キョウデン List of Products and Services

Compatible with ultra-thin build-up layer filled vias. Achieves equivalent filling properties even with build-up layers of different thicknesses. Supports thin plate formation and substrate property requirements with a highly flexible layer configuration. Compatible with 5-layer builds, full stack, and any layer. Kyoden's short delivery times also apply to build-up processes! We can deliver 1-2-1 (4-layer board) in as little as 2 days. 【Features】 ● Smaller substrate size ● Strong against noise ● Capable of carrying large currents ● High design flexibility *For more details, please download the PDF or contact us!

What supports KyoDen's narrow adjacent mounting technology is not just the mounting technology itself. It is unique to KyoDen that we can also offer solutions from substrate manufacturing technology, design, and analysis.

Do you know what a build-up substrate is and what advantages it has? Recently, with the trend towards miniaturization of products, there has been an increase in ultra-small components such as ICs and capacitors. The demand for smaller printed circuit boards that accommodate these components is rising, and achieving this requires build-up substrates. Kyoden, which has been manufacturing build-up substrates for over 30 years and continues to accumulate know-how, will introduce the basics of build-up, its advantages, and examples of manufacturing achievements! [Contents] ■ What is a build-up substrate? ■ Features of Kyoden's build-up substrates ■ Introduction of case studies, etc. *For more details, please download the PDF or contact us.