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The weekly timer-equipped heater controller is a device that can start (or stop) heater control at a set time. It is desirable for process materials and work to be at the appropriate temperature when work begins. In such cases, consider the heater controller from Maple Co., Ltd., which starts heating like an alarm clock. You can set start and stop times for each day of the week, allowing for flexible operational planning. It also features a manual operation switch, enabling timely operation independent of the timer. Safety circuits for overheating and overcurrent are, of course, implemented. You can use it with peace of mind even during unmanned operation. We hope it helps you make effective use of time and energy. 【Features】 ○ Starts heating like an alarm clock ○ Can schedule start and stop times over a week ○ Capable of accommodating different times for each day of the week ○ Safety circuits for overheating and overcurrent are also implemented ● For more details, please contact us or download the catalog.

• controller

Maple Corporation's heater controller, based on our experience in vacuum chamber manufacturing and film deposition equipment production, is designed with a focus on workability and usability in the field, making it the "Heater Controller for Vacuum Professionals." It provides convenience not only for the essential outgassing process required for vacuum chambers but also in any situation that requires temperature management. 【Features】 ○ Easy-to-read temperature display ○ Safe with heating monitoring ○ Simultaneous activation of heaters ○ Easy connection with connector type ○ Timer function for heater shutdown ● For more details, please contact us or download the catalog.

• controller

The "MDC8540L" is the flagship model of the MDC series, designed for cleaning fixtures used in the manufacturing of compound semiconductors such as power devices, blue laser diodes, and blue LEDs, employing a dry etching method to clean GaN, AlN, and other materials that accumulate during film deposition. It is ideal for improving product yield during mass production and reducing running costs. 【Features】 - Optimal for dry cleaning various fixtures used in GaN and AlN deposition equipment - Cleanable fixtures include SiC-coated carbon susceptors, quartz fixtures, etc. - Sapphire substrates of dummy wafers can also be cleaned - No need for wet cleaning or a large number of spare parts - Reduction in maintenance costs due to the introduction of this equipment - Safe design that does not burden operators ● For more details, please download the catalog or contact us.

• Other cleaning machines

The "MDP2015" is a device that forms a metal film, such as aluminum, on a resin substrate using a resistance heating vapor deposition method, and then applies a polymer protective film through plasma polymerization to prevent corrosion. By providing two doors that open to the left and right, it allows for efficient exchange of workpieces and attachment of evaporated materials during the process. Optimization of the device configuration achieves high productivity and low running costs. 【Process Overview】 ■ Attach the workpiece, close the door, and evacuate. ■ Pre-treat the substrate surface using plasma discharge. ■ Deposit aluminum on the substrate surface using the resistance heating vapor deposition method. ■ Protect the aluminum film with a film formed by plasma polymerization of HMDSO. ■ Utilize the film formation time to exchange the workpiece on the waiting door. ■ After atmospheric release, open the door and close the waiting door to start processing. ● For more details, please download the catalog or contact us.

• others

It is possible to use a wide range of applications, including precision parts, optical glass components, electronic parts, automotive-related parts, and sanitary-related components. This is a steam cleaning machine that can significantly reduce "outgassing," which is a problem in vacuum equipment.

• Other cleaning machines

The dry cleaning device for GaN film deposition equipment is a system that cleans GaN and AlN deposited during the film formation process, such as on fixtures of MO-CVD equipment, using a dry etching method. It is ideal for the production of compound semiconductors like power devices and laser diodes, as well as blue LEDs. It effectively improves product yield during manufacturing and reduces running costs. 　　　★☆★【Free Demo】Now Available!!★☆★ 【Features】 ● Optimal for dry cleaning of various fixtures used in GaN film deposition equipment ● Cleanable fixtures include SiC coated carbon, quartz, etc. ● Dummy wafers with sapphire substrates can also be cleaned. ● No need for expensive large quantities of spare parts required for wet cleaning ● The introduction of this device can contribute to reducing maintenance costs! ● Safety design that does not burden the operator. ★If you would like a 【Free Demo】, please contact us through the ≪Inquiry≫ form★

• Other cleaning machines
• High pressure cleaner
• Ultrasonic Cleaner

Rapid heating and high-precision temperature distribution achieved with the lamp R unit. 【Features】 ○ Utilizes high-output infrared lamp heaters in a circular shape to heat the substrate from both above and below, achieving rapid heating and high-precision temperature distribution. ○ Employs a cooling reflective plate with a special surface treatment on the inner surface of the chamber, enabling excellent process reproducibility and rapid cooling. ○ Processing substrate: φ300mm ○ Maximum operating temperature: 1000±10℃ ● For other functions and details, please download the catalog.

• Hydraulic Equipment

Cluster-type composite process equipment capable of accommodating a total of six chambers, including a load lock chamber, around the center chamber. 【Features】 - Gate valves are placed between the center chamber and each chamber to prevent contamination. - Gate valves are integrated within the center chamber to save space. - The main pump is installed at the top of the chamber for high maintenance accessibility. - Equipped with a uniquely developed vacuum transport robot. - Each chamber is equipped with an independent vacuum exhaust system. - Features a sputtering film deposition unit with a film thickness distribution of ±3%. - Includes a lamp annealing unit capable of heating up to 1000°C. - Equipped with a cassette load lock chamber that can accommodate 13 φ300mm silicon wafers. For more functions and details, please download the catalog.

• Hydraulic Equipment

Supports the processing of large substrates. A tabletop UV irradiation device that enables advanced cleaning without damaging the samples. 【Features】 ○ UV irradiation can be performed on substrates (samples) such as silicon wafers and glass with a maximum diameter of 300mm, removing organic substances from the surface and improving wettability. ○ The holder for the substrates (samples) can be easily adjusted or replaced, allowing for the processing of thicker substrates (samples). ○ The ozone-generating device can achieve high cleaning effects by combining treatment with ozone. ○ Automatic operation is possible after setting the substrates (samples). ○ Despite being a tabletop model, it can process large substrates, making it ideal for the development of treatment processes such as surface modification and wafer cleaning. ○ Unlike wet cleaning, it does not produce waste liquid and achieves advanced cleaning effects without causing physical damage to the samples. ○ Organic contaminants are gasified and expelled, preventing re-adhesion of organic contaminants. ● For other functions and details, please download the catalog.

• Wafer processing/polishing equipment
• Other semiconductor manufacturing equipment

Sputtering film deposition unit equipped with a magnetron sputtering source and substrate rotation mechanism 【Features】 ○ Achieves excellent film thickness distribution ○ Capable of switching between DC sputtering and RF sputtering ○ Allows deposition of different types of films by incorporating two types of sputtering sources ○ Equipped with reverse sputtering function for substrate cleaning and etching ○ Prevents contamination and dust generation by adopting a two-motion shutter ● For other functions and details, please download the catalog.

• Vacuum forming machine
• Hydraulic Equipment
• Other semiconductor manufacturing equipment

Adoption of a hexagonal center chamber Vacuum transport unit for multi-vacuum processes 【Features】 ○ Incorporates a gate valve within the center chamber, achieving space-saving design ○ Main pump (turbo molecular pump) of the center chamber is mounted on the upper lid, ensuring high maintainability ○ Equipped with a uniquely developed vacuum transport robot ○ Each chamber is equipped with an independent vacuum exhaust system (However, the center chamber and the load lock chamber share a system) ○ Equipped with a set load lock chamber capable of accommodating 13 φ300 Si wafers ● For other functions and details, please download the catalog.

• Hydraulic Equipment

【Features】 ● Uses Abzol (ABZOLTMJG), which has cleaning performance comparable to chlorine-based solvents (such as TCE) ● Adopts a steam cleaning method utilizing Abzol vapor ● Capable of cleaning parts up to a maximum size of 700*700*500 ● Work is performed by suspending from a crane (separate) from the top of the cleaning machine *For details, please contact us for more information.

• Other cleaning machines

【Features】 ● Combination of a highly versatile cleaning tank + rinsing tank (two tanks) ● Ultrasonic generator equipped in the cleaning tank and rinsing tank (one tank) (38 kHz/600 W) ● The cleaning tank adopts a filter circulation system ● The rinsing tank features a two-tank flow system with a heater (MAX 50℃) *For details, please request materials.

• Other cleaning machines
• Ultrasonic Cleaner

The process from developing the resist film applied on the glass substrate while rotating it to rinsing with pure water is performed automatically. 【Features】 ● A developing solution purge mechanism is provided, making it easy to change the type of developing solution. ● A robot is used for the left-right movement of the nozzle. The nozzle movement can be set arbitrarily over a wide range of 0 to 400 mm. ● The vertical position of the nozzle can be set arbitrarily over a wide range of 0 to 500 mm. *For details, please request the materials.

• Analytical Equipment and Devices

Ideal for dry cleaning various jigs used in GaN film deposition equipment.

• Other cleaning machines