ティーシーエスジャパン Product Lineup

Are you facing issues like communication speeds being too fast for signals to transmit properly (noise), and difficulties in design due to heat buildup? Regarding "backplanes," we provide solutions suitable for our customers based on the know-how we have built over many years as a specialized backplane manufacturer. We accommodate a full range of products, from large to small, high-layer to low-layer. For "power solutions (busbars)," we support appropriate design, simulation, and manufacturing based on your specified requirements, including current, voltage, frequency, thermal design, and space-saving considerations.

• cable

We would like to introduce the products handled by TCS Japan Corporation. Regarding "Backplanes," we provide suitable solutions for our customers based on the know-how we have built as a specialized manufacturer of backplanes over many years. We accommodate a full range of products, including large and small, high-layered and low-layered options. For "Power Solutions (Busbars)," we support appropriate design, simulation, and manufacturing based on the required specifications such as current, voltage, frequency, thermal design, and space-saving. 【Products Handled】 ■ Backplanes ■ Subracks/Chassis ■ Cables/Harnesses ■ Power Solutions (Busbars) *For more details, please refer to the PDF materials or feel free to contact us.

• cable
• Other cable related products
• connector

■EMC Shielding Effect (Attenuation Rate of Each Frequency Component) Shielding includes electric field, magnetic field, and electromagnetic field (radio wave) shielding. However, at distances of λ/6 or more, electromagnetic field (radio wave) shielding becomes important. The principle of electromagnetic shielding is based on the "eddy currents" generated when electromagnetic waves (radio waves) pass through a metal conductor, which create a counter magnetic flux (magnetic flux generated in a direction that cancels the incident magnetic flux) that attenuates the electromagnetic field. The attenuation rate of the shielding material is usually expressed in decibels (dB). ■Structure It is fundamental to address noise at the circuit board, which is the source of noise generation. To prevent the generated noise from radiating to the outside (emission) and to minimize external influences (immunity), measures around the circuit board, such as the chassis and external input/output lines (including power supply), are important. □For other functions and details, please contact us.

• Other semiconductors

We can also accommodate assemblies such as backplanes, fan units, and power supplies. We also support products compliant with the PICMG standard. Please feel free to consult with us.

• Other semiconductors

We offer a wide range of services including board mounting and press-fit. We can also flexibly accommodate connectors from other manufacturers. If you have any issues with board assembly or enclosure assembly, please feel free to consult with us.

• Other semiconductors

Design support using electromagnetic field analysis simulations will be provided as needed.

• Other semiconductors

**Features** - Compliant with PICMG MTCA.0 R1.0, AMC.0 R1.0, AMC.1 R1.0, AMC.2 R1.0, AMC.3 R1.0 - Backplane: Single height, full size (6HP width), 3 slots - Interfaces: PCI Express (X1, X2, X4, X8), GbE/10GbE, SAS/SATA, SRIO (1X, 4X) - Power: AC 100/200V input, 300W 12V 27A with forced air cooling, 3.3V/1A supplied via DC-DC converter on the backplane For other features and details, please refer to the catalog.

• Embedded Board Computers

TCS Japan offers a lineup of products including various specifications of MicroTCA backplanes and subracks based on the PICMG(R) MTCA.0 R1.0 standard, as well as products compliant with the latest MTCA.4 standard. We also have a system in place to respond to customization requests, so please feel free to contact us.

• Embedded Board Computers

In the development of the latest systems that require high-speed and large-capacity information processing, ensuring signal quality between each unit has become an important issue. Today, as the mainstream transmission form on backplanes has shifted from parallel buses to high-speed serial buses, the transmission speed has entered the gigahertz range, necessitating treatment as distributed constant circuits. TCS Japan is engaged in various initiatives to provide backplane systems that can reliably achieve the high-speed transmission required by our customers, and we have also accumulated production achievements in high-speed backplanes in the gigahertz range.

• Other Connectors
• others

Introducing the backplane "Compact PCI" handled by TCS Japan, a manufacturer specializing in backplanes and high-speed connectors. We respond with a variety of slot configurations for left and right system slots. A system configuration with more than 8 slots using a bridge board is also possible.

• Other semiconductors

In recent years, the MicroTCA standard has expanded its applications not only in communication devices but also in advanced measuring instruments' computing units. TCS Japan fully supports system subracks that can accommodate a star/dual-star configuration backplane and two EMMC-compatible cooling units.

• Other semiconductors

Based on the expertise inherited from Teradyne as a specialized manufacturer of backplanes, we promise high transmission quality. We offer a lineup of products including MTCA.0 and the latest accelerator standard MTCA.4. Please feel free to consult us for various custom solutions.

• Printed Circuit Board

Introducing the backplane "Compact PCI Express," handled by TCS Japan, a manufacturer specializing in backplanes and high-speed connectors.

• Other semiconductors