富山技販 List of Products and Services

The IH soldering device "S-WAVE" has a magnetic concentration head tip that remains below 100°C, while only the terminals can rise to 250°C, allowing for soldering without issues even when resin is nearby. Thanks to EV adoption, even large heat capacity substrates that have increased in automotive components can be effectively soldered with S-WAVE, as it heats not only the terminals but also the flat patterns and solder, significantly improving solder joint quality. The "Introduction of Wall-Mounted Terminal Cases" section features common examples of automotive substrates and heating conditions. The "Introduction of Large Heat Capacity Substrate Cases" section includes examples of large heat capacity substrates and thermographic results. Additionally, we explain the advantages of the WAVE series IH soldering, making it easy to reference when considering implementation. **Advantages of IH Soldering in the S-WAVE Series** - In addition to terminals, pads and solder also generate heat, which shortens the cycle time for soldering medium to large heat capacity terminals. - Non-contact operation means there are no replacement parts. - Non-contact operation ensures stable quality. - This method minimizes the occurrence of solder balls. *For more details, please refer to the PDF materials or feel free to contact us.*

We would like to introduce a case of IH soldering on a large heat capacity substrate for automotive products. With the rise of electric vehicles (EVs), the use of large heat capacity substrates in automotive components has increased. The IH method not only heats the terminals but also the large patterns and solder, significantly improving soldering quality. IH soldering is a specialty in the field of large heat capacity substrates. 【Case Overview】 ■ Heating Target ・ 6-layer thick copper substrate ・ □0.64 *For more details, please refer to the PDF document or feel free to contact us.

This is an example of soldering with IH (induction heating) on the edge terminal of an automotive product. When the resin part is close to the terminal, issues often arise with the soldering iron method due to radiant heat, and with the laser method due to reflected light, which can melt the resin part. In the case of the IH method, the tip of the magnetic concentration head remains below 100°C while the terminal itself rises to 250°C. This characteristic allows for soldering without issues even when resin is nearby. [Case Summary] ■ Issues - With the soldering iron method, radiant heat is a problem, and with the laser method, reflected light can often melt the resin part. ■ Results - In the case of the IH method, soldering can be performed without issues even when resin is nearby. *For more details, please refer to the PDF document or feel free to contact us.

The "S-WAVE301H" is a product designed for spot heating printed circuit boards that require a large amount of heat. It can accommodate characteristic substrates such as busbars, power semiconductors, four-layer boards, high multilayer boards, thick copper boards, ceramic substrates, and metal base substrates. It retains features such as low power consumption and high heating efficiency. Please feel free to contact us when you need assistance. 【Features】 ■ Low power consumption, high heating efficiency ■ Spot heating for printed circuit boards that require a large amount of heat ■ Improvement of solder joint quality for power semiconductors ■ Improvement of solder joint quality for busbars ■ Compliance with various regulations such as ICNIRP and the Radio Law ■ Capability to accommodate characteristic substrates such as busbars and metal base substrates *For more details, please feel free to contact us.

The "S-WAVE" is a 3D localized heating device that accommodates a range of materials from metal-based substrates to ceramic substrates and low-heat-resistant components. The "S-WAVE301A" rapidly heats narrow spots to 300°C, the "S-WAVE301" achieves high continuous operation performance, and the "S-WAVE301H" realizes double the heating power compared to conventional models. We offer three evolving lineups that respond to the needs of the times. 【Features】 <S-WAVE301A> ■ Achieves high heating efficiency with low power consumption ■ Suitable for soldering through-hole terminals ■ Preheats pad surfaces of printed circuit boards, etc. ■ Reduces radiant heat and minimizes impact on surrounding components ■ Complies with various regulations such as ICNIRP and the Radio Law *For more details, please refer to the PDF document or feel free to contact us.

The "S-WAVE FBA Series" is a product designed to suppress solder balls during low-temperature soldering at 250°C. It allows for non-contact tool changes that are unnecessary for an extended period. It is applicable to general through-hole mounting of electronic components, terminals with insufficient solder, and areas with heat-sensitive components or surrounding parts. Additionally, the use of solder wire supply reduces solder material consumption, and the power consumption during soldering is less than 300W. 【Features】 ■ Suppresses solder balls during low-temperature soldering at 250°C ■ Non-contact tool changes are unnecessary for an extended period ■ Daily maintenance is automated with a temperature checker/cleaning device (optional) ■ Reduces solder material consumption through solder wire supply ■ Power consumption is less than 300W (during soldering) *For more details, please refer to the PDF document or feel free to contact us.

The "S-WAVE301A" is a 3D localized heating device that achieves high heating efficiency with low power consumption. It is suitable for soldering snow hole terminals. It supports double-sided boards, as well as single-sided boards, flexible boards, and low heat-resistant components. Additionally, it suppresses radiant heat, minimizing its impact on surrounding components. Please feel free to contact us when you need assistance. 【Features】 ■ Achieves high heating efficiency with low power consumption ■ Suitable for soldering snow hole terminals ■ Preheats pad surfaces of printed circuit boards, etc. ■ Utilized for spot heating of low heat-resistant components ■ Suppresses radiant heat to minimize impact on surrounding components ■ Complies with various regulations such as ICNRP and the Radio Law *For more details, please refer to the PDF document or feel free to contact us.

The "S-WAVE301" is a 3D local heating device that complies with various regulations such as ICNRP and the Radio Law. Maintaining features such as low power consumption and high heating efficiency, it achieves high continuous operation performance. It can shorten heating intervals and reduce cycle times. Additionally, it realizes a compact head unit, which is effective for improving solder joint quality and addressing red-eye issues. 【Features】 ■ Maintains characteristics such as low power consumption and high heating efficiency ■ Increased cooling capacity extends heating time at high output ■ Shortens heating intervals and reduces cycle times ■ Achieves a compact head unit ■ Effective for improving solder joint quality and addressing red-eye issues ■ Complies with various regulations such as ICNRP and the Radio Law *For more details, please refer to the PDF materials or feel free to contact us.

In the automotive industry, the quality of electronic component implementation is crucial for improving product reliability. In particular, failures due to soldering defects in automotive parts used in harsh environments can lead to significant issues. The S-WAVE FBA series achieves high-quality soldering by suppressing solder balls through low-temperature soldering at 250°C. 【Usage Scenarios】 - In-vehicle ECUs - Meter panels - Various sensors - Connector connections 【Benefits of Implementation】 - Mitigation of product reliability decline due to solder defects - Contribution to long-term stable supply of products - Reduction of maintenance labor hours

The IH soldering device "S-WAVE" was born as a device that allows for soldering without the need for tool changes, enabling quick and beautiful soldering with high thermal capacity. This document introduces the improvement in production capacity arising from the above two features. It provides detailed explanations on topics such as "Changes in the soldering process flow with S-WAVE" and "Improvement in production capacity with S-WAVE = Improvement in OEE and reduction in CT." *We have summarized technical information and case studies in an easy-to-understand manner, so please take a moment to read through it! [Contents] ■ Changes in the soldering process flow with S-WAVE ■ Improvement in production capacity with S-WAVE = Improvement in OEE and reduction in CT ■ Preliminary examination of the introduction effects of S-WAVE ■ Competitiveness we aim for with our customers *For more details, please refer to the PDF document or feel free to contact us.