キョウデン List of Products and Services

Compatible with ultra-thin build-up layer filled vias. Achieves equivalent filling properties even with build-up layers of different thicknesses. Supports thin plate formation and substrate property requirements with a highly flexible layer configuration. Compatible with 5-layer builds, full stack, and any layer. Kyoden's short delivery times also apply to build-up processes! We can deliver 1-2-1 (4-layer board) in as little as 2 days. 【Features】 ● Smaller substrate size ● Strong against noise ● Capable of carrying large currents ● High design flexibility *For more details, please download the PDF or contact us!

Smoothly handle everything from design, circuit boards, to assembly with just one order form and one point of contact. This is possible because of Kyoden. The appeal of Kyoden's printed circuit board assembly: ☑ Assembly handled in-house within the group ☑ Quality assurance with a wealth of inspection equipment ☑ Support for rework and modifications, providing convenience ☑ Possession of SMT lines capable of assembling 0402 chips ☑ Short delivery times achieved through in-house metal mask manufacturing ☑ Support for multi-pin BGA and high-density 0201 components Assembly is handled by Kyoden's subsidiary, Kyoden Precision, which is responsible for EMS. We have 3D image inspection equipment and X-ray inspection equipment. You can rest assured even for components where solder wetting is difficult to confirm. We can check beyond the range that can be verified through data comparison and visual inspection. Please consult us about rework for small and high-density components that are difficult for customers to handle. We are equipped with cutting-edge technology to support 0402, 0201, and narrow-pitch BGA. If you have any issues with assembly, please feel free to consult Kyoden!

"Kyoden's Latest Technology: High-Speed Thick Copper Plating Method" This new technology has enabled the development of high heat dissipation, high-frequency substrates. 【Features】 ♢ Overcomes challenges in mass production, substrate reliability, and thin plate compatibility that were previously unattainable ♢ Technology that can also be used for build-up substrates ♢ Compatible with 5G/6G and power semiconductor components ◎ *For more details, please refer to the related links or feel free to contact us.

What supports KyoDen's narrow adjacent mounting technology is not just the mounting technology itself. It is unique to KyoDen that we can also offer solutions from substrate manufacturing technology, design, and analysis.

Do you know what a build-up substrate is and what advantages it has? Recently, with the trend towards miniaturization of products, there has been an increase in ultra-small components such as ICs and capacitors. The demand for smaller printed circuit boards that accommodate these components is rising, and achieving this requires build-up substrates. Kyoden, which has been manufacturing build-up substrates for over 30 years and continues to accumulate know-how, will introduce the basics of build-up, its advantages, and examples of manufacturing achievements! [Contents] ■ What is a build-up substrate? ■ Features of Kyoden's build-up substrates ■ Introduction of case studies, etc. *For more details, please download the PDF or contact us.

As represented by 5G, IoT, and AI, the wave of digitalization in society is advancing increasingly, and electronic devices are being used in various fields and for a wide range of applications. The possibilities of printed circuit boards, which are the core components, are limitless. This time, we will clearly introduce the types and structures of printed circuit boards. - What is a printed circuit board? - Types of printed circuit boards - Classification by structure - Expanding areas of activity *For more details, please refer to the related links or contact us.