ウィンゴーテクノロジー Product Lineup

"Low-temperature film-forming low thermal expansion polyimide" can be film-formed at lower temperatures than conventional polyimides, which reduces thermal stress and allows for use similar to that of epoxy and other materials. It achieves high production efficiency and labor-saving, making it suitable for applications such as interlayer insulating films (for semiconductor devices, multilayer printed wiring boards, and package substrates). [Features] - Thermal expansion coefficient graded from 2 to 20 ppm/K (can be matched to the thermal expansion coefficients of various substrates) - Varnish can be stored at room temperature *For more details, please download the PDF or feel free to contact us.

• Other polymer materials

"Diamine compounds" are products developed for use in resins such as polyimides, polyamides, and polyurethanes, as well as for epoxy resin curing agents. They have a rigid molecular structure and exhibit high solubility in organic solvents. They can be applied as raw materials for new materials with excellent properties such as high heat resistance, low thermal expansion, and low water absorption. [Features] - Achieves a soluble polyimide that is rigid - Achieves a polyimide with good dimensional stability and a melting point *For more details, please download the PDF or feel free to contact us.

• Other polymer materials