A 3D local heating IH soldering device that can also accommodate characteristic substrates!

Capable of outputting a large amount of heat, it can handle a wide range of substrates with just "one unit"! Compliant with various regulations such as ICNIRP and the Radio Law, 'S-WAVE301H'.

The "S-WAVE301H" is a product designed for spot heating printed circuit boards that require a large amount of heat. It can accommodate characteristic substrates such as busbars, power semiconductors, four-layer boards, high multilayer boards, thick copper boards, ceramic substrates, and metal base substrates. It retains features such as low power consumption and high heating efficiency. Please feel free to contact us when you need assistance. 【Features】 ■ Low power consumption, high heating efficiency ■ Spot heating for printed circuit boards that require a large amount of heat ■ Improvement of solder joint quality for power semiconductors ■ Improvement of solder joint quality for busbars ■ Compliance with various regulations such as ICNIRP and the Radio Law ■ Capability to accommodate characteristic substrates such as busbars and metal base substrates *For more details, please feel free to contact us.

Heating device