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サーマプレシジョン

capital10000Ten thousand
number of employees42
addressTokyo/Koto-ku/16-1 Fuyuki
phone03-3643-2921
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last updated:Oct 29, 2025
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Heating warp measurement device Heating warp measurement device
Oxide film measurement device Oxide film measurement device
Inline type substrate and film cleaning device Inline type substrate and film cleaning device
Metal surface treatment agent Metal surface treatment agent
Research and development slit coater Research and development slit coater
Inline slit coater Inline slit coater
Applied exposure device Applied exposure device
Substrate-related solutions Substrate-related solutions
Heating

Heating warp measurement device

It is a heated warp measurement device.

Shadow Moiré Type Substrate Warpage Measurement Device TherMoiré AXP3

Measuring the warping of the substrate during heating using shadow moiré measurement! ◆Warping data obtained in about 2 seconds per point! ◆Achieving a resolution of 0.5 microns!

TherMoire AXP 3.0 utilizes shadow moiré measurement technology to enable surface analysis with a variety of optional modules. It visualizes the surface shape of samples in user-specified temperature profile environments. In addition to measuring warping during heating, optional features are available for analyzing surface behavior in sub-zero temperature environments and calculating CTE values. Furthermore, the design ensures high temperature uniformity due to the top and bottom heating. For more details, please contact us or download the catalog.

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TherMoiré Shadow Moiré Type Curvature Measurement Device Various Options

You can select a measurement method that suits your measurement application (sample). Measurements can be taken under various conditions such as implemented products, strain, and when cooled!

The DFP module (AXP) can measure non-continuous flat surfaces (island-like) such as products with steps, packages with solder balls, and boards with recesses that could not be measured with shadow moire. The gantry fixture allows for movable measurement positions (capable of moving to specific locations on large samples). It is also possible to measure small structures such as connector holes with high-resolution XY (over 1.9 million pixels) and automatic mask processing. 【Features of Other Options】 - DFP2: Capable of measuring mounted items (steps, solder balls, unevenness, etc.) - DIC2.0: Capable of measuring strain (expansion, contraction, etc.) - SRT: Capable of heating/cooling from -55°C to 300°C - Visualization of both-sided behavior during mounting (reflow) is possible. 【Specifications】 ○ Compatible models – AXP ○ Maximum FOV (Field of View) – 100mm x 100mm ○ Maximum sample size – 400mm x 400mm For more details, please contact us or download the catalog.

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Introduction to the product lineup of the heating warp measurement device by Akrometrix.

We introduce a lineup of various substrate warpage measurement devices manufactured by Akrometrix! There are a total of four types.

◆TherMoiré PS200S 【Features】 - Lower heating specification - Measurement field 200mm×200mm - Warpage data acquisition time approximately 2 seconds - Option to equip with DIC2.0 ◆TherMoiré PS600S 【Features】 - Compatible with large substrates - Measurement field 600mm×600mm - Warpage data acquisition time approximately 2 seconds - Option to equip with DFP2, DIC2.0 ◆Table Top Shadow Moiré 【Features】 - Tabletop type room temperature inspection device - Measurement field 300mm×300mm - Warpage data acquisition time approximately 2 seconds ◆Table Top DFP 【Features】 - Inspection device for mounted products at room temperature - Measurement field 192mm×240mm - Warpage data acquisition time approximately 1 second ● For more details, please contact us or download the catalog.

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