丸三電機 Product Lineup

Introducing heat sinks that contribute to the compactness of units and exhibit excellent characteristics in high-density electronic devices, including large semiconductor heat sinks for forced air cooling and water cooling. ■□■Features■□■ ■ By adopting a mechanical crimping method, the fin thickness has been reduced and a narrow pitch has been achieved, resulting in an increased surface area and excellent thermal resistance even at the same dimensions. ■ The mechanical crimping process has been simplified, achieving high performance while maintaining low costs. ■ The fin height can be freely set. For other functions and details, please contact us.

• Other electronic parts

The LEX medium-sized heat sink series, designed for cooling in high-density electronic devices that are becoming more powerful due to advancements in semiconductor technology, offers a total of 276 models that are the most rational and cater to all users. 【Features】 ○ Medium-sized products can be complexly processed using large machining centers. ○ A wide variety of extruded materials are available, allowing for selection of materials that meet customer needs. A versatile heat sink made from flat extruded materials. It is suitable for both natural cooling and forced air cooling applications. (Refer to the graphs in the catalog for performance data during natural and forced cooling.) If heat dissipation and thermal transport using metal alone are insufficient for heat dissipation measures, it is possible to enhance heat dissipation by installing heat pipes. - For more details, please contact us or download the catalog.

• Other electronic parts

We have added models recommended by Marusan Electric as standard products to our lineup. Standard products can be offered at a low price as they do not require molds. We are introducing the Intel CPU-specific types "104DHP91-91" and "104DHP90-90," as well as the 1U server types "26DHP83-106.5" and "24.5DHP90.3-90.3." For more details, please contact us or refer to the catalog.

• Cooling system

Introducing a heat sink developed to dissipate heat generated by the acceleration of CPUs in a more compact space, specifically for LSI applications. ■□■ Features ■□■ ■ A compact design that increases surface area by machining slits into a small heat sink or block to create fin structures with corner pins, resulting in excellent thermal resistance. ■ A heat sink that allows for the free setting of dimensions for height, width, and length, as well as corner pin dimensions, to solve various issues related to space during design. For other functions and details, please contact us.

• Other electronic parts

This is an introduction to a series of medium-sized heat sinks, with a total of 276 types available, designed for cooling electronic devices that are becoming more densely packed due to the power enhancement of semiconductor devices, aimed at providing the most rational solutions for all users. ■□■Features■□■ ■Medium-sized products can be complexly processed using large machining centers. ■A wide variety of extruded materials are available, allowing customers to choose materials that meet their needs. For other functions and details, please contact us.

• Other electronic parts