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千代田光機

addressTokyo/Hachioji-shi/4-1-3 Seninmachi
phone042-667-1371
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last updated:Apr 02, 2025
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千代田光機 Product Lineup

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Microscope unit Microscope unit
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Microscope

Microscope unit

Microscope unit

Microscope Unit "CMX Series"

Wide spectral coverage from visible to shortwave infrared. Perfect for wafer surface and internal inspection. On display at Image Sensing Expo and SEMICON Japan.

The "CMX Series" is a microscope unit specifically designed for embedded devices in factory automation (FA). It features built-in coaxial illumination, allowing for high-resolution imaging even on mirror-like workpieces. Additionally, it is a high-end microscope objective lens unit that uses infinity-corrected objective lenses, and it is compatible with objective lenses from various manufacturers. 【Features】 ■ Achieves realistic microscope images with high NA objective lenses ■ Supports sensor sizes up to 1.1" (C-mount, image circle φ20mm) ■ Applicable wavelength range: visible light to short-wave infrared [SWIR] (400nm to 1700nm) ■ Equipped with a back focus adjustment mechanism (adjustment range ±2.5) *For more details, please refer to the related links or feel free to contact us.

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Compact Microscope Unit CMX05 Series

It is a compact microscope unit specialized for FA (Failure Analysis) equipment integration!

This is a compact microscope unit specialized for various precision inspections and precise measurements for FA (Factory Automation) applications. It has a lens magnification of 0.5X and is compatible with large sensors of 1.1.

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Compact Microscope Unit CMX10 Series

It is a compact microscope unit specialized for device integration in FA!

This is a compact microscope unit specialized for various precision inspections and precise measurements for FA (Factory Automation) applications. It has a lens magnification of 1.0X and is compatible with large sensors of 1.1.

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CMX Series for Semiconductor Testing

A microscope unit suitable for exterior and interior inspection of wafers in FA applications.

In the semiconductor industry, the inspection process involves detecting minute defects and foreign substances on wafers, which is a critical issue that affects product quality and yield. Particularly, as manufacturing processes become more advanced, there is a demand for inspections with higher precision. The CMX series supports a wide range of wavelengths from visible light to short-wave infrared, enabling high-precision image acquisition for both external and internal inspections of wafers. 【Application Scenarios】 - External inspection of wafers - Foreign substance inspection inside wafers - Quality control of semiconductor devices 【Benefits of Implementation】 - Improved quality through high-precision inspections - Enhanced yield - Reduced inspection time

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CMX Series for Precision Machinery

FA microscope unit to improve positioning accuracy.

In the precision machinery industry, high-precision positioning is required for positioning tasks. Particularly in the assembly and inspection processes, even slight misalignments can significantly impact product quality. Traditional visual positioning relies on the experience and skills of the operator, leading to issues such as variations in accuracy and increased work time. The CMX series supports high-precision positioning through high NA objective lenses and a back focus adjustment mechanism. 【Application Scenarios】 - Positioning of precision machine parts - Alignment of parts in the assembly process - Foreign object detection in the inspection process 【Benefits of Implementation】 - Improved positioning accuracy - Reduced work time - Stabilization of quality

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CMX Series for Electronic Component Mounting

A microscope unit suitable for exterior and interior inspection of wafers for FA (Factory Automation).

In the field of electronic component mounting, accuracy and reliability of the mounting process are essential for consistently supplying high-quality products. Particularly in the mounting of fine components, misalignment and contamination can lead to product defects. The CMX series enables high-precision image acquisition for the inspection of both the exterior and interior of wafers, contributing to the improvement of the quality of the mounting process. 【Usage Scenarios】 - Inspection in the electronic component mounting process - Exterior inspection of wafers - Quality inspection of components after mounting 【Benefits of Implementation】 - Early detection of mounting defects - Improvement in quality control - Enhancement of yield

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