Batch-type plasma ashing device for 50 wafers at once.
This device is a batch-type plasma ashing system with a coaxial barrel structure in the chamber, capable of processing 50 wafers at once. It supports wafer sizes of 5 inches or smaller, as well as 6 inches and 8 inches. Additionally, it can optionally accommodate both 4-inch and 6-inch wafers, as well as 5-inch and 6-inch wafers. The high-frequency plasma excitation can be used for various process applications, such as low-damage ashing (ash removal) and surface modification, on photoresist thin films formed on silicon wafers.
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basic information
This device is a batch-type plasma ashing system that accommodates 50 wafers at once and features a coaxial barrel structure in its chamber. It supports wafer sizes of 5 inches or smaller, as well as 6 inches and 8 inches. Additionally, it can be configured as an option to handle both 4-inch and 6-inch wafers, or 5-inch and 6-inch wafers interchangeably. The high-frequency plasma excitation can be used for various process applications, such as low-damage ashing (ash removal) and surface modification, on photoresist thin films formed on silicon wafers.
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Applications/Examples of results
Ashing (decomposition removal process) of photoresist films on silicon wafers, surface modification, and descum ashing treatment, etc.
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Company information
Our company primarily engages in: 1. Sales and services of new equipment (plasma treatment equipment, wafer transporters (sorters), inspection equipment, etc.) 2. Sales and services of used semiconductor manufacturing equipment 3. Development, manufacturing, and consulting of equipment based on customer needs. Additionally, leveraging our network with companies both domestically and internationally, we accept inquiries regarding our customers' diverse needs, not limited to the semiconductor industry.