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The metal surface treatment agents SSP-1000 and SSP-2000 can remove impurities from the copper surface before resist application with minimal etching. They can simultaneously remove oxides and grease. By processing the copper surface smoothly, the adhesion with the resist is improved, enhancing resolution. The SSP series is designed for processing in the pre-lamination stage, particularly when physical mechanical polishing is difficult, such as with inner layers and flexible substrates, and when it is desired to minimize chemical etching. It is also capable of completely removing chromium, which has been challenging with conventional treatments, using a single solution. 【Features】 - Sufficient adhesion effect with the resist is achieved through the primer film. - The primer film provides ongoing simple rust prevention until the next process. - There is almost no impact on the copper surface even after several consecutive treatments. For more details, please contact us or download the catalog.