LC Product Lineup

The "Sheet-type Spin Cleaning Device" can be equipped with ultrasonic spray nozzles, two-fluid spray nozzles, high-pressure jet nozzles, ozone water, and more, allowing for processing tailored to specific applications. It accommodates work sizes from 2-inch to 12-inch wafers. It can also handle square substrates up to 500mm on a side (consultation required). The device can be configured with process modules for acidic, alkaline, and organic solutions. 【Features】 ■ Versatile chamber configurations to meet various process needs ■ Compatible with work sizes from 2-inch to 12-inch wafers ■ Can also accommodate square substrates up to 500mm on a side (consultation required) ■ Configurable with process modules for acidic, alkaline, and organic solutions *For more details, please download the PDF or feel free to contact us.

We would like to introduce the "Resist Coater" that we handle. We can also accommodate manual specifications upon request. The work sizes supported are Φ2" to 12" wafers and 100□ to 320□ mm square substrates. The work materials include Si, SiC, GaN, GaAs, InP, LT/LN, ceramics, quartz, resin, glass, etc. The viscosity of the coating material ranges from 100CP to 8,000CP. 【Specifications (partial)】 ■ Work transport: Multi-joint clean robot with backside suction method ■ Two-stage cup (upper stage: resist, lower stage: rinse) ■ Resist liquid: Photoresist, polyimide-based (can accommodate built-in canisters) ■ Bake: 90℃ to 120℃ ±1℃ (proximity/contact selection) ■ Cool plate: 10℃ to 25℃ (proximity/contact selection) *For more details, please download the PDF or feel free to contact us.

We would like to introduce the "Sheet-Type Spin Developer" that we handle. By simply setting the cassette in the loader, the clean robot automatically transports the workpiece and processes each step automatically. For developing large substrates, we recommend the coating method. In the manual type, the workpiece can be manually set in the chuck, and similar developing, rinsing, and spin-drying processes can be performed. 【Specifications (partial)】 ■ Work Material - Si, SiC, GaN, GaAs, InP, LT/LN, ceramics, quartz, resin, glass, etc. ■ Developer: TMAH, Na2CO3, cyclopentane (independent chamber) ■ Rinse Liquid: DIW, PGMEA, etc. ■ Back Rinse: PGMEA, etc. ■ Coating Method: Shower or nozzle *For more details, please download the PDF or feel free to contact us.

We would like to introduce the "Sheet-type Spin Cleaning Device" that we handle. The work size ranges from Φ2" to 12" wafers or square substrates (up to a maximum of 600mm□). No setup changes are required for size adjustments. In the automatic type, when the cassette is set in the loader, the clean robot transports the workpiece and automatically performs chemical treatment, rinsing, and spin drying. In the manual type, the workpiece can be manually set in the chuck, and the same processes can be carried out. 【Specifications (partial)】 ■ Work materials - Si, SiC, GaN, GaAs, InP, LT/LN, ceramics, quartz, resin, glass, SUS plates, etc. ■ Chemical tanks: Chemical supply tanks and waste liquid tanks can be built into both sides of the main unit. ■ PVA disk brush can be installed. *For more details, please download the PDF or feel free to contact us.

We would like to introduce the "Sheet-Type Resist Stripping Device" that we handle. By simply setting a FOUP or dedicated cassette on the load port, the clean robot automatically transports the workpieces. It is also capable of manufacturing manual development devices. The work materials supported include Si, SiC, GaN, GaAs, InP, ceramics, quartz, resin, glass, SUS plates, and more. 【Specifications (partial)】 ■ Two-stage cup (upper stage: resist, lower stage: rinse) ■ Stripping solution: DMSO/TMAH, polyimide, etc. (independent chamber) ■ Rinse solution: polyimide, etc. ■ Back rinse: DIW, polyimide, reusable liquid, etc. ■ Stripping and rinse solution supply and recovery tank can be built into the device *For more details, please download the PDF or feel free to contact us.

We would like to introduce the "Multi-Chamber Wafer Cleaning System" that we handle. The carrierless type supports 6-inch, 8-inch, and 12-inch wafers. With carrierless transport, it accommodates high-purity cleaning such as pre-deposition cleaning, and offers a lineup of 50, 25, and 13 wafers per batch. Equipped with loaders and unloaders compatible with cassettes or FOUPs, it allows for device configurations for processing with acidic, alkaline, and organic chemical solutions. Drying options include IPA drying, hot water lift & IR drying, and Marangoni drying. 【Features (Carrier Type)】 ■ Work sizes support wafers from 2 inches to 12 inches. ■ The number of transport cassettes per batch can be selected from 1 or 2 cassettes. ■ Device configurations for processing with acidic, alkaline, and organic chemical solutions are possible. ■ Drying options include spin dryer and IPA drying. ■ The number of cassettes for loaders and unloaders can be customized according to your needs. *For more details, please download the PDF or feel free to contact us.

We would like to introduce the "Chemical Liquid Scrub Cleaning Device" that we handle. It accommodates work sizes from Φ2" to 12" wafers and square substrates (up to a maximum of 600mm□), and there is no need for setup changes when switching sizes. The work materials include Si, SiC, GaN, GaAs, InP, LT/LN, ceramics, quartz, resin, glass, etc. It is equipped with an automatic correction function that controls the pressing force in 0.1mm increments according to brush wear, and the brush is automatically cleaned before each scrub cleaning. Chemical supply tanks and waste liquid tanks can be built into both sides of the main unit. 【Processing Configuration】 ■ Scrub Cleaning: Surface scrub cleaning with PVA brushes (detergent and pure water cleaning) ■ Spin Cleaning: Two-fluid cleaning, SPM/DHF/SC-1 chemical cleaning (selectable) ■ Rinse Cleaning: MS shower, O3 cleaning (optional) ■ Backside Cleaning: Pure water cleaning ■ Drying: N2 blow drying *For more details, please download the PDF or feel free to contact us.

We would like to introduce the "Dual-Sided Scrub Cleaning Device" that we handle. This device performs scrub cleaning on both sides of the workpiece using detergent and pure water after polishing. Following this, a complex cleaning process is carried out, including two-fluid cleaning, acid and alkali chemical cleaning, and megasonic shower cleaning, with spin drying as the final step. The device accommodates work sizes from Φ2" to 12" wafers and 100 to 320□mm, with no need for setup changes when switching sizes. It offers the option of horizontal dual-sided scrub cleaning or vertical cleaning. 【Device Configuration】 ■ Loader: Immersion tank (Dry-in compatible) ■ Scrub Cleaning: Dual-sided scrub cleaning with PVA or nylon brushes (detergent and pure water cleaning) ■ Spin Cleaning: Two-fluid cleaning, DHF/SC-1/SPM cleaning (optional) ■ Rinse: MS shower, O3 cleaning ■ Back Rinse: DIW cleaning ■ Drying: N2 spin drying ■ Unloader: 1-2 cassettes or FOUP *For more details, please download the PDF or feel free to contact us.

We would like to introduce our "Large Substrate (Panel Level, Square Substrate) Development Equipment." By simply setting a FOUP or dedicated cassette in the load port, a clean robot automatically transports the workpiece and performs a series of processes including development, rinsing, and spin drying. We can also accommodate the production of manual development equipment. The workpiece sizes supported are 300x300mm, 510x515mm, and 600x600mm. The materials compatible with the workpieces include Si, resin, glass, SUS plates, etc., and it is possible to integrate the development liquid supply unit within the equipment (canister or poly tank). 【Specifications (partial)】 ■ Development liquid: TMAH, Na2CO3, cyclopentane, etc. (independent chamber) ■ Rinse liquid: DIW, PGMEA, etc. ■ Back rinse: PGMEA, etc. ■ Application method: Shower or nozzle ■ Bake: 90℃ to 120℃ ±1℃ ■ Cool plate: 10℃ to 25℃ *For more details, please download the PDF or feel free to contact us.