ニッカン工業 List of Products and Services

"STRB" is a thin, soft, and elastic sheet that returns to its original shape after being stretched. It can also be used as a protective material, and the elastic sheets adhere to each other at low temperatures and for a short time. It is suitable for circuit board materials and circuit coating materials with elasticity. Additionally, we are considering a low permeability and high adhesion type. We also offer "hot melt adhesive sheets" that can adhere at low temperatures and for a short time. 【Features】 ■ High elasticity: elongation rate of over 500% ■ Thin and soft: can be produced from 10μm ■ Heat resistance: retains properties even after 150℃ for 1 hour ■ Handling: can be heat-treated with a separator ■ High permeability: permeability of 2,200[g/m2･24h] (25μm) ■ Hot sealing: can also be used as a protective material Elastic sheets adhere to each other at low temperatures and for a short time (100℃ for 1 minute) *For more details, please refer to the PDF document or feel free to contact us.

• others

The foam adhesive sheet is an adhesive sheet that expands during the process, changing its thickness, and is suitable for gap filling and various bonding applications. It enables bonding in places where pressure cannot be applied, which was difficult with conventional sheet adhesives. It serves as a liquid adhesive alternative, reduces waste, and simplifies processes. Since the adhesive itself increases in thickness and conforms to the adherend, it can bond without changing the shape of thin or soft materials, making it ideal for bonding in areas with strict surface roughness requirements. For more details, please contact us or refer to the catalog.

• Other optical parts

The low dielectric coverlay bonding sheet is a material compatible with low dielectric constant, low dielectric loss tangent coverlay, and high-frequency design. Due to its low Dk and Df, it contributes to reducing dielectric loss in transmission lines, and its low Dk allows for wider circuit conductors, enhancing the flexibility of wiring design. It can be press-formed at 160°C, eliminating the need for changes in auxiliary materials due to high-temperature pressing (above 160°C). It can be molded using the current coverlay press equipment. For more details, please contact us or refer to the catalog. We have developed an ultra-low dielectric and ultra-dielectric loss tangent adhesive sheet. For more details, please contact us.

• Other optical parts

It is a composite material from NIKKAN that combines heat resistance, flame retardancy, chemical resistance, and toughness of Nomex paper and other special papers.

• others

■ Excellent heat resistance for soldering, capable of withstanding the flow soldering process, and used in a wide range of electronic components. ■ Excellent thermal dimensional stability, allowing for the formation of high-density patterns. ■ Excellent flexibility. ■ Excellent flame retardancy.

• others

■Excellent flame retardancy and tracking resistance. ■Unclad boards for backing plates of flexible substrates are also available. ■Halogen-free and antimony-free materials.

• others

■The processing method is simple. Adhesion is possible with roll lamination and after curing. ■Excellent moisture resistance. ■Ideal for bonding polyimide film substrate flexible printed circuits and reinforcement plates. ■Maintains long-term life.

• Printed Circuit Board

We will propose composite materials tailored to your desired characteristics using our company's unique know-how and resin.

• glue

■ Due to its short-time molding type, productivity can be improved. ■ It can adapt to a wide range of molding conditions. ■ It can be supplied in roll shape.

• others

■It has excellent heat resistance to soldering and can sufficiently withstand the flow soldering process, making it suitable for a wide range of electronic components. ■It has excellent electrical properties. ■It has excellent flexibility. ■There is little resin flow during pressing.

• Printed Circuit Board