いおう化学研究所 Product Lineup

Our company specializes in the bonding of dissimilar materials using molecular adhesives. One of the features of these compounds, known as molecular adhesives, is that they connect materials through chemical bonds, allowing for sufficient adhesion even when the material surfaces are flat. Additionally, even if the materials being bonded are different, the surfaces can be treated to have the properties of the molecular adhesive, making it possible to bond difficult-to-adhere materials. Please feel free to consult us if you have any requests. 【Features of Molecular Bonding Technology】 ■ Bonding of dissimilar materials ■ Adhesion even with flat surfaces *For more details, please download the PDF or feel free to contact us.

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Our company specializes in the bonding of smooth copper foil and low dielectric materials. This is suitable for high-frequency substrates required in the ICT market and can be adapted to low dielectric resins (such as LCP and PPE). Please feel free to consult us if you have any requests. 【Features】 ■ Bonding of smooth copper foil is possible → Reduction of conductor loss ■ Bonding with low dielectric materials is possible → Reduction of dielectric loss ■ Bonding through chemical bonding → Improved heat resistance and durability *For more details, please download the PDF or feel free to contact us.

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We offer a "light-reactive molecular adhesive" that allows for partial bonding through photolithography. It is compatible with the MB-1013 ethanol solution (development product) and can be applied, for example, in primers and selective plating. Please feel free to consult us if you have any requests. 【Features】 ■ Organic functional group Y chemically bonds with organic materials upon UV irradiation 　⇒ The surface of the organic material is terminated with functional group X without heating 　⇒ Partial bonding is possible through photolithography *For more details, please download the PDF or feel free to contact us.

• Chemicals
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• Organic Natural Materials