【Features】 ■ High precision and high rigidity bearings ■ Lapping plate ■ PLC sequencer control ■ Forced drive operation ■ Oscillation drive (sway) *For more details, please download the PDF or feel free to contact us.

• Wafer processing/polishing equipment
• Other processing machines