北川グレステック Product Lineup

The "Portable Hand Wrapping Kit" allows for manual wrapping and polishing of parts, enabling immediate hand polishing on the worksite. It is ideal for materials made from ceramics, tungsten carbide, stellite, brass, steel carbide, silicon, and neodymium, among others. Additionally, it is suitable for situations where production volume is low and purchasing a polishing machine is not economically viable. 【Features】 ■ Manual wrapping and polishing of parts ■ Immediate hand polishing on the worksite ■ Suitable for low production volumes where purchasing a polishing machine is not economical ■ Lineup tailored to usage conditions *For more details, please refer to the PDF document or feel free to contact us.

• Other abrasives

The "CHALLENGE 300-HT" provides maximum grinding/cutting power and surface finishing performance in the grinding, sawing, and dicing processes using diamond wheels and blades. Thanks to its special components, it exhibits various effects such as suppression of cutting heat, reduction of grinding wheel load, and extended lifespan of grinding wheels even for difficult-to-cut materials. It also has a foaming effect, making operation easy. 【Features】 ■ For ceramics and glass ■ Assists in high-quality machining finishes (surface roughness, machining alteration layer) ■ High grinding rate ■ Foaming effect ■ Extends the lifespan of diamonds *For more details, please refer to the PDF document or feel free to contact us.

• Other consumables

"VECTOR HTR" is used for residue removal on wrapping plates and wafers, and also has rust prevention effects. It suppresses the surface tension between the polishing pad and the wafer, reducing residues on the wafer. In polishing applications, it is effective for rinsing pads and wafers. 【Features】 ■ Used during wafer cleaning and handling ■ Reduces maintenance and cleaning of polishing pads and plates ■ Reduces staining ■ Reduces wafer breakage and scratches caused by contamination of plates ■ Reduces wafer breakage during wrapping *For more details, please refer to the PDF document or feel free to contact us.

• Other consumables

The "Wood Stick" is a wrapping stick for hand wrapping made from natural wood materials and a special resin from Chemitt, compressed under high pressure. Thanks to Chemitt's special technology, it is easy to process into spherical shapes and resistant to deformation. It can finish details such as molds to a uniform surface through manual processing. There are two types available: a hard type suitable for rough finishing with high cutting power, and a soft type suitable for mirror finish as a final touch. 【Features】 ■ Wrapping stick for hand wrapping ■ Resistant to deformation ■ Finishes details such as molds to a uniform surface ■ Available in hard and soft types *For more details, please refer to the PDF document or feel free to contact us.

• Other abrasives

Kemet Japan's "Kemet Wax Series" is a wax designed to make precision polishing easier and to better meet finishing requirements. The "ST Wax Series" is a hot melt type with strong adhesion and does not clog diamond cutters. The "Brown Wax Series" melts at low temperatures and has low viscosity, making it ideal for high-precision products as it can be applied thinly. 【Features】 ■ST Wax - Excellent adhesion, bonding, and durability - Hot melt type adhesive - Superior workability and cleanability ■Brown Wax - Melts at low temperatures and can be applied thinly due to low viscosity - Bonds quickly and has excellent workability and cleanability *For more details, please refer to the PDF materials or feel free to contact us.

• Other abrasives

The "Kemett Plate" is a resin mixed plate that is optimal for lap polishing of metals, brittle materials, and difficult-to-machine materials such as molds, LEDs, electronic components, and semiconductor materials. 【Product PR】 The plate is mixed with soft metals and has flexibility, absorbing shocks during contact between the diamond and the workpiece, preventing damage to the processing surface. It is easy to check the flatness of the plate, allowing anyone to easily create an accurate flat surface. 【Features】 ◆ Resistant to fine scratches With elasticity and abrasive particle retention, the diamonds are evenly embedded, acting as semi-fixed abrasives, making it difficult for fine scratches to occur. ◆ Easy to correct flatness Correction can be done using diamond pellets, making it easy to manage the flatness of the plate. ◆ Wide variety There is a wide variety available, allowing you to choose a plate that suits the material and lap purpose. *For more details, please refer to the PDF or feel free to contact us.

• Other machine tools

The "VECTOR HTC-SCA Series" is an additive developed for ultrasonic and high-frequency cleaning. Ultrasonic and high-frequency waves are efficiently released on the surface of the cleaning wafer, resulting in excellent cleaning outcomes. We offer four types of products to suit various applications. 【Features】 ■ Excellent wetting properties ■ No rinsing required - no film or residue left ■ Compatible with other VECTOR products ■ Economical and easy to filter *For more details, please refer to the PDF document or feel free to contact us.

• Other consumables

The "VECTOR HTI-1.1" is a lubricant developed for use with the one-pass method for I.D. diamond blades. It has excellent thermal conductivity, contributing to an extended lifespan by quickly cooling the diamond blade. It also excels in cleaning power, keeping the diamond clean, which enhances cutting speed and reduces blade distortion. 【Features】 ■ Improved blade lifespan ■ Reduced blade distortion ■ Increased productivity ■ Reduced surface damage ■ Minimal twisting and warping *For more details, please refer to the PDF document or feel free to contact us.

• Cutting Oil

"VECTOR HTG" contributes to maximum grinding/cutting power and surface finishing performance in the processing processes of grinding, sawing, and dicing using diamond wheels and blades. Thanks to its special components, it exhibits various effects such as suppression of cutting heat and reduction of grinding wheel load. It can also be adapted to filtering systems and has a defoaming effect, making it user-friendly for operators. 【Features】 ■ Good surface finish ■ Extended grinding wheel life ■ High grinding rate ■ Defoaming effect ■ Corrosion resistance *For more details, please refer to the PDF document or feel free to contact us.

• Cutting Oil

"VECTOR HTN" is an additive for high-speed circulation slurries, developed for use with circulation pumps. It uniformly disperses various abrasives such as alumina, cerium, zirconia, SiC, B4C, synthetic/natural diamonds, and garnet. It can be continuously used as a circulation slurry, reducing slurry waste and the amount of abrasives used. 【Features】 ■ Improved dispersibility ■ Reduced material damage (processing altered layer) ■ High lap rate ■ Scratch-free ■ Effective cleaning after polishing *For more details, please refer to the PDF document or feel free to contact us.

• Other consumables

"VECTOR HTS-3" is a dispersant developed for the lapping of silicon wafers. It has high biodegradability and viscosity, and by mixing alumina with pure water, a moderately viscous lapping slurry can be obtained. There are no changes in physical or chemical properties, and high dispersibility is maintained for over a week. 【Features】 ■ For lapping slurry ■ High biodegradability ■ High viscosity ■ No changes in physical or chemical properties ■ Wafer flatness ■ Reduced wafer damage *For more details, please refer to the PDF document or feel free to contact us.

• Other consumables

The "MHD240-SS" is a bonding device that adheres thin substrates such as sapphire, SiC, and GaN wafers to support substrates made of materials like ceramic and glass using wax adhesion. By applying uniform pressure to the samples through air pressure, it allows for even and consistent bonding to the support substrate. The device can set the wax curing time (cooling time), which helps prevent shrinkage of the wax due to rapid cooling. 【Features】 ■ A device for attaching thin substrates to support substrates using wax ■ Capable of vacuum release during bonding ■ Uniform pressure application to samples through air pressure for consistent bonding ■ Bonding settings are controlled by a sequencer program ■ Allows for setting the wax curing time to prevent rapid cooling *For more details, please refer to the PDF materials or feel free to contact us.

• Processing Jig

This is an electronic dispenser (automatic supply device) specifically for diamond slurry. It allows for adjustments to spray time, stop time, and spray output, enabling appropriate diamond slurry supply according to polishing conditions while minimizing excess consumption of the slurry. Additionally, it can control two systems simultaneously, allowing for the simultaneous supply of slurry and lubricants, among others.

• Other laboratory equipment and containers

This is a high-performance diamond compound provided by Kemet, a pioneer in diamond polishing systems. Like the company's slurries, the diamond abrasives are highly classified and managed, boasting high polishing precision. It is recommended to combine it with Kemet polishing rods, Kemet wood sticks, and Kemet lubricants.

• Hand polishing and filing

Kemet's diamond powder is a specially selected diamond powder by Kemet, a pioneer in diamond polishing systems. It is primarily used for slurries (abrasives) and grinding wheels, but some users also employ it as a special additive. Even though it is referred to as diamond powder, it is necessary to select the appropriate specifications according to the application, such as: - Crystal type (single crystal MA or polycrystalline PC) - Particle shape - Classification accuracy We can also provide samples, so please feel free to contact our sales department if you have any difficulties in selection.

• Other abrasives

【Product PR】 This is diamond slurry classified using advanced classification technology by Kemet. We offer both polycrystalline and single crystal diamonds, and you can choose from aqueous or oil-based solvents. 【Features】 ◆ Custom-made options are available upon request. The basic diamond size ranges from approximately 1/10 to 15 micrometers, but other sizes can also be custom-made according to your requirements. ◆ When used in conjunction with Kemet plates, it is possible to achieve high-precision finishes at high polishing rates. Samples are available upon request. *Please note that it may take some time for the samples to arrive. Thank you for your understanding in advance. For more details, please refer to the PDF or feel free to contact us.

• Other abrasives