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Manufacturing and processing contract
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メルテックス

number of employees350
addressSaitama/Kita-ku, Saitama-shi/2-2-4 Yoshino Town
phone048-652-2104
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last updated:Nov 08, 2024
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Melplate UBM Process

Minimal damage to the electrodes! Barrier layer formation process on semiconductor wafer electrodes!

The "Melplate UBM Process" is a process for forming UBM (Under Barrier Metal) on semiconductor aluminum electrodes through electroless nickel-gold plating. It enables stable plating treatment for devices with large-area electrodes. The process features minimal damage to the electrodes and excellent barrier properties and smoothness of the coating. 【Features】 ■ Selective electroless plating for UBM formation on microelectrodes ■ Applicable to a wide variety of electrode materials ■ Electrode formation using reduction-type thick gold plating is also possible *For more details, please refer to the PDF materials or feel free to contact us.

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LtF Process for Fan-Out Packaging Process

Introducing dry film stripping agents and seed layer (copper/titanium) etching solutions!

The "LtF Process" is a product for the Fan-Out packaging process. We offer amine-based dry film resist stripping solutions, copper sputter seed layer etching solutions, and titanium sputter seed layer etching solutions. 【Features】 ■ Dry film stripping agent ⇒ Reduces copper dissolution ■ Copper sputter seed layer etching solution ⇒ Maintains stable performance due to continuous supply method ■ Titanium sputter seed layer etching solution ⇒ Low corrosiveness to other metal materials and excellent selective etching properties *For more details, please refer to the PDF document or feel free to contact us.

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Copper sulfate plating additive "Lucent Copper SVF"

Copper sulfate plating additive with low film thickness and high filling ability!

"Lucent Copper SVF" is a copper sulfate plating additive for printed circuit boards. It excels in filling performance and throwing power in high current density areas compared to conventional additives, providing a reliable plating film on boards with mixed vias and through holes. [Features] - High filling capability with low film thickness - Compatible with boards with mixed through holes - Suitable for high current density *For more details, please refer to the PDF document or feel free to contact us.

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Mertex Corporation Company Profile

We will utilize our experience and know-how in surface treatment to meet our customers' needs.

Mertex primarily manufactures and sells surface treatment chemicals used in plating. Since its establishment in 1960, the company has consistently developed and provided high-performance, high-quality plating chemicals, earning a strong reputation. Utilizing accumulated experience, know-how, and a research and development system, we will continue to challenge ourselves in exploring new technologies and product areas, particularly in the electronics field. In addition, leveraging our advanced technology and knowledge in surface treatment, we provide not only products but also total solutions tailored to our customers' needs. 【Business Activities】 ■ Manufacturing and sales of chemicals for the electronics industry ■ Manufacturing and sales of surface treatment chemicals (for plating) ■ Design and construction of chemical equipment ■ Analysis and recovery of chemical substances and metals *For more details, please refer to the PDF document or feel free to contact us.

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