新生電子 Product Lineup

We would like to introduce our "Parts Processing Technology." With the equipment we have in our own factory, we are capable of press and molding processing, allowing for integrated production up to insert molding. This enables us to reduce the necessary processing steps for manufacturing and shorten processing time. By designing and processing the molds and jigs used in production in-house, we can provide proposals aimed at achieving more efficient product processes from the customer's product development stage. 【Features】 ■ Technical collaboration and support system with domestic and overseas bases ■ Processes that cannot be handled in-house can be processed by partner companies ■ A system has been established to accommodate a wide range of needs ■ Our in-house technical department can devise, design, and manufacture rationalization equipment ■ We can also manufacture electrical inspection machines according to product specifications and install them on the line *For more details, please refer to the related links or feel free to contact us.

• Processing Contract

We would like to introduce our "Implementation and Assembly Manufacturing Technology." In terms of mounting substrates, we have experience with flexible substrates, glass-epoxy substrates, ceramic substrates, and others, ranging from small to large sizes. For mounted components, we can accommodate everything from microchips to large connectors and bottom electrode components. We carry out assembly work using our internally manufactured substrates and components supplied by customers, producing with consideration for product characteristics, production time, and quantity through cell production, partial cells, and line production. 【Supported Substrate Sizes (M and L Sizes)】 ■ Supported substrate sizes: 50mm x 50mm (MIN) to 510mm x 380mm (MAX) ■ Substrate thickness: 0.4mm and above (FPC is supported with pallet transport) *For more details, please refer to the related links or feel free to contact us.

• Contract manufacturing

We offer "software development" services. We work together with our clients to consider their requests (specifying requirements) and provide software to realize their ideas. By collaborating with hardware design, we can develop solutions that take into account cost, schedule, and performance. Please feel free to contact us with your requests. 【Technologies We Possess (Partial)】 ■SoC/Microcontrollers - NXP: i.MX5/6 series - Renesas: RZ/A1, SH series, RL78, RX series Synergy - NVIDIA: Jetson - Intel-based *For more details, please refer to the related links or feel free to contact us.

• Embedded system design service

We offer "mechanical design" that provides designs in line with product concepts. From conceptual consideration to detailed design, we design while taking into account quality, cost, availability, and assembly. We can handle everything from resin parts, sheet metal parts, and machined parts to transportation packaging design for mass production. Additionally, by utilizing 3D printers, we can shorten development time and reduce development/manufacturing costs. 【Technologies We Possess (Partial)】 ■3D CAD - Solid Works: DASSAULT SYSTEMES - CATIA V5: DASSAULT SYSTEMES ■2D CAD - AutoCAD LT: Autodesk *For more details, please refer to the related links or feel free to contact us.

• Mechanical Design

We offer "PCB design" that can accommodate the analysis of transmission lines (SI) necessary for high-frequency substrates, which are in high demand, as well as power and ground plane resonance (PI) analysis. To meet the various needs of our customers, we propose suitable layer configurations and design rules, providing high-quality products backed by solid achievements and corresponding design and technical capabilities. Please feel free to contact us with your requests. 【Analysis Achievements】 ■ Transmission line (SI) analysis necessary for high-frequency substrates ■ Power and ground plane resonance (PI) analysis *For more details, please refer to the related links or feel free to contact us.

• Circuit board design and manufacturing

Our company offers "circuit design" services that propose design and development plans tailored to customer requirements, starting from specification meetings. We are capable of designing and developing platform boards equipped with various CPUs, as well as embedded boards such as microcontrollers. Additionally, in printed circuit board design, we support various simulations and can conduct verification and reliability testing. 【Technologies We Possess: Design】 ■ Digital circuit design using Cortex-A series SoCs ■ Circuit design for high-speed transmission boards using DDR4-SDRAM, etc. ■ Design of products using lithium-ion batteries/nickel-metal hydride batteries ■ Extensive experience with storage solutions such as SSDs, CFast, eMMC, etc. ■ Design of IoT devices and contactless chargers ■ Design of contactless chargers *For more details, please refer to the related links or feel free to contact us.

• Embedded system design service