ラポールシステム List of Products and Services

Rapport System Co., Ltd. is a company engaged in software development as well as hardware development and sales system development. With "measurement, control, and communication" as our three pillars, we not only offer our own products but also undertake board, unit, and system design and manufacturing based on customer requirements, aiming to contribute to the creation of a comfortable society and a better working environment. 【Business Activities】 ■ Software development and hardware development and sales system development *For more details, please refer to the PDF materials or feel free to contact us.

• Defect Inspection Equipment
• Other inspection equipment and devices
• Communications

This is a system for detecting edge cracks, grinding width, corner cuts, oriflat cuts, and chipping defects on glass substrates before cleaning. We offer a low-cost glass edge defect inspection machine. 【Features】 ■ Can be easily installed in existing lines with minimal space. ■ Capable of inspection at a speed of 800mm/sec. ■ Creates and saves inspection result LOG data and defect images in real-time. ■ LOG data can also be saved as CSV format files. *For more details, please download the catalog or contact us directly.

• Defect Inspection Equipment

The "LF-1000" is a non-contact automatic film thickness measurement device equipped with a spectrometer and optical interference film thickness analysis software, enabling film thickness measurement by setting various parameters. This analysis software allows for non-contact automatic measurement and mapping of the thickness, refractive index, and absorption coefficient of transparent or translucent thin films by analyzing the interference waveforms from the surface of the thin film and the interface with the substrate. 【Features】 - Capable of measuring film thickness not only on wafers and glass substrates but also on other mirror-like substrates. - Various film thickness measurements can be performed by setting the optical constants of the film. - Excellent for measuring thin film oxide layers, SOI, EG films, color filters, etc. - Comes with an auto stage compatible with standard 3, 4, 5, 6, 8, and 12-inch wafers. - Loader specifications can also be accommodated as an option (consultation available for cassette/FOUP and number of ports). - Capable of measuring film thickness from thin films to thick films depending on the measurement head specifications. - GEM communication is optional. *For more details, please refer to the PDF materials or feel free to contact us.

• Semiconductor inspection/test equipment
• Other measurement, recording and measuring instruments

The "MEMS 3-axis accelerometer calibration and inspection device" offers a total solution from probe sockets that match the package shape and non-damaging probe sockets to inline automation. We have a lineup that includes the self-contained mass production cell system "ACT-4125C," equipped with a loader-unloader that automatically inspects from low temperatures (-40°C) to high temperatures (+125°C), as well as the manual type for development, "ACT-4125-M22." 【Lineup】 <For Development> ■ Posture holding jig JIG007 ■ Manual type ACT-4125-M22 <For Mass Production> ■ Cell system ACT-4125C ■ Custom system *For more details, please refer to the PDF document or feel free to contact us.

• Image Processing Equipment

At Rapport System Co., Ltd., we undertake the development and manufacturing of new product circuit boards that meet your requirements, including environmental measures such as lead-free initiatives. You can trust us with everything from design to manufacturing and maintenance. Additionally, we manufacture OEM products, conduct shipping inspections, and provide maintenance based on RoHS standards and ISO 9000. 【Development and Design】 ■ Analog and Digital Circuit Design ■ FPGA Design ■ PCI Bus Board Design ■ CPU: SH Series, V800 Series, and others ■ Firmware & Application Software - Languages: C++, VB, Delphi - OS: Windows 2000/XP/NT, iTRON *For more details, please refer to the PDF materials or feel free to contact us.

• Other services

The "MEMS Pressure Sensor High-Speed Temperature Characterization Testing Device" is a device that allows for high-speed temperature characterization of MEMS pressure sensors through a built-in cooling and heating plate with a pressure control method (patent pending). By employing a method that incorporates the cooling and heating plate within a pressure control chamber, it can conduct tests at three temperatures and three pressures in just 30 minutes. Additionally, by utilizing this cooling and heating plate mechanism, the time required for temperature characterization tests other than pressure can also be significantly reduced. 【Features】 - Adoption of bump probes enables a small mounting area - Capable of conducting tests at three temperatures and three pressures in 30 minutes *For more details, please refer to the PDF document or feel free to contact us.

• Other inspection equipment and devices

The "Glass Appearance Inspection Device" is a system for inspecting the appearance of defects and surface foreign substances in sheet glass produced by the float process, as well as in the panels of various generations. It is compatible with printed PDP filter glass. The device can be expanded or enhanced to accommodate different panel sizes. Defect information can be sampled from the upper HOST, making feedback to the production line and data management easy. 【Features】 ■ Glass inspection system for internal defects and surface foreign substances in panels of various generations ■ Expandable and adaptable to panel sizes ■ Compatible with printed PDP filter glass ■ Easy feedback of defect information to the production line and data management ■ LOG data can also be saved as CSV files *For more details, please refer to the PDF document or feel free to contact us.

• Image analysis software
• Defect Inspection Equipment

The "GEM Driver (LPD-GEM-H/S)" is a software package that enables SECS, GEM, and HSMS communication for semiconductor manufacturing equipment. Since it is a DLL format driver, there are no restrictions based on the development language. It can implement SECS I and HSMS with the same driver, allowing for minor modifications to accommodate change requests after the line startup. 【Features】 ■ Implements SECS I and HSMS with the same driver ■ Capable of responding to change requests after line startup with minimal modifications ■ Protocol control and timer monitoring are performed on the DLL ■ The structure of SECS II messages is created by the loader, with structure editing and expansion processing during send/receive via the DLL ■ GEM communication scenarios can be executed with the DLL ■ Ports can use standard RS232C ports or LAN ports on a computer *For more details, please refer to the PDF document or feel free to contact us.

• Communications
• Other semiconductor manufacturing equipment

The "EES Package" is a package designed to build an EES (Equipment Engineering System) at a low cost, aimed at improving the productivity of equipment. No need for users to create communication programs; only the necessary parameter settings are required. It is also easy to connect to existing systems. Additionally, it is possible to define events triggered by changes in parameter values based on metadata definitions (parameter lists/event collection/trace collection). 【Features】 ■ No need for users to create communication programs ■ Easy to implement and connect to existing systems ■ Ability to define events triggered by changes in parameter values ■ Capability to store data from the past six months ■ One package per equipment unit ■ Operating environment: Windows 2000/XP/7 *For more details, please refer to the PDF document or feel free to contact us.

• Communications

It can be built up into a module dedicated to your company's equipment.

• Display

The measured results will be displayed as 2D or 3D data.

• Defect Inspection Equipment

This is a high-speed 3D appearance inspection device equipped with a 3D laser sensor manufactured by NanoFocus, developed by Siemens.

• Image analysis software
• Defect Inspection Equipment

Reading characters: Please contact us regarding OCR fonts.

• Other environmental analysis equipment

If you have any questions, please feel free to contact us.

• Communications

In addition to communication, the interface with external carriers such as automatic transport carts and OHT, which cannot be covered by the equipment, will also be linked to the device's online communication.

• Communications
• Other semiconductor manufacturing equipment

Enabled high stability measurement.

• Other environmental analysis equipment

There are wafer-level types and package-level types.

• Temperature and humidity measuring instruments

Target MEMS sensors ⇒ ● MEMS accelerometer ● MEMS gyroscope ● MEMS motion sensor ● MEMS pressure sensor

• Other environmental analysis equipment