サーマプレシジョン List of Products and Services

The SX series is a compact and versatile small X-ray device. Its capabilities have improved, and the image quality is different. Additionally, it is equipped with a proprietary micro-focus X-ray tube.

It is ideal for removing chips from processing fluids, long-term reuse of coolant liquids, reuse/disposal of recovered sludge, decolorization, and reduction of BOD/COD, among other applications. It is suitable for wastewater treatment in various industries. Recovery of tungsten, cerium oxide, and copper powder is possible. 【Features】 ○ Precise filtration and low moisture content sludge recovery using centrifugal force of 1700G [up to 3000G] ○ No consumables such as filter media like paper filters or filter presses required ○ Capable of filtration separation of valuable materials regardless of whether they are water-soluble, oil-based, magnetic, or non-magnetic For more details, please contact us or download the catalog.

The recovery of silicon sludge from silicon processing wastewater using a centrifuge achieves stable recovery of silicon sludge with a moisture content of approximately 30%. High purity recovery is possible due to a low-wear structure that minimizes the contamination of impurities in the silicon sludge. 【Features】 ○ Stable recovery of silicon sludge with a moisture content of approximately 30% ○ High purity recovery due to a low-wear structure that minimizes the contamination of impurities in the silicon sludge ○ Unmanned recovery of silicon sludge through fully automated operation For more details, please contact us or download the catalog.

The light source device is equipped with a lamp (reflector assembly), rod lenses (optical components that uniform the illumination), and a shutter, among other components. The light from the source is directed to the sample using a series of light guides (optical fibers) and illumination lenses (rod lenses) tailored for various applications. 【Features】 ○ Wavelength selection available ○ Freedom in irradiation shape For more details, please contact us or download the catalog.

Therma Precision Co., Ltd. provides cutting-edge technology to electronic component manufacturers in Japan through the sale of manufacturing equipment and inspection and analysis equipment for major electronic components such as printed circuit boards, semiconductors, LCDs, and PDPs. 【About the Oxide and Metal Film Thickness Measurement Device】 The PC-M1 is a device that easily measures the thickness of thin film oxide and thin film metal using a continuous electrochemical reduction method. 【Metals for Oxide Measurement】 [About Oxide Measurement] ○ Copper: Cu2O, CuO, Cu2S ○ Tin: SnO, SnO2 ○ Silver: Ag2O, AgCl, Ag2SO4, Ag2S 〇 For other materials (such as aluminum), please consult us. Measurements are taken in various Å (angstrom) units. 【Comparison with Other Analyzers】 PC-M1 vs. Other Analyzers Measurement Time: Several hundred seconds vs. several hours Identification of Oxide Types: Possible vs. Difficult Measurement of Intermetallic Compounds: Possible vs. Difficult Equipment Cost: Within tens of millions vs. thousands to hundreds of millions Ease of Handling: Easy vs. Difficult Minimum Measurement Area: mm² vs. μm² For more details, please contact us or download the catalog.

The next-generation composite material for printed circuit boards, "Clear Sheet," has low thermal conductivity due to independent bubbles and low moisture absorption, providing insulation effects. It has moderate flexibility and excellent elasticity. It also boasts superior resilience, maintaining cushioning properties close to the initial state even after repeated impacts. Since it uses polyethylene, it does not generate dioxins. Its foamed structure is designed with consideration for the environment, energy conservation, and resource savings. 【Features】 ○ Protects products with excellent cushioning properties ○ No self-dusting due to being made of plastic material ○ Anti-static agents prevent issues caused by static electricity and the adhesion of foreign substances For more details, please contact us or download the catalog.

Ampoc's "developing, etching, and stripping device" features a wider transport wheel width and holes to reduce the surface tension of the liquid, enabling stable transport of thin plates. By using both transport wheels and small-diameter rolls at the connecting parts and liquid discharge, it can prevent troubles such as substrate entanglement at the seams. This is a new generation vertical device that eliminates the effects of liquid vertical flow due to zero contact and rotation. 【Features】 ○ Compatible with thin materials ○ Achieves complete contact-free operation without transport marks ○ Fully automated production with a robot transport system ○ Liquid pooling at the clamp area has been resolved 【Latest Design】*For details, please refer to the catalog ◆ Thermal circulation reuse system ◆ Stripping residue dehydration system ◆ Developing liquid purification system ◆ Magnetic gear For more information, please contact us or download the catalog.

The completely non-silicone dispersion defoamer for development, "FOAMKILLER NSI-0.00," is a revolutionary defoamer that ensures both immediate and lasting effects without containing silicone. It can also be used as a dispersant to prevent sludge accumulation. 【Features】 - No risk of contamination as it does not contain any silicone components. - Provides rapid defoaming effects when used with alkaline developing solutions. - Extremely excellent dispersibility of sludge, allowing for smooth cleaning of tanks during bathing. For more details, please contact us or download the catalog.

How about fully automated measurement for the inspection of copper plating film thickness? The handheld copper plating thickness measurement device "Cabidarm" can automate various points such as the plating process, final inspection process, and incoming inspection. 【Features】 ○ Measurements are taken instantly ○ The dedicated probe does not scratch the substrate ○ It is possible to connect to a PC via USB cable for advanced statistical processing For more details, please contact us or download the catalog.

PWB, wafer, and other electronic component plating solutions, as well as various types of plating such as wiring plating, Viafill, Damacine, and bump plating are supported. By expanding the range of rotation speeds, more new additives can be analyzed. Additionally, the "Get Me Expert" feature allows for immediate contact with on-site support. It is compatible with additives sold by chemical manufacturers worldwide. 【Features】 ■ Compatible with PWB, wafer, and other electronic component plating solutions ■ Supports various types of plating such as wiring plating, TSV plating, Viafill, Damacine, and bump plating ■ Up to four syringes for diverse sample analysis ■ Automatic analysis of up to 42 samples (V30 model) ■ Automation of SE solution and calibration standard solution preparation ■ Multilingual support ■ Built-in galvanostat ■ Improved maintenance of reference electrodes ■ Compatible with additives from the following chemical manufacturers: Atotech, Ishihara Chemical, Kamimura Industry, Okuno Pharmaceutical Industry, Dow Chemical, McDermid, Mertex, ADEKA, EEJA, JCU, etc. *For more details, please refer to the catalog or feel free to contact us.