リバティー Product Lineup

The "WPA800S" is a batch plasma ashing device with a coaxial barrel structure that accommodates 50 wafers. It supports wafer sizes of 200mm (8 inches) and can be used for various process applications such as low-damage ashing (ash removal) and surface modification by utilizing high-frequency plasma excitation on photoresist thin films formed on silicon wafers. 【Features】 ■ Coaxial barrel structure ■ 50-wafer batch type ■ Supports wafer size of 200mm (8 inches) ■ Easy recipe input *For more details, please refer to the catalog or feel free to contact us.

• Separation device

The "Feeling Measurement Device" uses a load cell to measure the load of various objects, conduct feeling measurements, and perform durability tests. The measured data can be displayed in real-time as waveform graphs, point data, and can be saved. Additionally, we manufacture products in various sizes and specifications according to customer needs. Please feel free to contact us. 【Features】 ■ Capable of load measurement and feeling measurement ■ Data can be displayed as waveform graphs and saved ■ Customizable for production *For more details, please refer to the catalog or feel free to contact us.

• Other measurement and measuring equipment

There are various machines that people operate, such as airplanes, trains, cars, cameras, PC keyboards, mobile phones, and calculators. The sensation of pressing buttons and switches. The sensation of operating knobs and levers. The sensation felt when touching keyboards and similar devices. By quantifying and graphing these subtle operational sensations using feeling measurement devices, it becomes possible to improve usability and maintain consistent product quality.

• Testing Equipment and Devices
• Other inspection equipment and devices
• Analytical Equipment and Devices

This device is a 2-station open cassette compatible wafer sorter (transfer machine). It supports wafer sizes of 200mm (8 inches) or smaller. Throughput: 350 wph OCR / 850 wph transfer.

• Other clean room equipment and facilities
• Other semiconductor manufacturing equipment

This device is a 2-station FOUP/FOSB compatible wafer sorter (transfer machine). It supports wafer sizes of 200/300mm (8/12 inches). Throughput: 350 wph OCR / 850 wph transfer.

• Other clean room equipment and facilities
• Other semiconductor manufacturing equipment

This device is a multipurpose single-sheet plasma unit that is effective for etching polyimide-based resins, nitride films, ashing (ash removal) of photoresists, and surface modification, using parallel plate high-frequency plasma. It supports wafer sizes from 50 to 200 mm (2 to 8 inches) and is compatible with BGA, CSP, and other formats. The plasma mode can be switched between DP mode and RIE mode via the operation panel. Additionally, it allows for the retrofitting of a transport unit, making it ideal for experimental and research facilities.

• Etching Equipment
• Ashing device
• Other processing machines

This device is a 2-station FOUP/FOSB compatible EFEM (Equipment Front End Module). It supports wafer sizes of 200/300mm (8/12 inches). Throughput: 150 wph OCR / 450 wph transfer (excluding processes).

• Other clean room equipment and facilities
• Other semiconductor manufacturing equipment

This device is a single-wafer plasma etching processing apparatus that performs treatments such as etching of polyimide-based resins and nitride films, as well as ashing (ash removal) of photoresists, using parallel plate high-frequency plasma. The operation panel allows switching between DP mode and RIE mode. It supports wafer sizes of 6 inches and 8 inches.

• Etching Equipment
• Ashing device
• Wafer processing/polishing equipment

This device is a SMIF-compatible 3-station wafer sorter (transfer machine). It supports wafer sizes of 200mm (8 inches) or smaller. Throughput: 300 wph OCR / 750 wph transfer.

• Other clean room equipment and facilities
• Other semiconductor manufacturing equipment

This device is a 4-station open cassette compatible wafer sorter (transfer machine). It supports wafer sizes of 200mm (8 inches) or smaller. Throughput: 350 wph OCR / 850 wph transfer.

• Other clean room equipment and facilities
• Other semiconductor manufacturing equipment

This device is a simple sheet-type plasma cleaner using parallel plate high-frequency plasma. It is a compact process device measuring 600mm (W) × 600mm (D) × 750mm (H) (excluding the pump).

• Etching Equipment
• Ashing device

This device is a batch-type plasma ashing system with a coaxial barrel structure in the chamber, capable of processing 50 wafers at once. It supports wafer sizes of 5 inches or smaller, as well as 6 inches and 8 inches. Additionally, it can optionally accommodate both 4-inch and 6-inch wafers, as well as 5-inch and 6-inch wafers. The high-frequency plasma excitation can be used for various process applications, such as low-damage ashing (ash removal) and surface modification, on photoresist thin films formed on silicon wafers.

• Etching Equipment
• Ashing device
• Circuit board processing machine

This device is a SMIF-compatible 2-station wafer sorter (transfer machine). It supports wafer sizes of 200mm (8 inches) or smaller. Throughput: 350 wph OCR / 850 wph transfer.

• Other clean room equipment and facilities
• Other semiconductor manufacturing equipment