アシストナビ List of Products and Services

We offer a standard evaluation "TEG Wafer" for PKG development, implementation method development, implementation & inspection equipment development, and material development. We also accept the production of TEG wafers (chips) tailored to your specific applications. Additionally, we have started providing substrates in size Φ300mm (12 inches). 【Standard TEG Wafer (TEG-A)】 ■Pad config: Area ■Base chip size: □10mm ■Al pad size: 100μm ■Pad geometry: round ■Passivation opening: 40μm *For more details, please refer to the PDF materials or feel free to contact us.

• Processing Contract
• Circuit Board Inspection Equipment

Our company specializes in non-thermal, fine processing of high hardness and high brittleness materials using short pulse lasers. The materials include examples of processing with our expertise in short pulse lasers. The processing features very little thermal impact on high hardness, high brittleness materials, and metals. Additionally, due to minimal deformation of the base material caused by thermal effects, high-density drilling is possible. *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

We offer Ni and quartz molds with ultra-fine patterns of hole patterns and line patterns below 50nm. Additionally, using semiconductor laser technology, we can create molds for sub-micron order line and pillar patterns. Please feel free to consult with us. 【Overview】 ■ Ni Molds - Fine molds made by Ni electroforming - Capable of providing fine molds with hole, pillar, and line patterns below 50nm ■ Quartz Molds - Quartz molds available for UV transfer *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

We offer UV transfer, thermal transfer, and molding contract services to meet our customers' needs. We perform transfer and molding using transfer materials (resins, resist, etc.) tailored to our customers' requests. Please consider our evaluation before introducing equipment for the feasibility of introducing nanoimprint technology, as well as for basic experiments and initial considerations regarding nanoimprint technology. *For more details, please refer to the PDF materials or feel free to contact us.

• Processing Contract

Our company offers contract processing services for stealth dicing. "Stealth laser dicing" is a technology that performs localized laser processing inside the material, allowing the substrate to be divided through expansion. Since it cuts only the interior without damaging the wafer surface, chipping on the back side of the chip is minimized. Additionally, as it is a completely dry process, it is suitable for devices that are sensitive to moisture and for contamination prevention. 【Features】 ■ Supported sizes: φ2 to φ8 inches ■ Capable of handling small quantities ■ Particularly effective for cutting thin silicon wafers ■ High-speed cutting is possible ■ Improved throughput and yield *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board processing machine
• Surface treatment contract service

"Mini-Lab" is a service jointly launched by our company and Lithotech Japan Co., Ltd., which has a proven track record in lithography research and development. We propose ultra-compact experimental equipment suitable for IC and MEMS experiments that can be operated immediately at a low cost. We handle small equipment for all processes. We offer compact and high-performance small devices with functionalities comparable to large experimental equipment, standing against the headwinds of research budget reductions with our motto of affordability, miniaturization, high performance, and short delivery times. [Features] - Provision of small equipment for all processes - A range of supply products - Mini cleanroom facilities available - A wide lineup of compact and high-performance small devices *For more details, please refer to the PDF materials or feel free to contact us.

• Coater
• Etching Equipment
• Circuit board processing machine

At Assist Navi, we offer "Wafer Level Various Plating Contract Processing Services." Please leave the processing of "Rewiring Formation and BUMP Processing," "TSV (through-silicon via) Processing," and "Electroless Plating (UBM Plating)" to us. 【Rewiring Formation and BUMP Processing】 <Main Processing Services> ■ Cu Plating Rewiring Processing (Line & Space 10μm/10μm) ■ BUMP Processing: Cu, Ni, Au, Solder (Sn-Ag, Sn-Ag-Cu) Low Melting Point Solder, etc. ■ N Electroforming *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

Our "PE-TEOS Film Thick Film Formation Service" can form films ranging from thin films to thick films over 20μm, and is capable of processing substrates with films, substrates in the middle of processing, compound semiconductor wafers, ceramic substrates, and more. Due to its parallel plate design, small pieces and chips can also be processed, with sizes up to 8 inches in diameter. We can accommodate small quantities as well. 【Features】 ■ Capable of processing substrates with films, compound semiconductor wafers, ceramic substrates, etc. ■ Can be used as a hard mask ■ The parallel plate design allows for the processing of small pieces, chips, and rectangular substrates ■ Can also be used as a protective film for MEMS structures ■ Small pieces, chips, and rectangular substrates can also be cut ■ Suitable for bonding and lamination applications *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

We provide high-quality silicon (Si) wafers for dummy, monitor, and solar applications under thorough quality control. We accommodate sizes from 2 inches to 12 inches in diameter, and special sizes are also available. We sell materials and processing at low prices and with short lead times. Additionally, we offer thermal oxidation film processing. Please inquire about wafers with various films (using PVD and CVD equipment). 【Features】 ■ Supports sizes from 2 inches to 12 inches in diameter ■ Can accommodate small quantities ■ Provides high-quality wafers under thorough quality control ■ Sells materials and processing at low prices and with short lead times ■ Thermal oxidation film processing is also available *For more details, please refer to the PDF document or feel free to contact us.

• Other metal materials

The "Sputtering Coating (Film Formation) Service" is an assist service utilizing low-temperature high-speed magnetron sputtering. We assist with research and development, prototyping, and mass production using prototype and large-scale equipment. We also accept various CVD, EB evaporation, and ion plating requests. Please consult us separately for on-site work. 【Features】 ■ Utilization of low-temperature high-speed magnetron sputtering is possible ■ Three-cathode system allows for stacking up to three layers in the same vacuum ■ Substrate heating up to 300 degrees is possible ■ Can accommodate substrates regardless of material or shape ■ Processed substrates with films or patterns can also be input *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

Our company is capable of polishing from mechanical grinding/polishing/back grinding (BG) to final flattening CMP. Please utilize our services when you are unable to achieve satisfactory polishing speeds, have many scratches, have narrow process margins, or need a selection ratio. Electropolishing of stainless steel and steel plates is also possible. Feel free to consult us about reducing outer dimensions or bevelling. We also accept back grinding (BG) processing and back lap processing. 【Features】 ■ Supported sizes: 2 inches φ to 12 inches φ ■ Product development tailored to your requests, applications, and processing conditions ■ A rich lineup providing slurries that match the polishing objects and processing processes ■ CMP slurries are improved or designed for each user, providing processing services *For more details, please refer to the PDF materials or feel free to contact us.

• Processing Contract

Our "Patterning Processing" offers contract foundry services that assist in processing various processes on 8 and 12-inch device lines, MEMS device lines, and prototype lines for devices under 6 inches. For semiconductor elements, MEMS structures, plating, and etching (Deep-RIE, Dry & Wet), we can perform exposure and development using aligners, steppers, and electron beam lithography as methods for resist patterning. Additionally, we possess various types of resists for positive, negative, dry film, thin film, and thick film, and we are also capable of patterning polyimide. [Typical Processing Processes] ■ Sputtering ■ Evaporation ■ CVD ■ CMP Polishing ■ Deep-RIE & ICP, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

This is an introduction to Assist Navi's "Patterning Processing" services, a specialized company for research and development, prototyping, experimentation, and outsourced mass production. 【Features】 ■ Large-wafer Foundry We assist in processing for each process on 8 and 12-inch device lines. <Representative processing equipment> - Sputtering, CVD - KrF/ArF lithography, ion implantation, CMP, etc. ■ MEMS-wafer Foundry We assist in processing for each process on MEMS device lines. <Representative processing equipment> - Sputtering, CVD - KrF/ArF lithography, ion implantation, CMP, etc. ■ Small-wafer Foundry We assist in processing for each process on device prototyping lines of 6 inches or smaller. <Representative processing equipment> - Sputtering, CVD - KrF/ArF lithography, ion implantation, CMP, etc. *For other functions and details, please download the catalog or contact us.

• lathe