TOMOEGAWA CORPORATION Product Lineup

iCas F-TR has unique characteristics to increase adhesion temporary by heating then to reduce adhesion strength by continuing heating. Therefore, even under high-temperature environments, the tape adheres firmly to the substrate and can be easily removed after the process has been completed without leaving any adhesive residue. In addition, since additional process such as heating or UV irradiation is not required when peeling off the tape, it is also possible to improve work efficiency. The tape is suitable for temporary fixing applications in manufacturing process of electronic parts, etc. [Features] - Capable to adhere to various materials at room temperature (Ex. copper, gold, alumina, silicon, etc). - Compatible with reflow process and dry/wet process such as plasma flux cleaning. - Able to be peeled off at room temperature after heat treatment process (thermal peeling is possible). - Possesses superior chemical resistance against various chemicals such as toluene, THF, IPA, etc. - Designed as PFAS-Free formulation. [Application] - Components carrier tape in the manufacturing process. - Temporary fixing to backside of substrates such as silicon, glass, alumina for FO-WLP. - Masking use under high temperature environment (plating, soldering, thermal spraying, etc.) - Preventing mold resin bleed of lead frame package.

The conventional liquid type adhesive has high adhesion strength and high heat resistance, however, its workability is an issue in comparison with adhesive tape. TOMOEGAWA's adhesive film contributes to improving workability while maintaining high adhesive strength and heat resistance, by molding to sheet form with thermo-setting adhesive by our own developed process. Can be customized according to the customer's request (adhesive strength, adhesive thickness, curing condition, etc.) Example: Short time curing type (At 180°C for 6 minutes, a peel strength of 10N/cm is achieved for aluminum and stainless steel.） [Features] - Available in thin films (Min.5μm), contributing to low-profile and low thermal resistance of parts. *Please contact us for thickness of less than 5 μm. - Replacement from glue to the film contributing to reduce the use of solvent in manufacturing site - Sheet type provides eliminating the need for care against overflow and coating amount control, which are required for liquid type adhesive. - Can be stored at room temperature [Application] - Passive parts (chip resistor, etc.) - Automotive parts - Circuit substrate materials such as FPC and FFC - Various equipment parts and jigs

[Features] - Improving sealing and adhesive performance without curing process due to mold temperature and heat during resin injection molding - Because the tape itself is slightly sticky, temporary lamination with metal insert materials is possible at room temperature - No surface modification or potting - Applicable to various materials Metals: Aluminum, stainless steel, copper, steel, etc. Resin: PPS, PBT, PA, etc. [Application] - Insert molded products such as connectors, bus bars, and terminal blocks - Resin and metal composite parts such as car interior panels

This is a thermal adhesive film developed with our own high-insulation adhesive applied to a Polyimide Film. Featuring high electrical insulation and heat resistance, it ensures insulation even in environments where large currents and high voltages are present. It also offers excellent migration resistance and has a long track record of use in semiconductor applications. [Application] - Enables insulation between IC chips, and between lead frames and IC chips - Joins lead frames and heat sinks - Fixes and insulates electrical/electronic components, precision parts, devices, and jigs