IAM Electronics Co., Ltd. Product Lineup

The "Alumina Thick Film Circuit Board" is a high-reliability electronic material substrate that has excellent heat dissipation and heat resistance, with electrode materials and resistive materials baked onto an alumina substrate. Our company produces and sinters alumina substrates at our affiliated company, "Ina Ceramic Co., Ltd.," and has established a consistent high-quality line that includes circuit printing, sintering, resistance value adjustment, component mounting, molding, and electrical testing. It can be utilized in main applications such as automotive electronic components, communication industrial equipment, power supplies, and safety devices. 【Features of Alumina Substrate】 ■ Material: 96% Alumina ■ Color: White ■ Specific Gravity: 3.8±0.1 ■ Water Absorption (%): ≧0.1 ■ Flexural Strength (MPa): 215≦ ■ Hardness (GPa): 13.7±2.4 ■ Insulation Breakdown Voltage (V/mm): 1×10^7≦ *For more details, please refer to the PDF document or feel free to contact us.

This is an announcement from AIEIM Electronics regarding "Hybrid ICs and Thick Film Printed Circuit Boards."

Our company manufactures "Hybrid ICs" that integrate circuit design technology, assembly technology, and measurement technology based on years of experience in thick film manufacturing. This allows for simplification and miniaturization of circuit boards without the hassle of component procurement or equipment. It also contributes to reduced development time and lower management costs. We also support production using alumina ceramic substrates, which excel in heat dissipation and heat resistance. We welcome inquiries regarding integration density, usage conditions, pricing, and delivery times. 【Features】 ■ Simplification and miniaturization of circuit boards through modularization ■ High reliability due to low thermal expansion and high thermal conductivity of alumina substrates ■ Reduction of management costs through simplified component management ■ Adjustments through operational trimming ■ Custom design enabling flexible circuit design *For more details, please refer to the materials. Feel free to contact us with any inquiries.

Our company manufactures "Hybrid ICs" that integrate circuit design technology, assembly technology, and measurement technology based on many years of thick film manufacturing expertise. This allows for simplification and miniaturization of circuit boards without the hassle of component procurement or equipment. It also contributes to shortening development time and reducing management costs. We also accommodate production using alumina ceramic substrates, which excel in heat dissipation and heat resistance. We welcome inquiries regarding integration density, usage conditions, pricing, and delivery times. 【Features】 ■ Simplification and miniaturization of circuit boards through modularization ■ High reliability due to low thermal expansion and high thermal conductivity of alumina substrates ■ Reduction of management costs through simplified component management ■ Adjustments through operational trimming ■ Custom design enabling flexible circuit design *For more details, please refer to the materials. Feel free to contact us with any inquiries.

The "Alumina Thick Film Circuit Board" is an electronic material substrate with high reliability, where electrode materials and resistive materials are baked onto an alumina substrate that excels in heat dissipation and heat resistance. It is suitable for applications such as automotive electronic components, communication industrial equipment, power supplies, and safety devices. Our company, in collaboration with our affiliated company "Ina Ceramic Co., Ltd.," produces and sinters alumina substrates, establishing a consistent high-quality line from circuit printing, firing, resistance value adjustment, component mounting, molding, to electrical testing. 【Features】 ■ Electrode materials and resistive materials are baked onto an alumina substrate with excellent heat dissipation and heat resistance ■ High reliability ■ A consistent high-quality line is established from circuit printing to electrical testing *For more details, please refer to the PDF document or feel free to contact us.

"Alumina ceramic substrates" are products that can create electronic circuit boards using thick film printing technology. They are suitable for heat dissipation and high-reliability substrates. Circuits are formed on this product using thick film printing technology with silver-palladium, silver-platinum, gold, and other materials. They can suppress the temperature rise of electronic components and can be utilized for LED lighting and automotive electronic substrates. 【Features】 ■ Excellent heat resistance: Sintered at approximately 1500°C ■ Excellent heat dissipation: Thermal conductivity about 50 times that of PWB ■ Excellent insulation and corrosion resistance ■ Capable of creating electronic circuit boards using thick film printing technology ■ Suitable for heat dissipation and high-reliability substrates *For more details, please refer to the PDF materials or feel free to contact us.

The "thick-film hybrid IC" uses a ceramic substrate, which can suppress the temperature rise of electronic components. The pattern is fired onto the ceramic substrate at approximately 800°C. The heat resistance of the ceramic substrate is higher than that of PWB due to high-temperature processing, ensuring reliability. In addition, we also handle "hybrid ICs" that can reduce total manufacturing costs through modularization. 【Features】 ■ Excellent heat dissipation ■ Miniaturization through printed resistance ■ Function trimming ■ High reliability ■ Available in SIP type and DIP type *For more details, please refer to the PDF materials or feel free to contact us.