Woyton Technologies List of Products and Services

The "Non-contact 3D Measurement System" offers a wide range of models, from those covering 150mm in the XY direction to models with a maximum movement range of 600mm, providing a broad scanning area. Do you have concerns such as "measurement takes too long," "dissatisfaction with accuracy," or "inability to automate"? The measurement speed is among the best in the industry, and there are models with a rotating stage that can measure the profiles of round parts. You can experience the features of this system through a demonstration unit. 【Features】 ■ Satisfactory inspection speed and accuracy ■ Easy operation ■ The L-CHR sensor is a good choice for speed and accuracy requirements ■ Achieves sub-micron accuracy in both vertical and horizontal measurements without issues ■ The L-CHR sensor has established its position as a standard in semiconductor back-end processes *For more details, please refer to the PDF materials or feel free to contact us.

• Other electronic measuring instruments
• Other measurement, recording and measuring instruments
• Software (middle, driver, security, etc.)

We handle the packaging process systems from Besi. With a modular-based equipment and a common software platform, it is also possible to design manufacturing lines that transcend category boundaries. We have suitable proposals for the packaging process design that our customers desire. 【Three Categories】 ■ Molding Equipment ■ Trim and Form Equipment ■ Cutting Equipment *For more details, please download the PDF or contact us.

• Wafer processing/polishing equipment
• Molding Equipment
• Other semiconductor manufacturing equipment

We handle the die attach systems from Besi. To meet the ever-evolving semiconductor applications, we continue to evolve with advanced technology. Please feel free to contact us if you have any requests. 【Four Categories】 ■ Multi-Module Bonder ■ Epoxy Die Bonder ■ Soft Solder Die Bonder ■ Flip Chip Bonder *For more details, please download the PDF or contact us.

• Other semiconductor manufacturing equipment
• Bonding Equipment