ウィンゴーテクノロジー Product Lineup

The low dielectric polyimide developed by our company is a high-performance material designed for high-speed communication and high-frequency devices. Compared to general polyimides, it achieves low dielectric constant and low dielectric loss tangent, while also possessing high heat resistance and low moisture absorption. It significantly reduces the loss of high-frequency signals and improves communication performance. Even in high-temperature environments, it maintains excellent dimensional stability and reliability, suppressing degradation of properties due to humidity changes. 【Features】 ■ Low dielectric constant and low dielectric loss tangent ■ High heat resistance ■ Low moisture absorption ■ High adhesion *For more details, please download the PDF or feel free to contact us.

• Other polymer materials

The "Next Generation LIB Binder" is an electrode binder developed to achieve high performance in lithium-ion batteries. As the demand for higher capacity, higher output, and rapid charging in lithium-ion batteries increases, this binder was created to meet these needs. It fulfills performance requirements that cannot be met by conventional materials such as PVDF or CMC/SBR. Materials like polyimide-based binders and water-based polymers achieve high performance and durability that were not possible with standard products. It firmly supports the high performance required for next-generation batteries. 【Features】 ■ High adhesion ■ Excellent heat resistance ■ Improved flexibility ■ Environmentally friendly design *For more details, please download the PDF or feel free to contact us.

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Transparent polyimide is a high-performance resin that achieves high light transmittance with less coloration compared to conventional polyimides. Conventional polyimides have a yellow to brown hue, which has limited their use in optical applications. This resin significantly improves transmittance in the visible light range through molecular design and raw material structure innovations. Furthermore, it possesses excellent heat resistance, mechanical strength, and chemical stability, making it highly anticipated as an electronic material and optical component. 【Features】 ■ High transparency ■ Low thermal expansion ■ High glass transition temperature (Tg) ■ Excellent flexibility ■ Low-temperature process compatibility (<250°C) *For more details, please download the PDF or feel free to contact us.

• Other polymer materials

The "WGv-2400/2500 series" is a product that can form a film at low temperatures. It can be matched to the thermal expansion coefficients of various substrates, accommodating a wide range of materials. It also offers ease of handling, such as the ability to store the varnish at room temperature. Please feel free to contact us when you need assistance. 【Features】 ■ Achieves lower temperature film formation and lower thermal expansion coefficients ■ Reduces thermal stress, allowing for use similar to epoxy and other materials ■ Enables high production efficiency and labor-saving ■ Grades thermal expansion coefficients from 2 to 20 ppm/K ■ Allows for room temperature storage of varnish *For more details, please download the PDF or feel free to contact us.

• Other polymer materials

"TADBHQ" is a novel ester-type anhydride that suppresses interchain CTC due to its aromatic ester structure positioned at the center of the main chain, achieving high transparency and low coloration. By introducing tert-butyl (t-Bu) substitution, it improves the solubility and processability of polyimide resins (compatible with high varnish concentrations). While it slightly lowers the Tg (glass transition temperature), it allows for improvements in thermoplasticity and ductility. Additionally, it is easy to achieve low water absorption and low dielectric constant, and it excels in low CTE (low thermal expansion) design as well as adhesion and composite suitability. 【Features】 ■ Suppresses interchain CTC, achieving high transparency and low coloration ■ Improves the solubility and processability of polyimide resins (compatible with high varnish concentrations) ■ Allows for improvements in thermoplasticity and ductility ■ Easy to achieve low water absorption and low dielectric constant ■ Excels in low CTE design and adhesion/composite suitability *For more details, please download the PDF or feel free to contact us.

• Other polymer materials

The ether-type aromatic diamine compound for low dielectric polyimides is designed for high-performance polyimide and polyester imide materials. It features a unique structure with a rigid aromatic backbone, α,α-dimethylbenzyl substituents, and para-aminophenyl end groups. This achieves an excellent balance of heat resistance and molecular flexibility. Additionally, it has balanced mechanical strength with excellent ductility and crack resistance. 【Features】 ■ Achieves high Tg ■ High transparency ■ Excellent molecular flexibility ■ Low water absorption ■ Low dielectric constant (Low-k) ■ Excellent mechanical properties *For more details, please download the PDF or feel free to contact us.

• Other polymer materials

"TBBAAB" is an ester-type diamine compound with a tert-butyl (t-Bu) group introduced in the second position. It features an aromatic skeleton with an ester bond in the center and amino groups at both ends, providing a structure suitable for polyimide polymerization. The rigid aromatic skeleton maintains a high glass transition temperature while improving thermoplasticity and processability. The t-Bu group introduces significant steric hindrance, suppressing the formation of intermolecular charge transfer complexes (CTC) and contributing to improved visible light transmittance. The combination of hydrophobicity and ester bonds also achieves low water absorption. **Features** - Maintains a high glass transition temperature while improving thermoplasticity and processability - Suppresses the formation of intermolecular CTC, reducing the coloring of polyimides - Achieves low water absorption through the combination of the hydrophobic t-Bu group and ester bonds - Facilitates the achievement of low dielectric constant through CTC suppression design *For more details, please download the PDF or feel free to contact us.*

• Other polymer materials

"PHBAAB" is a compound developed with the aim of improving heat resistance, low thermal expansion, and low dielectric properties. It achieves a high Tg due to its rigid aromatic framework while suppressing the formation of intermolecular CTC (charge transfer complexes) through the steric hindrance effect of the phenyl groups. The ester bonds and the hydrophobicity of the phenyl groups are expected to result in low water absorption. Additionally, by partially disrupting the planarity of the molecule through aromatic ester bonds and phenyl substitution, it suppresses the coloring of polyimide and improves visible light transmittance. It is suitable for transparent polyimide and display applications. [Features] ■ Achieves high Tg due to a rigid aromatic framework ■ Suppresses the formation of intermolecular CTC through the steric hindrance effect of phenyl groups ■ Expected low water absorption due to ester bonds and the hydrophobicity of phenyl groups ■ Suppresses the coloring of polyimide and improves visible light transmittance *For more details, please download the PDF or feel free to contact us.

• Other polymer materials

"Low-temperature film-forming low thermal expansion polyimide" can be film-formed at lower temperatures than conventional polyimides, which reduces thermal stress and allows for use similar to that of epoxy and other materials. It achieves high production efficiency and labor-saving, making it suitable for applications such as interlayer insulating films (for semiconductor devices, multilayer printed wiring boards, and package substrates). [Features] - Thermal expansion coefficient graded from 2 to 20 ppm/K (can be matched to the thermal expansion coefficients of various substrates) - Varnish can be stored at room temperature *For more details, please download the PDF or feel free to contact us.

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"Diamine compounds" are products developed for use in resins such as polyimides, polyamides, and polyurethanes, as well as for epoxy resin curing agents. They have a rigid molecular structure and exhibit high solubility in organic solvents. They can be applied as raw materials for new materials with excellent properties such as high heat resistance, low thermal expansion, and low water absorption. [Features] - Achieves a soluble polyimide that is rigid - Achieves a polyimide with good dimensional stability and a melting point *For more details, please download the PDF or feel free to contact us.

• Other polymer materials