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  3. テクニックジャパン 横浜実験室
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テクニックジャパン 横浜実験室

addressKanagawa/Kanazawa-ku, Yokohama-shi/1-1-1 Fukura, Yokohama Kanazawa High-Tech Center, Techno Core 4th Floor
phone045-780-1355
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last updated:Jun 28, 2016
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テクニックジャパン List of Products and Services

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Analysis machine "Real-Time Analyzer (RTA)"

It is being widely adopted as a next-generation electrochemical analysis device!

The "Real-Time Analyzer (RTA)" is a new electrochemical analysis device focused on alternating current voltammetry. This product allows for real-time analysis of all components in electroplating copper solutions, including copper, sulfuric acid, chlorine, suppressors, accelerators, etc., simply by immersing a probe with three electrodes in a storage tank, contributing to the stability of plating quality. Additionally, there is no need to dilute the plating solution or add reagents, enabling automatic analysis with an extremely simple system. 【Features】 ■ Real-time analysis ■ Contributes to quality stability ■ Automatic analysis possible with a simple system *For more details, please refer to the catalog or feel free to contact us.

  • Other analytical and testing equipment

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Plating equipment "MP80 terminal plating device"

Numerous installation achievements. It is possible to reduce the amount of gold used by equalizing the plating thickness.

The plating device "MP80 terminal plating device" enables the reduction of gold usage through the uniformity of plating thickness. The technique boasts the largest installation record in the world for terminal plating devices. You can choose from a variety ranging from the Mini FFP with a processing speed of 0.45m per minute and a footprint of 3.3m x 0.9m to the MP80 with a speed of 3.6m per minute. Based on the largest number of installations in the world, we provide systems and support tailored to your company's needs. Please contact us for more details.

  • Other surface treatment equipment

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Plating device "Pattern plating device"

The advanced pattern plating equipment of the technique sets the industry standard.

The plating device "Pattern Plating Device" achieves a uniform plating layer even in high aspect ratio holes. The panel positioning system ensures that the positions of the panel and anode are kept horizontal during stirring. Our large-scale plating systems have a throughput of over 50-100 panels per hour. We manufacture chemicals for all processes involved in substrate plating and cater to all needs from equipment to chemicals. For more details, please contact us.

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Plating device "TPM1000 exterior solder plating device"

Due to the low variation in plating thickness and high reproducibility of the plating, inspections can be significantly reduced.

The plating device "TPM1000 exterior solder plating device" processes the lower end of a stainless steel belt into a wedge-shaped spring, allowing for the vertical loading of strip lead frames while simultaneously enabling horizontal transport and power supply. The development of this horizontal transport method has significantly improved the plating quality of strip lead frames, making it the global standard method. Inline deburring with high-pressure water is also possible. For more details, please contact us.

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Plating equipment - tumble plating equipment

A completely new concept of a rotary plating device.

Each processing station has a container called a compartment that rotates parts on a belt, allowing only the parts to move between stations for processing. Since the compartment is open, the chemical solution is directly sprayed in, and the current flows easily, significantly improving the plating speed. Additionally, due to the stationary nature of the container and the unique rinsing method, the amount of liquid extracted can be improved by about 85% compared to a barrel, greatly reducing chemical costs and the burden on the drainage system.

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Analysis machine real-time analyzer

An automatic analysis device utilizing direct current/alternating current voltammetry developed by Technique.

The current situation is specialized in the analysis of copper plating solution and is gradually becoming an alternative system to CVS. A probe is directly immersed in the storage tank to automatically analyze 5-6 components of the copper plating solution in about 20-25 minutes. Since it analyzes the copper plating solution directly, dilution and reagents are unnecessary, making it a very simple automatic analysis system.

  • Analytical Equipment and Devices

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Plating equipment - Roll to roll plating equipment

Wide strip continuous plating equipment

It is possible to transport delicate strip materials or films, such as 50-micron thick polyimide film, by clipping them from above and below. When combined with a shield, stable plating can be achieved. Since power is supplied from the clips, there is no need for a power roll, which prevents damage to the product's surface. Additionally, the stainless steel belt that holds the clips guides the product, allowing for extremely low tension to be set on the product.

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Plating equipment SBE (jet-type) plating equipment

A completely new concept for a rotating plating device that replaces barrels.

A completely new concept of a rotary plating device developed by Technique Corporation, which replaces barrels.

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