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  3. ティー・エイ・インスツルメント・ジャパン (TAInstruments)
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Testing, Analysis and Measurement
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ティー・エイ・インスツルメント・ジャパン (TAInstruments)

EstablishmentNovember 1991
capital25000Ten thousand
number of employees29
addressTokyo/Shinagawa/6th Floor, Lexington Plaza Nishigotanda, 5-2-4 Nishigotanda
phone03-5759-8500
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last updated:Jul 02, 2025
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ティー・エイ・インスツルメント・ジャパン List of Products and Services

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Technical Data Summary Technical Data Summary
YouTube lecture materials YouTube lecture materials
Pharmaceuticals-related Pharmaceuticals-related
Composite Materials Analysis Related Composite Materials Analysis Related
Protein analysis related Protein analysis related
Biomaterials-related Biomaterials-related
Differential Scanning Calorimeter (DSC) Differential Scanning Calorimeter (DSC)
Thermogravimetric analysis device (TGA) Thermogravimetric analysis device (TGA)
Dynamic Mechanical Analysis Device (DMA) Dynamic Mechanical Analysis Device (DMA)
Thermogravimetric analysis device (TG-DSC, SDT) Thermogravimetric analysis device (TG-DSC, SDT)
Steam adsorption and desorption measurement device (Discovery SA) Steam adsorption and desorption measurement device (Discovery SA)
Magnetic levitation high-temperature high-pressure thermal weight measurement device Magnetic levitation high-temperature high-pressure thermal weight measurement device
Thermal Conductivity Measurement Device (DTC-300) Thermal Conductivity Measurement Device (DTC-300)
Thermal conductivity measurement device (FOX) Thermal conductivity measurement device (FOX)
Laser Flash Method Thermal Diffusivity Measurement Device (DLF) Laser Flash Method Thermal Diffusivity Measurement Device (DLF)
Thermal Expansion Rate Measurement Device (TMA) Thermal Expansion Rate Measurement Device (TMA)
Thermal Expansion Rate Measurement Device (DIL) Thermal Expansion Rate Measurement Device (DIL)
Heating microscope (HM867) Heating microscope (HM867)
Rheometer and viscoelasticity measurement device (DHR) Rheometer and viscoelasticity measurement device (DHR)
Rheometer and viscoelasticity measurement device (ARES-G2) Rheometer and viscoelasticity measurement device (ARES-G2)
High Temperature Viscometer (VIS413) High Temperature Viscometer (VIS413)
Rubber testing cure meter & viscoelasticity measurement device Rubber testing cure meter & viscoelasticity measurement device
Fatigue testing & high-load viscoelasticity measurement device Fatigue testing & high-load viscoelasticity measurement device
BioDynamic Testing Device Low Load Material Fatigue Testing Machine BioDynamic Testing Device Low Load Material Fatigue Testing Machine
DuraPulse Stent Graft Testing Machine (SGT) DuraPulse Stent Graft Testing Machine (SGT)
Artificial heart valve durability testing device Artificial heart valve durability testing device
Isothermal calorimeter (TAM) Isothermal calorimeter (TAM)
Isothermal Titration Calorimeter (Affinity ITC) Isothermal Titration Calorimeter (Affinity ITC)
Differential Scanning Calorimeter for Biomacromolecules (nanoDSC) Differential Scanning Calorimeter for Biomacromolecules (nanoDSC)
Cooler and air chiller system Cooler and air chiller system
Thermal

Thermal Expansion Rate Measurement Device (TMA)

This device, designed to fully utilize techniques born from extensive experience, excels in performance, ease of operation, and reliability, unmatched by others, and measures mechanical properties with high sensitivity across a wide temperature range.

Thermomechanical Analysis / Thermal Expansion Rate Measurement Device Discovery TMA

Various measurement modes! High-sensitivity mechanical analysis is possible over a wide temperature range.

The thermal analysis device/thermomechanical measurement device "TMA Series" is designed to measure dimensional changes of samples under controlled temperature, time, stress, and atmosphere. It offers a variety of measurement modes, enabling the evaluation of material excessive properties (such as creep and stress relaxation) and the separation of overlapping thermal events (MTMA). This product is a research and development grade thermomechanical measurement device, equipped with high performance suitable for research, education, and quality control applications. 【Features】 ■ High sensitivity measurement ■ High versatility ■ Variety of measurement modes ■ Capable of measurements over a wide temperature range

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[Analysis Case] Evaluation of Device Materials and Film Properties for 5G Compatibility

Ideal for the characterization of high-speed communication 5G-compatible materials and films!

The thermal analysis and viscoelasticity measurement devices are equipped with a variety of measurement modes, enabling a wide range of assessments. They are also suitable for evaluating the properties of materials and films compatible with high-speed communication 5G. 【Device Lineup / Main Evaluation Items】 <DSC Differential Scanning Calorimeter> Melting heat, temperature / Glass transition temperature / Crystallization, melting / Reaction heat, temperature / Oxidation <TGA Thermogravimetric Analyzer> Decomposition temperature / Quantification of composite material composition / Residual solvent amount / Kinetic analysis of decomposition reactions <TMA Thermomechanical Analyzer> Glass transition temperature / Coefficient of thermal expansion / Residual strain <DMA Dynamic Mechanical Analyzer> Glass transition temperature / Elastic modulus, Young's modulus / Frequency dependence / Master curve / Creep characteristics <Rheometer> Viscoelastic properties / Glass transition temperature / Elastic modulus / Frequency dependence / Master curve / Thixotropy *For more details, please contact us or download the PDF to view.

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[Analysis Case] Summary of Film Thermal Analysis and Moisture Absorption Analysis Cases

We will introduce examples of film analysis. We also include features of the equipment used for characteristic evaluation.

Under the title "Which devices are used for film property evaluation?", we will introduce suitable devices and applications for evaluation. <Film Analysis Examples> - Glass transition temperature analysis of PET film (DMA/influence of measurement frequency) - DMA measurement of automotive paint film under solvent immersion - High-sensitivity analysis of polyamide blends using Modulated DSC - Evaluation of water vapor permeability of films <Evaluation Item Keywords> - DMA Dynamic Mechanical Analysis Device - Relaxation behavior such as heat resistance, hardness, flexibility, glass transition, and impact absorption - DSC Differential Scanning Calorimeter - Glass transition, crystallization, melting, phase change, curing, oxidation stability - TMA Thermomechanical Analysis Device - Coefficient of thermal expansion (CTE), softening point, load deflection temperature, stress relaxation - SA Moisture Vapor Adsorption/Desorption Analysis Device - Water vapor permeability, barrier properties *For more details, please contact us or download the PDF to view.

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