Electronic Components and Semiconductors

SPUTTERCORE CO.,LTD.

Establishment25/Dec/2025
capital1000Ten thousand
addressOsaka/Yodogawa-ku, Osaka-shi/Room 707, 2nd Shin-Osaka Building, 6-3-32 Nishi-Nakajima
phone06-6732-9818
last updated：

SPUTTERCORE CO.,LTD. Product Lineup

1～10 item / All 10 items

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C18150(Cu) backing plate

Used as a backing plate, alloy material with hardness ≧ 1/2H!

■ Purity > 98.0% ■ Density (8.9 g/cm³) ■ Manufacturing method: Vacuum melting method * For more details, please download the PDF or feel free to contact us.

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C18200(Cu) backing plate

Used as a backing plate, alloy material with hardness ≧ 1/2H!

■ Purity: 99.97% ■ Density (8.9 g/cm³) ■ Manufacturing method: Vacuum melting method *For more details, please download the PDF or feel free to contact us.

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Aluminum Silicon (Al-Si) Target [Alloy Target]

In adjustment.

For more details, please download the PDF or feel free to contact us.

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Aluminum Titanium (Al-Ti) Target

Aluminum Titanium (Al-Ti) Target

■Al, Ti ratio tolerance:+/-0.3wt% ■Segment difference possible ■Surface finish<Ra1.6a ■No scars, no broken edges *For more details, please download the PDF or feel free to contact us.

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Aluminum Neodymium (Al-Nd) Target

Aluminum neodymium materials suitable for wiring of flat panel displays, magnetic recording media, and magnetic sensors.

■ Purity: 99.95% ■ Density (2.72 g/cm³) ■ Usable AlNd ratios (wt%): 90:10; 94:6; 98:2, etc. ■ Manufacturing method: Vacuum melting method *For more details, please download the PDF or feel free to contact us.*

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Tungsten Titanium (W-Ti) Target

Tungsten-titanium materials that can be used as diffusion barriers and adhesives for metal wiring in microchip gate circuits.

■ Purity: 99.95% ■ Density (19.3 g/cm³) ■ Manufacturing Method: Powder metallurgy *For more details, please download the PDF or feel free to contact us.*

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Nickel-Vanadium (NiV) Target

Contributing to the manufacturing of integrated circuits (ICs) and the semiconductor and microelectronics industry! Nickel-vanadium materials capable of depositing high-quality thin films.

■ Purity: 99.5% ~ 99.9% ■ Density (8.4 g/cm³) ■ Manufacturing method: Vacuum melting method *For more details, please download the PDF or feel free to contact us.

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Nickel-chromium (NiCr) target

Nickel-chromium that can be used for thin film formation, microelectronics manufacturing, Low-E films for architectural glass, liquid crystal panels, and recording media!

■ Purity: 99.5% - 99.95% ■ Density (8.4 g/cm³) ■ Manufacturing method: Vacuum melting method *For more details, please download the PDF or feel free to contact us.

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Nickel-Copper (NiCu) Target

Alloy materials that can be used for semiconductor integrated circuits (VLSI), flat panel displays, optical discs, surface coatings, etc.

■ Purity: 99.9% ■ Density (8.9 g/cm³) ■ Manufacturing method: Vacuum melting method *For more details, please download the PDF or feel free to contact us.

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Sputtering

We deliver target materials for PVD and materials for vacuum deposition in small quantities and with short lead times!

We would like to introduce the "sputtering" products we handle. For target materials, the maximum size for planar types is 2200mm x 2500mm, and for rotary types, it is up to 3800mm in length. We handle various materials, but we are particularly confident in our ability to supply materials that are currently difficult to obtain, such as Hf, Zr, Ta, Nd, Sc, and Sm. 【Benefits of Using Our Products】 ■ Smooth procurement of hard-to-obtain materials ■ Bonding processing support is also available *For more details, please download the PDF or feel free to contact us.

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